Patent classifications
B22F2301/30
METHOD OF PRODUCING PLATED POWDER-CORE PROJECTILE
A method of forming a projectile for use in a firearm ammunition cartridge, the method including mixing a first material and a second material having different densities to produce a core mixture, disposing the core mixture in a die, heating the core mixture to the melting point, removing the core mixture from the die, quenching the core mixture, and plating the core mixture with a jacket material.
Thermoelectric material, thermoelectric device, powder for thermoelectric material, and method for producing thermoelectric material
A thermoelectric material of the present invention includes copper, tin, and sulfur, wherein a ratio A/B of the number A of copper atoms to the number B of tin atoms is 0.5 to 2.5 and a content of a metal element other than copper and tin is 5 mol % or less with respect to total metal elements. Additionally, the thermoelectric material of the present invention has a thermal conductivity less than 1.0 W/(m.Math.K) at 200 to 400° C.
RARE EARTH MAGNET AND PRODUCTION METHOD THEREOF
A Sm—Fe—N-based rare earth magnet more resistant to demagnetization than ever before in an environment where an external magnetic field is applied, particularly at high temperatures, and a production method thereof are provided.
The present disclosure presents a production method of a rare earth magnet, including preparing a coated magnetic powder, compression-molding the coated magnetic powder in a magnetic field to obtain a magnetic-field molded body, pressure-sintering the magnetic-field molded body to obtain a sintered body, and heat-treating the sintered body, and a rare earth magnet obtained by the method. D.sub.50 of the magnetic powder in the coated magnetic powder is 1.50 μm or more and 3.00 μm or less, the content ratio of the zinc component in the coated magnetic powder is 3 mass % or more and 15 mass % or less, and the heat treatment temperature is 350° C. or more and 410° C. or less.
LEAD-BASED ALLOY AND RELATED PROCESSES AND PRODUCTS
A lead-based alloy containing alloying additions of bismuth, antimony, arsenic, and tin is used for the production of doped leady oxides, lead-acid battery active materials, lead-acid battery electrodes, and lead-acid batteries.
HEAT SINK AND METHOD OF MANUFACTURING SAME, HEAT EXCHANGER, AND GYROID STRUCTURE COMPONENT AND METHOD OF MANUFACTURING SAME
A heat sink includes a channel including a gyroid structure portion having a non-uniform thickness.
SINTERED FRICTION MATERIAL FOR A FRICTION LINING
A sintered friction material comprises a metallic matrix and granular constituents embedded in the matrix. The metallic matrix comprises a copper base alloy. The friction material is characterized in that the granular constituents comprise at least one sintered cemented carbide in a proportion of up to 9 weight percent, based on the total weight of the friction material. Furthermore, a friction body, in particular for clutches and brakes, that comprises a friction lining with at least one layer made of the sintered friction material, and a method for the production of a friction lining with the sintered friction material are described.
Solder Materials Including Supercooled Micro-Capsules And Alloyed Particles
A material includes a plurality of supercooled micro-capsules each including a metallic core in a liquid state at a temperature below a solidification temperature of the metallic core and further includes a metallic shell surrounding each respective metallic core. A plurality of alloyed metallic particles and flux are mixed with the plurality of supercooled micro-capsules to form a solder paste. Upon heating the solder paste, the plurality of alloyed particles melt. As the metallic shells destabilize, the liquid metallic cores interdiffuse with the melted alloyed particles forming a new alloy that has a higher melting temperature than the melting temperature of the alloyed metallic particles.
Solder Material, Solder Paste, Solder Preform, Solder Joint and Method of Managing the Solder Material
Provided is a solder material having oxidation resistance at the time of melting solder or after melting it, as well as managing a thickness of oxide film at a fixed value or less before melting the solder. A Cu core ball 1A is provided with a Cu ball 2A for keeping a space between a semiconductor package and a printed circuit board and a solder layer 3A that covers the Cu ball 2A. The solder layer 3A is composed of Sn or a solder alloy whose main component is Sn. For the Cu core ball 1A, lightness is equal to or more than 65 in the L*a*b* color space and yellowness is equal to or less than 7.0 in the L*a*b* color space, and more preferably, the lightness is equal to or more than 70 and the yellowness thereof is equal to or less than 5.1.
LEAD-BASED ALLOY AND RELATED PROCESSES AND PRODUCTS
A lead-based alloy containing alloying additions of bismuth, antimony, arsenic, and tin is used for the production of doped leady oxides, lead-acid battery active materials, lead-acid battery electrodes, and lead-acid batteries.
MULTIPLE PORTION GRIP
A component can include a degradable portion that is degradable in an aqueous environment; and a non-degradable portion that is not degradable in the aqueous environment where the non-degradable portion can include polycrystalline diamond.