A method for producing a TiAl-based intermetallic sintered compact includes sintering TiAl-based powder to produce a TiAl-based intermetallic sintered compact. The TiAl-based powder contains a TiAl-based intermetallic compound in which Ti and Al are bonded and an additional metal. The additional metal is Ni, or Ni and Fe.

An object of the invention is to provide: an alloy article that has excellent homogeneity in the alloy composition and microstructure as well as significant shape controllability, using an HEA with significant mechanical strength and high corrosion resistance; a method for manufacturing the alloy article; and a product using the alloy article. There is provided an alloy article comprising: Co, Cr, Fe, Ni, and Ti elements, each element in content of 5 to 35 atomic %; more than 0 atomic % to 8 atomic % of Mo %; and remainder substances of unavoidable impurities. And, ultrafine particles with an average diameter of 40 nm or less are dispersedly precipitated in matrix phase crystals of the alloy article.

A micro-nano composite powder dedicated for laser repair of tiny crack in stainless steel surface, which belongs to the technical field of laser repair and comprises 3 wt %-7 wt % of nano-WC, 0.5 wt %-2 wt % of nano-Al.sub.2O.sub.3, 0.2 wt %-0.8 wt % of micro-V powder and the balance of micro stainless steel powder, wherein the stainless steel powder comprises 0.08 wt % of C, 0.5 wt % of Si, 1.46 wt % of Mn, 0.03 wt % of P, 0.005 wt % of S, 19 wt % of Cr, 9.5 wt % of Ni, 0.5 wt % of Mo and the balance of Fe. The micro and nano powders are fully mixed through ball milling and further uniformly mixed after being blended with anhydrous ethanol. The composite powder provided by the present invention is particularly suitable for laser repair of tiny crack in the surface of stainless steel part with high toughness requirement. After laser repair, the composite powder can be fully fused with the substrate, the repaired layer and the substrate are metallurgically bonded at the interface with no crack or impurity, the repaired layer contains fine grains, and therefore the compactibility and fracture property of the repaired layer are improved.

While a molten metal obtained by melting silver and a metal, which is selected from the group consisting of tin, zinc, lead and indium, in an atmosphere of nitrogen is allowed to drop, a high-pressure water (preferably pure water or alkaline water) is sprayed onto the molten metal in the atmosphere or an atmosphere of nitrogen to rapidly cool and solidify the molten metal to produce a silver alloy powder which comprises silver and the metal which is selected from the group consisting of tin, zinc, lead and indium and which has an average particle diameter of 0.5 to 20 m, the silver alloy powder having a temperature of not higher than 300 C. at a shrinking percentage of 0.5%, a temperature of not higher than 400 C. at a shrinking percentage of 1.0% and a temperature of not higher than 450 C. at a shrinking percentage of 1.5% in a thermomechanical analysis.

The joining material of the present invention is a joining material which contains a first metal powder and a second metal powder having a higher melting point than the first metal powder, in which the first metal powder is formed of Sn or an alloy containing Sn, the second metal powder is formed of a CuNi alloy in which a proportion of Ni is 5 wt % or more and 30 wt % or less, a CuNiCo alloy in which a total of a proportion of Ni and a proportion of Co is 5 wt % or more and 30 wt % or less, or a CuNiFe alloy in which a total of a proportion of Ni and a proportion of Fe is 5 wt % or more and 30 wt % or less, and a 90% volume grain size D90 of the second metal powder is 0.1 m or more.

A novel silver-coated copper powder, particularly a silver-coated copper powder particle having a dendritic shape, having increased electrical conductivity with no need to increase the silver content is provided. The silver-coated copper powder is composed of a silver-coated copper particle coated with a silver layer containing silver or a silver alloy, including a silver-coated copper particle having a dendritic shape, containing nitrogen (N) in the silver layer, and having a nitrogen (N) content of 0.2 to 10.0 parts by mass with respect to 100 parts by mass of the silver content.

A process for producing a coating source for physical vapour deposition provides the coating source with a target layer formed of an at least two-phase composite which contains a metallic phase and at least one further phase and a mechanical stabilizing layer which is joined to the target layer on one side of the target layer. A first powder mixture which corresponds in terms of its composition to the at least two-phase composite and a second powder mixture which corresponds in terms of its composition to the mechanical stabilizing layer are densified hot in superposed layers. A coating source for physical vapour deposition is also provided.

Ti-based metal matrix composites, methods of their additive manufacture, and parts manufactured therefrom and thereby are provided. Method include layer-by-layer additive manufacturing for fabricating Ti-based metal matrix composite parts thicker than 0.5 mm, in layers with thickness between 10-1000 micrometers. The parts formed may have one or more of the following properties: a tensile strength greater than 1 GPa, a fracture toughness greater than 40 MPa m.sup.1/2, a yield strength divided by the density greater than 200 MPa cm.sup.3/g, and a total strain to failure in a tension test greater than 5%.

An electro-conductive paste includes a metal particle and a vehicle in which the metal particle is dispersed. The metal particle has a particle size in a range from 1 m to 20 m and consists of an outer shell and a core part. The core part contains Sn or a Sn alloy. The outer shell contains an intermetallic compound of Sn and Cu and covers 50% or more of a total surface area of the core part.

A formed article includes a metal particle which has a particle size in a range from 1 m to 20 m and consists of an outer shell and a core part. The core part contains Sn or a Sn alloy. The outer shell contains an intermetallic compound of Sn and Cu and covers 50% or more of a total surface area of the core part.