In one aspect, cutting tools are provided comprising radiation ablation regions defining at least one of refractory surface microstructures and/or nanostructures. For example, a cutting tool described herein comprises at least one cutting edge formed by intersection of a flank face and a rake face, the flank face formed of a refractory material comprising radiation ablation regions defining at least one of surface microstructures and surface nanostructures, wherein surface pore structure of the refractory material is not occluded by the surface microstructures and surface nanostructures.

A coated cutting tool according to the present invention is a coated cutting tool comprising a substrate and a coating layer formed on a surface of the substrate, wherein: the coating layer comprises a lower layer, an intermediate layer formed on a surface of the lower layer, and an upper layer formed on a surface of the intermediate layer; the lower layer is a predetermined Ti compound layer with a predetermined average thickness; the intermediate layer is an -type aluminum oxide layer with a predetermined average thickness; the upper layer is a Ti carbonitride layer with a predetermined average thickness; and a texture coefficient of a predetermined plane of each of the -type aluminum oxide layer and the Ti carbonitride layer falls within a predetermined range.

A cutting tool for performing cutting operations on a workpiece when the cutting tool is rotated about a central axis by a machine tool, the cutting tool includes a generally cylindrical body disposed about the central axis. The generally cylindrical body includes a first end and an opposite second end. The cutting tool further includes a cutting portion and a mounting portion. The cutting portion is disposed at or about the first end of the generally cylindrical body and includes a number of cutting edges structured to engage the workpiece during cutting operations. The mounting portion is disposed at or about the opposite second end of the generally cylindrical body and is structured to be coupled to the machine tool. At least a portion of the generally cylindrical body comprises a molded portion formed via a molding process about the cutting portion in a manner that couples the cutting portion to the generally cylindrical body.

The invention relates to a cutting insert (1) for installation in carrier tools for machining workpieces, comprising a top side (2), a bottom side (3), and side surfaces (4) connecting the top side (2) and the bottom side (3), wherein a peripheral protective chamfer (5) having an upper edge (6) adjoining the top side (2) of the cutting insert (1) and having a lower edge (7) adjoining the side surfaces (4) is arranged at the transition from the top side (2) to the side surfaces (4), wherein the upper edge (6) forms cutting edges (9) and cutting corners (10) and, in the region of the cutting edges (9), the lower edge (7) transitions into a cutting-edge clearance angle surface (8) having an edge clearance angle of 3 to 11. For improved edge stability in drawn cuts, it is proposed that, in the region of the cutting corners (10), the lower edge (7) of the protective chamfer (5) transitions into a corner clearance angle surface (11) having an edge clearance angle of 3 to 5.

A coated cutting tool has a substrate and a coating layer formed onto a surface of the substrate. The coating layer contains a hard layer of a composition represented by (Ti.sub.xM.sub.1-x)N, wherein M represents at least one kind of an element selected from the group consisting of Zr, Hf, V, Nb, Ta, Cr, Mo, W, Al, Si and Y, and x represents an atomic ratio of a Ti element based on a sum of the Ti element and an M element, and satisfies 0.45x0.9. Also, an average grain size of grains constituting the hard layer is 200 nm or more and 600 nm or less, and the grains of the hard layer satisfy predetermined conditions.

Disclosed herein are systems and methods for polishing internal surfaces of apertures in semiconductor processing chamber components. A method includes providing a ceramic article having at least one aperture, the ceramic article being a component for a semiconductor processing chamber. The method further includes polishing the at least one aperture based on flowing an abrasive media through the at least one aperture of the ceramic article, the abrasive media including a polymer base and a plurality of abrasive particles.

In one aspect, sintered ceramic bodies are described herein which, in some embodiments, demonstrate improved resistance to wear and enhanced cutting lifetimes. For example, a sintered ceramic body comprises tungsten carbide (WC) in an amount of 40-95 weight percent, alumina in an amount of 5-30 weight percent and ditungsten carbide (W.sub.2C) in an amount of at least 1 weight percent.

A cutting insert including a surface involved in cutting, for which a cutting tool material of a hard sintered body is used. A radius of a nose R portion is 0.4 mm or greater and 2.4 mm or less, an apex angle of the nose R portion is 50 or greater and 95 or less, a rake angle at a position of a bisecting plane of the apex angle of the nose R portion is 1 or greater and 10 or less, a chamfer provided in a cutting edge portion is a negative land with unequal width, and at least on one side of the negative land with respect to a boundary which is an apex of a nose R portion cutting edge, a width of the negative land gradually decreases from the apex of the nose R portion cutting edge to a position at which the nose R portion cutting edge is connected to a linear cutting edge. Let W1 be the width of the negative land at the apex of the nose R portion cutting edge, and W2 be the width of the negative land at both ends of the nose R portion cutting edge, then the W1 is 0.04 mm or greater and 0.2 mm or less, and a ratio of the W1 to the W2 is 1.5 or greater.

A sintered molded article includes a ceramic of /-sialon having a grain boundary phase, the grain boundary phase containing at least one hard material formed in situ as an additional phase. A method for the production of the sintered molded article uses at least the following compounds as a starting material: Si.sub.3N.sub.4, AlN, and, if applicable, Al.sub.2O.sub.3, at least one oxide of the rare earths, and at least one oxide of the element titanium.

In one aspect, cutting tools are provided comprising radiation ablation regions defining at least one of refractory surface microstructures and/or nanostructures. For example, a cutting tool described herein comprises at least one cutting edge formed by intersection of a flank face and a rake face, the flank face formed of a refractory material comprising radiation ablation regions defining at least one of surface microstructures and surface nanostructures, wherein surface pore structure of the refractory material is not occluded by the surface microstructures and surface nanostructures.