A facer for use in preparing the opposed ends of polyolefin pipes for fusion into a pipeline has a pair of cutting wheels which rotate in unison. A controller causes the cutting wheels to trace and face the pipe end walls in a closed loop path.

Pipe machining apparatuses and methods are disclosed. Embodiments include placing a clamp around a plastic pipe and attaching a cutting tool to the clamp, the cutting tool moving around the clamp and around the pipe as the cutting tool shapes the pipe end by removing portions of the pipe end. Further embodiments include forming a male portion of a snap coupling on one pipe and forming a female portion of a snap coupling on another pipe and pressing the two coupling portions together until the two pipes associated with the coupling portions snap together. Still further embodiments include rotating the pipe as the cutting tool travels around the pipe. Additional embodiments include an adjustment mechanism that adjusts the radial and/or axial location of the cutting head with respect to the clamp and with respect to the pipe.

A multifunction primer pocket correction tool that combines three cutting features in a single hand tool for use in ammunition reloading. The tool operates to cut the primer pocket depth, removes the military crimp and chamfers the leading edge of the flash hole in a single process. This combined tool includes a new technology in an external flash hole chamfer. This adds another level of safety and consistency with each casing, while still chamfering, and end milling the primer pocket, all while using the base of the casing as a backstop for consistent depth of cut.

An assembly for monitoring a semiconductor device under test comprising a mill configured to mill the device, a sensor configured to measure an electrical characteristic of the device, and a computer configured to determine the amount of strain in the device from the electrical characteristic when the mill is milling the device and detect an endpoint of milling at a circuit within the device. In use the endpoints of the milling process of the semiconductor device are detected measuring an electrical characteristic of the device with a sensor during milling determining the amount of strain in the device from the electrical characteristic and detecting an endpoint of the milling process within the device based on the amount of strain.

An assembly for monitoring a semiconductor device under test comprising a mill configured to mill the device, a sensor configured to measure an electrical characteristic of the device, and a computer configured to determine the amount of strain in the device from the electrical characteristic when the mill is milling the device and detect an endpoint of milling at a circuit within the device. In use the endpoints of the milling process of the semiconductor device are detected measuring an electrical characteristic of the device with a sensor during milling determining the amount of strain in the device from the electrical characteristic and detecting an endpoint of the milling process within the device based on the amount of strain.