The invention relates to a method for making nanopores in thin layers or monolayers of transition metal dichalcogenides that enables accurate and controllable formation of pore within those thin layer(s) with sub-nanometer precision.

The invention relates to a method and a device for electrochemically processing a material, which contains a hard phase and a binder phase. The method comprises preparing an aqueous, alkaline, complexing-agent-containing electrolyte and bringing the material to be processed into contact at least in part with the electrolyte and with a current source. In order to electrochemically oxidize the material, a pulsed electrical current is delivered to the material by means of the current source, the pulse sequence of the delivered electrical current being adjusted to the amount of the binder phase in the material to be processed. By means of the method and by means of the device, it is also possible to process materials having a high content of binder phase in such a way that matter can be removed from the material evenly (homogeneously), i.e. both from the hard phase and from the binder phase of the material.

The invention relates to a method for making nanopores in thin layers or monolayers of transition metal dichalcogenides that enables accurate and controllable formation of pore within those thin layer(s) with sub-nanometer precision.

Systems and methods for sterilization using nonthermal plasma (NTP) ionization are disclosed. An example method for inactivation of viable microorganisms includes: inactivating viable microorganisms in a predetermined volume by: installing a plurality of ceiling mounted direct current (DC) or alternating current (AC), bipolar or steady-state, ion emitter modules based on a geometry of the predetermined volume; and producing, using the plurality of ceiling mounted ion emitter modules, a DC or AC, bipolar or steady-state, nonthermal plasma (NTP), each of the ceiling mounted ion emitter modules comprising a high voltage power supply (HVPS).

An electrochemical machining device includes a plurality of electrodes, a guiding member and a plate member. The electrodes are disposed around a workpiece. The guiding member is configured to limit and guide each of the electrodes to move. The plate member is configured to exert a force to each of the electrodes. The driving member is configured to rotate the workpiece. The plate member is connected to each of the electrodes. A force-exerting direction of the force from the plate member to each of the electrodes is parallel to a central axis of each of the electrodes or deflects off the central axis. Each of the electrodes is passed through the guiding member and configured to perform a machining on the workpiece which is rotated by the driving member, and each of the electrodes has an electrochemical machining direction which is perpendicular, oblique or parallel to the workpiece.

An electrochemical machining device includes a plurality of electrodes, a guiding member and a plate member. The electrodes are disposed around a workpiece. The guiding member is configured to limit and guide each of the electrodes to move. The plate member is configured to exert a force to each of the electrodes. The driving member is configured to rotate the workpiece. The plate member is connected to each of the electrodes. A force-exerting direction of the force from the plate member to each of the electrodes is parallel to a central axis of each of the electrodes or deflects off the central axis. Each of the electrodes is passed through the guiding member and configured to perform a machining on the workpiece which is rotated by the driving member, and each of the electrodes has an electrochemical machining direction which is perpendicular, oblique or parallel to the workpiece.

A method includes producing a bulk substrate and beveling an edge of the bulk substrate using an electrical discharge machining (EDM) process and/or an electrochemical discharge machining (ECDM) process.

A method includes producing a bulk substrate and beveling an edge of the bulk substrate using an electrical discharge machining (EDM) process and/or an electrochemical discharge machining (ECDM) process.

A wire electrical discharge machine includes: a travelling route formed of multiple divisional regions, through which a wire electrode is fed by an auto wire feeding mechanism; and a memory storing failure evaluation reference data on the auto wire feeding for every divisional region. The wire electrical discharge machine detects failure of the auto wire feeding and locate the tip position of the wire electrode at the time of failure and causes a controller to determine whether to perform or stop retry of the auto wire feeding based on the located tip position and the failure evaluation reference data for every divisional region.

A wire electrical discharge machine includes: a travelling route formed of multiple divisional regions, through which a wire electrode is fed by an auto wire feeding mechanism; and a memory storing failure evaluation reference data on the auto wire feeding for every divisional region. The wire electrical discharge machine detects failure of the auto wire feeding and locate the tip position of the wire electrode at the time of failure and causes a controller to determine whether to perform or stop retry of the auto wire feeding based on the located tip position and the failure evaluation reference data for every divisional region.