Patent classifications
B23H3/08
SYSTEMS AND METHODS FOR AFFECTING SURFACES OF ELECTRICALLY CONDUCTIVE MATERIALS
Systems and methods for beneficially affecting the surface morphology of electrically conductive materials using electrochemistry are described. The systems and methods for beneficially affecting the surface morphology of electrically conductive materials use a bimodal process in which a first current type (alternating or direct) is applied across an electrolyte between an electrode and a workpiece followed by applying a second current type different from the first current type is used. The bimodal process may be repeated one or more times.
Method for improving surface quality of alloy micro-area via supersaturated film and use thereof
Disclosed are a method for improving a surface quality of an alloy micro-area via a supersaturated film and use thereof. The method includes: adding nickel chloride to a sodium chloride-ethylene glycol electrolyte until the electrolyte is saturated, and conducting electrochemical machining.
Method for improving surface quality of alloy micro-area via supersaturated film and use thereof
Disclosed are a method for improving a surface quality of an alloy micro-area via a supersaturated film and use thereof. The method includes: adding nickel chloride to a sodium chloride-ethylene glycol electrolyte until the electrolyte is saturated, and conducting electrochemical machining.
ELECTROCHEMICAL MACHINING DEVELOPMENTS
A mounting body for electrochemically machining a cavity of a component is disclosed. The mounting body comprises: an engagement face, at least part of an electrode and a plurality of electrode channels. The engagement face is engageable with the component to align the mounting body with the component. The at least part of an electrode is coupled to the mounting body. The plurality of electrolyte channels extend at least partway through the mounting body. Downstream ends of the plurality of electrolyte channels are distributed around the at least part of an electrode.