The present invention relates to a downhole tool (23), for removing sections of metal tubing, comprising: at least one conductive element (1) being arranged to corrode a section of metal tubing using an electrolytic process, said conductive element (1) being a tube or a pipe which is made of electric conductive material, an apparatus (4) to establish a connection to the metal tubing (2), and a milling apparatus with cutting or abrasive elements (3) arranged to remove byproducts from the electrolytic process. The invention also relates to a modular downhole tool (45), comprising an elongated main shaft (8) with several modules for insertion in a wellbore.

A punch, such as a socket punch, with an angle on a portion of the punch and method of manufacturing a punch with an angle on a portion of the punch using wire EDM. A punch for a cold forming process includes a base portion adapted to be a structural backbone for the punch and a work portion extending from the base portion that performs a punching operation. In addition, grooves and a hex portion are formed in the working portion with an electric discharge machining (EDM) machine. Further, a cone point is machined on an end of the hex portion and a land area with an inwardly tapered angle formed between the hex portion and the cone point. The punch can be manufactured more quickly and from a CAD model, therefore removing the need for over-specialized equipment and improving manufacturing times.

A punch, such as a socket punch, with an angle on a portion of the punch and method of manufacturing a punch with an angle on a portion of the punch using wire EDM. A punch for a cold forming process includes a base portion adapted to be a structural backbone for the punch and a work portion extending from the base portion that performs a punching operation. In addition, grooves and a hex portion are formed in the working portion with an electric discharge machining (EDM) machine. Further, a cone point is machined on an end of the hex portion and a land area with an inwardly tapered angle formed between the hex portion and the cone point. The punch can be manufactured more quickly and from a CAD model, therefore removing the need for over-specialized equipment and improving manufacturing times.

The invention provides an electrochemical discharge-assisted micro-grinding device for micro-components of brittle and hard materials. The device includes a micro-grinding tool, grinding fluid, a workpiece, an auxiliary electrode, a processing groove, and a pulsed DC power supply; the processing groove is filled with grinding fluid; the micro-grinding tool, the workpiece, and the auxiliary electrode are immersed in the grinding fluid; the micro-grinding tool is composed of a conductive grinding tool base, an electroplating layer, and insulated superabrasives. The micro-grinding tool is connected to the negative electrode of the pulsed DC power supply; the grinding fluid is composed of H.sub.2O.sub.2, Na.sub.2CO.sub.3, EDTA-Fe-Na, and deionized water; the workpiece material is brittle and hard; a large number of micro structures need to be produced on the surface of the workpiece.

The invention provides an electrochemical discharge-assisted micro-grinding device for micro-components of brittle and hard materials. The device includes a micro-grinding tool, grinding fluid, a workpiece, an auxiliary electrode, a processing groove, and a pulsed DC power supply; the processing groove is filled with grinding fluid; the micro-grinding tool, the workpiece, and the auxiliary electrode are immersed in the grinding fluid; the micro-grinding tool is composed of a conductive grinding tool base, an electroplating layer, and insulated superabrasives. The micro-grinding tool is connected to the negative electrode of the pulsed DC power supply; the grinding fluid is composed of H.sub.2O.sub.2, Na.sub.2CO.sub.3, EDTA-Fe-Na, and deionized water; the workpiece material is brittle and hard; a large number of micro structures need to be produced on the surface of the workpiece.

The invention discloses an electrochemical mechanical polishing/planarization equipment for processing a polishing surface of a conductive wafer substrate, which includes a power supply; a polishing table with conductivity; a polishing pad including an insulating active layer and having holes where a conductive chemical liquid is accommodated; a polishing head having conductivity and being attached to the back of the polishing surface. The power supply, the polishing table, the chemical liquid, the conductive wafer substrate, and the polishing head in sequence form a conductive loop, and an electrochemical reaction layer is formed on the polishing surface of the conductive wafer substrate. The polishing head drives the wafer substrate to move relative to the polishing pad, and to implement a mechanical polishing or a chemical mechanical polishing of the electrochemical reaction layer.

The invention discloses an electrochemical mechanical polishing/planarization equipment for processing a polishing surface of a conductive wafer substrate, which includes a power supply; a polishing table with conductivity; a polishing pad including an insulating active layer and having holes where a conductive chemical liquid is accommodated; a polishing head having conductivity and being attached to the back of the polishing surface. The power supply, the polishing table, the chemical liquid, the conductive wafer substrate, and the polishing head in sequence form a conductive loop, and an electrochemical reaction layer is formed on the polishing surface of the conductive wafer substrate. The polishing head drives the wafer substrate to move relative to the polishing pad, and to implement a mechanical polishing or a chemical mechanical polishing of the electrochemical reaction layer.

The invention discloses an electrochemical mechanical polishing/planarization equipment for processing a polishing surface of a conductive wafer substrate, which includes a power supply; a polishing table with conductivity; a polishing pad including an insulating active layer and having holes where a conductive chemical liquid is accommodated; a polishing head having conductivity and being attached to the back of the polishing surface. The power supply, the polishing table, the chemical liquid, the conductive wafer substrate, and the polishing head in sequence form a conductive loop, and an electrochemical reaction layer is formed on the polishing surface of the conductive wafer substrate. The polishing head drives the wafer substrate to move relative to the polishing pad, and to implement a mechanical polishing or a chemical mechanical polishing of the electrochemical reaction layer.

The invention discloses an electrochemical mechanical polishing/planarization equipment for processing a polishing surface of a conductive wafer substrate, which includes a power supply; a polishing table with conductivity; a polishing pad including an insulating active layer and having holes where a conductive chemical liquid is accommodated; a polishing head having conductivity and being attached to the back of the polishing surface. The power supply, the polishing table, the chemical liquid, the conductive wafer substrate, and the polishing head in sequence form a conductive loop, and an electrochemical reaction layer is formed on the polishing surface of the conductive wafer substrate. The polishing head drives the wafer substrate to move relative to the polishing pad, and to implement a mechanical polishing or a chemical mechanical polishing of the electrochemical reaction layer.

A device for machining a work piece creates an electrical potential between an electrode and the work piece or another conducting body proximate to the work piece. The electrical potential establishes an electrical field within the work piece that is expected to repel electrons and create a region of positively charged ions which repel one another. This region is expected to be weakened and material is expected to be removable from this region of the work piece using less force and energy than when machined by traditional machining techniques.