A dielectric working fluid processor for processing dielectric working fluid used in a wire electrical discharge machine includes: a dirty liquid tank for storing dielectric working fluid containing machining swarf; a filter for removing machining swarf from the dielectric working fluid in the dirty liquid tank; a clean liquid tank for storing the dielectric working fluid from which the machining swarf has been removed by the filter; a pump for supplying dielectric working fluid from the dirty liquid tank to the filter; an inverter for controlling electric power to be supplied to the pump; a pump controller for controlling the rotation speed of the pump by varying the frequency of electric power supplied from the inverter to the pump; and a feed pressure obtainer for obtaining the feed pressure of the dielectric working fluid supplied from the pump to the filter, based on the frequency of the electric power.

A method for the determination of lifetime of a filter of an electric discharge machine the electrical discharge machine in consideration of a maximum allowable filter pressure, wherein the time measuring unit counts the machining time ts during which an electric discharge machining process is running, a filter pressure sensor measures the filter pressure p(k), preferably with a predetermined sampling interval, the pressure measurement p(k) and the respective sampling time t(k) are stored, and the sampled measurements p(k) and the respective sampling times t(k) are used to determine the parameters of an exponential function which best fits to the plurality of sampled measurements regression analysis. The determined parameters include the filter lifetime tf, which serves to determine the residual time to the filter replacement tr and/or the calendar deadline of filter expiration.

A method for the determination of lifetime of a filter of an electric discharge machine the electrical discharge machine in consideration of a maximum allowable filter pressure, wherein the time measuring unit counts the machining time ts during which an electric discharge machining process is running, a filter pressure sensor measures the filter pressure p(k), preferably with a predetermined sampling interval, the pressure measurement p(k) and the respective sampling time t(k) are stored, and the sampled measurements p(k) and the respective sampling times t(k) are used to determine the parameters of an exponential function which best fits to the plurality of sampled measurements regression analysis. The determined parameters include the filter lifetime tf, which serves to determine the residual time to the filter replacement tr and/or the calendar deadline of filter expiration.

Disclosed is a wafer slicing apparatus which cuts a silicon ingot to fabricate a silicon wafer, and more specifically, a silicon wafer slicing apparatus cutting the silicon ingot using wire discharge machining is disclosed. The present invention provides a silicon wafer slicing apparatus using wire discharge machining comprising: a water tank which contains an electrolyte; a cutting wire which has a cutting section dipped into the water tank and is transferred by a wire driving means; an ingot transferring unit which includes an electrode on which a silicon ingot, an object to be cut, is fixed, and moves the silicon ingot up and down within the cutting section of the cutting wire; an electrolyte circulating means which circulates and refines the electrolyte stored in the water tank; and a power supply unit which supplies a source voltage to the electrode of the ingot transferring unit and the cutting wire.

Disclosed is a wafer slicing apparatus which cuts a silicon ingot to fabricate a silicon wafer, and more specifically, a silicon wafer slicing apparatus cutting the silicon ingot using wire discharge machining is disclosed. The present invention provides a silicon wafer slicing apparatus using wire discharge machining comprising: a water tank which contains an electrolyte; a cutting wire which has a cutting section dipped into the water tank and is transferred by a wire driving means; an ingot transferring unit which includes an electrode on which a silicon ingot, an object to be cut, is fixed, and moves the silicon ingot up and down within the cutting section of the cutting wire; an electrolyte circulating means which circulates and refines the electrolyte stored in the water tank; and a power supply unit which supplies a source voltage to the electrode of the ingot transferring unit and the cutting wire.

A method of machining a work-piece formed of titanium-based material, using a machining apparatus, is described. The method includes the steps of providing an electrically-conductive electrode contained within a spindle assembly, in a pre-selected distance and position relative to the titanium-based work-piece; while electrically powering the electrode and the work-piece with a power supply. In the process, fluid electrolyte is circulated through at least two pathways in the machining apparatusan internal conduit within the spindle assembly; and an external conduit. The charged electrode is moved relative to the work-piece in a plunging motion, to remove material from the work-piece at a relatively high rate, using a high-speed electro-erosion (HSEE) process.

A method of machining a work-piece formed of titanium-based material, using a machining apparatus, is described. The method includes the steps of providing an electrically-conductive electrode contained within a spindle assembly, in a pre-selected distance and position relative to the titanium-based work-piece; while electrically powering the electrode and the work-piece with a power supply. In the process, fluid electrolyte is circulated through at least two pathways in the machining apparatusan internal conduit within the spindle assembly; and an external conduit. The charged electrode is moved relative to the work-piece in a plunging motion, to remove material from the work-piece at a relatively high rate, using a high-speed electro-erosion (HSEE) process.

A wire electric discharge machine is provided with a storage unit configured to store the flow rate of a machining fluid delivered to a sealing portion in a machining tank in association with the flow rate of the machining fluid delivered to a nozzle. The flow rate of the machining fluid delivered to the nozzle is measured, and the flow rate of the machining fluid to be supplied to the sealing portion is read from the flow rate storage unit and set, based on the measured flow rate.

A wire electric discharge machine is provided with a storage unit configured to store the flow rate of a machining fluid delivered to a sealing portion in a machining tank in association with the flow rate of the machining fluid delivered to a nozzle. The flow rate of the machining fluid delivered to the nozzle is measured, and the flow rate of the machining fluid to be supplied to the sealing portion is read from the flow rate storage unit and set, based on the measured flow rate.

A rotary table apparatus includes a rotary table body, a table rotor supported on the rotary table body and configured to be rotatable, a driving unit for driving the table rotor, a seal mechanism including a sealer disposed between the rotary table body and the table rotor, and a first supply unit configured to supply clean fluid for use in machining to the seal mechanism.