A method for preparing a cross-dimension micro-nano structure array includes: S1. providing a workpiece immersed in the electrolyte as the first electrode, providing a trimming wire electrode as the second electrode and setting it above the workpiece, providing an interference beam adjuster and outputting multi-beam laser interference to irradiate the surface of the workpiece; S2. The power supply between the first electrode and the second electrode forms a loop, and drives the trimming wire electrode to reciprocate relative to the workpiece, and the workpiece undergoes electrochemical dissolution or electrochemical deposition at the corresponding position of the trimming wire electrode, and form a micro-nano structure array without a mask, and solves the problem of low output power of the existing ultrashort pulse power supply, improves the processing accuracy of the micro-nano structure array, does not require electrolyte for high-speed flow, and improves system safety and reduce the cost.

The invention provides an electrochemical discharge-assisted micro-grinding device for micro-components of brittle and hard materials. The device includes a micro-grinding tool, grinding fluid, a workpiece, an auxiliary electrode, a processing groove, and a pulsed DC power supply; the processing groove is filled with grinding fluid; the micro-grinding tool, the workpiece, and the auxiliary electrode are immersed in the grinding fluid; the micro-grinding tool is composed of a conductive grinding tool base, an electroplating layer, and insulated superabrasives. The micro-grinding tool is connected to the negative electrode of the pulsed DC power supply; the grinding fluid is composed of H.sub.2O.sub.2, Na.sub.2CO.sub.3, EDTA-Fe-Na, and deionized water; the workpiece material is brittle and hard; a large number of micro structures need to be produced on the surface of the workpiece.

This invention is directed to a new method of mass-transfer/fabrication of micro-sized features/structures onto the inner diameter (ID) surface of a stent. This new approach is provided by technique of through mask electrical micro-machining. One embodiment discloses an application of electrical micro-machining to the ID of a stent using a customized electrode configured specifically for machining micro-sized features/structures.

A method for manufacturing a liquid-discharge-head substrate includes providing a substrate having an energy-generating element and a pad, the pad having a wiring layer and a contact-probe receiving section, the contact-probe receiving section having a Vickers hardness that is higher than a Vickers hardness of the wiring layer; bringing a contact probe into contact with the contact-probe receiving section; and performing an electrical inspection by bringing the contact probe into contact with the wiring layer in the pad.

A method for microengineering a gradient structure on a metal surface. A metal surface including at least first, second, and third metal surface regions is exposed to a metal-removing agent. A portion of surface metal atoms is removed by the metal-removing agent in each of the first, second, and third metal surface regions. Sequential metal removal processes expose only the second and third regions to the metal-removing agent, followed by exposing only the third region to the metal-removing agent. A gradient metal surface is formed having different properties in each of the first, second, and third metal surface regions. In a further aspect, quantitative surface-enhanced Raman spectroscopy may be performed using the treated metal surface. An amount of an analyte is determined based on its position in one of the first, second, or third metal surface regions.

This invention is directed to a new method of mass-transfer/fabrication of micro-sized features/structures onto the inner diameter (ID) surface of a stent. This new approach is provided by technique of through mask electrical micro-machining. One embodiment discloses an application of electrical micro-machining to the ID of a stent using a customized electrode configured specifically for machining micro-sized features/structures.

The present invention provides an inductive electrochemical machining device, which comprises a base, an inductive machining electrode, and a negative cleaning module. The base includes a workpiece machining zone. The inductive machining electrode is disposed on the base and corresponds to said workpiece machining zone. The negative cleaning module is opposing to the inductive machining electrode. When the inductive machining electrode performs electrochemical machining, the generated induction current may be used for machining. In addition, the surface of the inductive machining electrode may be cleaned concurrently by the negative cleaning module.

This invention is directed to a pattern transfer device and assembly for mass-transfer/fabrication of micro-sized features/structures onto the inner diameter (ID) surface of a stent. This new approach is provided by technique of through mask electrical micro-machining. One embodiment discloses an application of electrical micro-machining to the ID of a stent using a customized electrode configured specifically for machining micro-sized features/structures.

For friction reduction in sliding bearing, it is known to structure the sliding surface (1) by ECM by introducing a plurality of microscopic small indentations (27). According to the invention it is proposed in particular in the same process step to smoothen also the intermediary spaces (6) between the indentations (27), thus to remove the tips of the surface profile.

Systems and methods disclosed herein relate to texturing a metal surface. A disclosed method for texturing a metal surface comprises applying a material via a thermal spray to form a textured surface, for example on a firearm slide.