A device for applying fluid having a pasty consistency is provided. The present invention relates to a device for applying brazing paste manually or by means of a robotic arm, having an elastically deformable conduit and a drive spindle.

The present invention provides an inexpensive valve unit fixing structure that enables a valve unit to be easily fixed without the need for unitization in advance, and a fluid pump that enables a discharge valve and a relief valve to be incorporated in a compact manner. The valve unit fixing structure includes a main body (3), a discharge communication passage (9) provided inside the main body (3), a discharge valve unit (10) which is provided in the main body (3) and which opens/closes the discharge communication passage (9), and deformed fixing parts (35) which are formed by plastically deforming the main body (3) and which fix the discharge valve unit (10) to the main body (3).

An example method of joining a first substrate with a second substrate includes applying a filler material between respective portions of the first substrate and the second substrate, the filler material including an electrically conducting and/or magnetic material, wherein the filler material and the respective portions define a joint; applying an alternating magnetic field to the joint to heat the electrically conducting material to a reaction temperature; in response to heating the electrically conducting material to the reaction temperature, energizing the joint using energy released from the electrically conducting material; cooling the joint to join the first substrate with the second substrate.

A self-heating solder flux material includes a solder flux material and a multi-compartment microcapsule. The solder flux material includes a solvent carrier, and the multi-compartment microcapsule includes a first compartment, a second compartment, and an isolating structure. The first compartment contains a first reactant, and the second compartment contains a second reactant. The isolating structure separates the first compartment from the second compartment. The isolating structure is adapted to rupture in response to a stimulus.

The invention relates to a method for forming a bonded joint between a structure that is applied to a glass substrate, in particular a printed conductive structure and an electrical connecting component, in particular a solder base by using solder coated or non-solder coated reactive nanometer multilayer foils which are made from at least two exothermally reacting materials. Initially preconfiguring the reactive nanometer multilayer foils according to the opposing joining surfaces of the conductive structure and the electrical closure element is performed. Thereafter arranging a solder preform respectively between the respective joining surface and the nanometer multilayer foil for non-solder coated foils or arranging an additional solder preform for already solder coated nanometer multilayer foils is performed, wherein the solder preform or the additional solder preform includes a larger, in particular double thickness layer compared to another solder preform between the nanometer multilayer foil and the a conductive structure applied to the glass substrate so that a reduction of the temperature introduction into the conductive structure and a leveling of uneven portions is caused. After temporarily applying a pressure force which is applied between the joining surfaces triggering the exothermal reaction of the nanometer multilayer foil is performed by an electrical impulse or a laser impulse.

A silver electrode joint having a high joint strength obtained by actively minimizing the particle size of a silver-zinc intermetallic compound at the solidification point. A joint obtained by joining an article to be joined, the joint including silver at least as the surface layer thereof, using a solder alloy which comprises 2-9 wt % of zinc, 0.0001-0.1 wt % of manganese and the balance consisting of tin, the solder joint having a joint interface wherein the particle size of a silver-zinc intermetallic compound, which is formed by silver being the surface layer of the article to be joined and zinc in the solder alloy, is 5 m or less.

A self-heating solder flux material includes a solder flux material and a multi-compartment microcapsule. The solder flux material includes a solvent carrier, and the multi-compartment microcapsule includes a first compartment, a second compartment, and an isolating structure. The first compartment contains a first reactant, and the second compartment contains a second reactant. The isolating structure separates the first compartment from the second compartment. The isolating structure is adapted to rupture in response to a stimulus. Rupture of the isolating structure results in an exothermic reaction between the first reactant and the second reactant. The exothermic reaction generates heat to volatilize the solvent carrier.

An electrical bypass device has two electrical conductors electrically insulated from one another and arranged such that two surface regions of the conductors are spaced apart from one another by a gap. Above the surface regions is a bypass element having at least one electrically conductive layer in the form of or connected to a mechanical energy store. The mechanical energy store is transferable by thermal triggering from a first mechanical state to a stable second mechanical state in which the electrically conductive layer of the bypass element makes electrical contact with the surface regions and shorts the two electrical conductors. Above the surface regions is a reactive element where an exothermic reaction can be triggered, resulting in the mechanical energy store transferring to the stable second mechanical state.

A braze preform includes a filler metal, a flux in communication with the filler metal, and a luminescent material covering at least a portion of the filler metal. The luminescent material is equal to or less than 0.15% total weight of the braze ring. Further, the luminescent material includes at least one of a luminescent ink, a solvent, and a binder. The solvent may be one of a bromide-based solvent or a non-chlorine-based solvent. The binder may be an acrylic resin.

Trigger devices for igniting an exothermic reaction is provided. The trigger devices may be flint type trigger devices and electronic type trigger devices. The flint type trigger device has a housing with a spark opening on a rear wall of the housing. A mold mounting assembly is secured to an exterior of the rear wall of the housing. A motor assembly is secured to the inside of the rear wall of the housing. The motor assembly has a flint wheel attached to a shaft of a motor, where the flint wheel is located adjacent the spark opening. A flint assembly is positioned within the housing such that a flint of the flint assembly is in contact with the flint wheel. A controller positioned within the housing is configured to selectively activate the motor to cause the flint wheel to rotate against the flint to create one or more sparks that are ejected from the spark opening.