Patent classifications
B23K1/0008
FLUX, SOLDER PASTE, AND ELECTRONIC CIRCUIT BOARD
A flux used for soldering with a tin-silver-copper alloy comprises an imidazole compound and/or an imidazoline compound; a dicarboxylic acid having 3 or more and 36 or less carbons; and a quaternary ammonium iodine salt. Relative to the total amount of the flux, the dicarboxylic acid content is 6 mass % or more and 25 mass % or less, and the iodine content is 200 ppm or more and 3600 ppm or less.
Overlapped blank for hot stamping, method of manufacturing overlapped hot stamp molded body, and overlapped hot stamp molded body
To solve the problem about the difference in temperature increasing rate between an overlapped part and a one-sheet part so as to further improve the corrosion resistance of plating after hot stamping. An overlapped blank for hot stamping includes: a first steel sheet; and at least one second steel sheet connected to a surface of the first steel sheet via a welding point and smaller in area than the first steel sheet, wherein: the first steel sheet is a plated steel sheet having an aluminum-based plated layer on both faces of the first steel sheet, and the second steel sheet is a plated steel sheet having an aluminum-based plated layer on both faces of the second steel sheet; a coating weight of the aluminum-based plated layer on the first steel sheet is W1 (g/m.sup.2) in terms of an average coating weight on both the faces; a coating weight of the aluminum-based plated layer on a surface on a side not in contact with the first steel sheet in the second steel sheet is W2 (g/m.sup.2); and each of the W1 and the W2 is within a range of 20 g/m.sup.2 or more and 120 g/m.sup.2 or less, and satisfies relationships of Expression (1) and Expression (2).
METHOD FOR MANUFACTURING HETEROMETALLIC ASSEMBLY AND HETEROMETALLIC ASSEMBLY
A method for manufacturing a dissimilar metal joint product includes: spraying a metal powder capable of being joined to a steel material to at least a part of a surface of an aluminum or aluminum-alloy material at a low temperature and at a high speed to form a coating thereon; disposing the aluminum or aluminum-alloy material and the steel material such that the coating and the steel material face each other; and performing brazing using a brazing material or welding using a welding material between the coating and the steel material.
BUILDING LIQUID FLOW-THROUGH PLATES
A process for building a high-performance liquid flow-through plate is provided and includes providing a substrate formed of metal matrix composite (MMC) material, metallizing a surface of the substrate to reform the surface into a metallized surface, placing a braze foil on the metallized surface and executing a high-temperature and high-pressure bake whereby material of the braze foil diffuses into the metallized surface.
Brazed electrode for plasma cutting torch
A silver-copper cutting electrode assembly, and method of manufacture is provided with optimized attributes to allow for improved durability, integrity and manufacturability. An electrode has a silver tip portion which is brazed to a copper body portion where the silver portion and joint have a particular structural relationship.
Systems and methods for bonding a downhole tool to a surface within the borehole
An assembly for use in a downhole tool. The assembly may include a body that includes a chamber with a solder suspension contained therein, the solder suspension comprising solder particles, each solder particle comprising an outer shell and a liquid metal core that is exposed and solidifies upon rupture of the outer shell. The assembly may also include a port that allows fluid flow between the chamber and an area outside of the chamber. The assembly may further include a plunger actuatable to apply a force to create a pressure to the solder suspension within the chamber to eject the solder suspension from the port at a velocity to rupture the outer shells of the particles upon contact with a surface.
SOLDERING COMPONENT AND METHOD OF ASSEMBLING SOLDERING COMPONENT TO OBJECT
The disclosure provides a soldering component and a method of assembling a soldering component to objects, the soldering component comprises a body part and an assembling part, the assembling part is for combining to the object, the body part has a snap-fit part, the snap-fit part has an elastic retracting space, and the elastic retracting space can elastically retract two or more fastening parts, so that each fastening part fastens into another object, and the soldering component has a solderable surface for soldering to an assembling part of the object, the assembling part of the object is preset with a tin soldering layer, which is heated and soldered the soldering component and the assembling part of the object.
Gas distribution plate with high aspect ratio holes and a high hole density
A gas distribution plate for a showerhead assembly of a processing chamber may include at least a first plate and second plate. The first plate may include a first plurality holes each having a diameter of at least about 100 um. The second plate may include a second plurality of holes each having a diameter of at least about 100 um. Further, each of the first plurality of holes is aligned with a respective one of the second plurality of holes forming a plurality of interconnected holes. Each of the interconnected holes is isolated from each other interconnected holes.
Repair of through-hole damage using braze sintered preform
A method may include removing a portion of a base component adjacent to a damaged portion of the base component to define a repair portion of the base component. The base component may include a cobalt- or nickel-based superalloy, and the repair portion of the base component may include a through-hole extending from a first surface of the base component to a second surface of the base component. The method also may include forming a braze sintered preform to substantially reproduce a shape of the through-hole. The braze sintered preform may include a Ni- or Co-based alloy. The method additionally may include placing the braze sintered preform in the through-hole and heating at least the braze sintered preform to cause the braze sintered preform to join to the repair portion of the base component and change a microstructure of the braze sintered preform to a brazed and diffused microstructure.
SEMICONDUCTOR SUBSTRATE SUPPORT WITH MULTIPLE ELECTRODES AND METHOD FOR MAKING SAME
A method for manufacturing an electrostatic chuck with multiple chucking electrodes made of ceramic pieces using metallic aluminum as the joining. The aluminum may be placed between two pieces and the assembly may be heated in the range of 770 C to 1200 C. The joining atmosphere may be non-oxygenated. After joining the exclusions in the electrode pattern may be machined by also machining through one of the plate layers. The machined exclusion slots may then be filled with epoxy or other material. An electrostatic chuck or other structure manufactured according to such methods.