A joined component includes a first member provided with a first joint surface having an arranging part where a brazing filler material is arranged, a second member joined to the first member by brazing, and provided with a second joint surface having an accommodating recess that opposes the arranging part, a guide groove formed in the first joint surface or the second joint surface, and extending from the arranging part or the accommodating recess toward a fringe of the first joint surface or the second joint surface, and a chamfer formed along the fringe of the first joint surface or the second joint surface, and the guide groove communicates to the chamfer.

A method of manufacturing a mold insert for the production of moldings, in particular blocks or slabs, in which a plurality of strips that form wall elements of the mold insert to be manufactured are interlocked by connecting elements and the interlocked strips are soldered to each other. There is also described a mold insert for producing moldings and to its use.

A structure and method for retaining fastening element solder are introduced. The structure includes a fastening element which has a solderable surface and a fastening portion or a hole portion. One end of the hole portion or the fastening portion has a retaining portion. During a soldering heating process, solder flows into or enters the retaining portion to cool down and solidify. The solidified solder is retained in the retaining portion. The fastening element is firmly coupled to a first object because of coordination between the solderable surface and the retaining portion, and the second object is coupled to or removed from the fastening element because of coordination between the fastening portion and the hole portion, so as to couple together and separate the first and second objects repeatedly and quickly.

solder connection that connects a contact pad on a first surface to a strip-shaped conductor. The strip-shaped conductor has a widening at one end and a through opening therein. A solder ball is located in the opening and connects the end of the conductor to the contact pad.

A closed socket brazed joint assembly is provided. The assembly comprises: a first member composed of a first base material; a second member composed of a second base material with a first end composed of a first profile with at least first and second faying surfaces; a socket formed in said first member configured to receive the first end of the second member with a faying surface with at least two portions separated by a first fillet; wherein the socket further is configured such that in a first state before the application of energy to the joint there is a gap with a width between the faying surfaces of the first member and the faying surfaces of the second member; and, in the first state a slug of brazing fill material is disposed between the first end of the second member and at least one faying surface of the socket; and, wherein a second state is created when upon application of energy the brazing fill material melts and flows from between first end of the second member and the at least one faying surface of the socket filling aforesaid gap between the faying surfaces of the first and second members.

An induction-heating welding method for vacuum insulated glass comprising upper and lower glass substrates is disclosed. Metal layers are prepared in regions to be sealed for the upper and lower glass substrates. A continuous solder is distributed on the metal layer in the lower glass substrate's region to be sealed. The upper and lower glass substrates are superposed. During welding, a high-frequency induction welding head's center moves forward along a centerline of a width of the metal layers; during induction heating of the metal layers in a corner region, a relative position between a movement route of the high-frequency induction welding head's center and the centerline of the width of the metal layers is changed, so that the movement route deviates from the centerline of the width of the metal layers, and thus reducing induction power and avoiding overheating of the metal layers in the corner region.

A method may include removing a portion of a base component adjacent to a damaged portion of the base component to define a repair portion of the base component. The base component may include a cobalt- or nickel-based superalloy, and the repair portion of the base component may include a through-hole extending from a first surface of the base component to a second surface of the base component. The method also may include forming a braze sintered preform to substantially reproduce a shape of the through-hole. The braze sintered preform may include a Ni- or Co-based alloy. The method additionally may include placing the braze sintered preform in the through-hole and heating at least the braze sintered preform to cause the braze sintered preform to join to the repair portion of the base component and change a microstructure of the braze sintered preform to a brazed and diffused microstructure.

An air data probe includes a probe head having an interior surface defining a cavity, a component positioned within the cavity of the probe head, a plurality of protrusions defining contact between the interior surface of the probe head and a peripheral surface of the component prior to brazing the component to the probe head, and a braze material located between the interior surface of the probe head and the peripheral surface of the component as a result of brazing the component to the probe head.

A method of connection to a conductive material for, such as, a switchable film, includes steps of providing a switchable film having a first substrate, a first conductive layer, a switchable layer, a second conductive layer, and a second substrate; applying a solder material to the first conductive layer with ultrasonic application to provide a first busbar; and applying the solder material to the second conductive layer with ultrasonic application to provide a second busbar. The busbars are to be connected to connectors.

The invention relates to a method for producing a heat exchanger (1) having tubes (2), which are each received at the longitudinal end side in an associated header (3), wherein the tubes (2) and the headers (3) are formed out of aluminium and are soldered to one another and, in a state soldered to one another, form a coolant-conducting channel structure (4).

Here it is substantial for the invention that the heat exchanger (1), following the soldering of the tubes (2) to the headers (3), is cold-formed and the strength thereby increased.

By way of this, the weight and the costs can be reduced and the performance and the strength increased.