Physical vapor deposition target assemblies and methods of manufacturing such target assemblies are disclosed. An exemplary target assembly comprises a flow pattern including a plurality of arcs and bends fluidly connected to an inlet end and an outlet end.

Disclosed is a hermetic bond for a joint including a first layer of silicon carbide; a second layer of silicon carbide; and a bonding layer positioned between the first layer and the second layer, wherein the bonding layer includes an iridium layer, a first reaction zone positioned between the iridium foil layer and the first layer, and a second reaction zone positioned between the iridium foil layer and the second layer, wherein the first reaction zone and the second reaction zone include iridium silicides.

A cutting insert comprises: a body; and a blade fixed to the body and made of a polycrystalline cubic boron nitride including 98.5% by volume or more of cubic boron nitride, the blade having a rake face and a flank face, the rake face and the flank face meeting each other and thus forming a ridge line which serves as a cutting edge, the rake face being provided with a land surface extending along the cutting edge, and a chip breaker disposed on a side opposite to the cutting edge with the land surface therebetween and also having a recess contiguous to the land surface.

A rotary valve can include a housing, a manifold with multiple flow paths can be fixedly mounted to the housing. A rotary actuator with a first surface can be rotatably mounted within the housing, and a valve seat with a second surface can be fixedly attached to the manifold, where the second surface can sealingly engage the first surface. The rotary actuator can include a gap that selectively aligns with respective ones of valve seat ports as the rotary actuator rotates relative to the valve seat, thereby selectively pressurizing one or more actuators. A system and method can include a rotary valve that selectively causes pads to extend at a predetermined orientation in the wellbore to steer a drill bit. The azimuthal orientation of a rotary actuator of the valve can determine which pads are extended and which are retracted as the drill bit rotates.

A fiber array unit (FAU) includes a substrate, a plurality of optical fibers, and a lid. The substrate includes: an optical window extending through a layer of non-transparent material, a plurality of grooves, and an alignment protrusion configured to mate with an alignment receiver. The plurality of optical fibers are disposed in the plurality of grooves. The alignment protrusion is configured to align the plurality of optical fibers with an external device when mated with the alignment receiver. The plurality of optical fibers is disposed between the lid and the substrate.

An electrical component configured to reduce a decrease in lifetime of a solder bonding portion of a lead terminal, and a method for manufacturing the electrical component are provided. The electrical component includes a unit, a housing case, and a sealing member. The unit includes a circuit board, a cover member covering the circuit board, and a lead terminal integrated with the cover member and soldered to the circuit board. The housing case houses the unit. The sealing member is disposed between the cover member and the housing case. The method for manufacturing the electrical component includes positioning the unit with respect to the housing case while disposing a liquid sealing member as a precursor of the sealing member between the cover member and the housing case, and hardening the liquid sealing member after the positioning.

The subject disclosure relates to electroplating niobium titanium (Nb/Ti) with a metal capable of being soldered to. According to an embodiment, a structure is provided that comprises a Nb/Ti substrate and a metal layer plated on a portion of the Nb/Ti substrate. The metal layer comprises an electroplated metal layer plated on the portion of the Nb/Ti substrate using electroplating. The metal layer can comprise a metal capable of being soldered to, such as copper. In another embodiment, a cable assembly is provided that comprises a niobium titanium wire, a metal layer plated on a first portion of the niobium titanium wire, and a metal coaxial connector soldered to the metal layer.

A ceramic structure includes a ceramic base member having a main face; a hole extending from the main face into the ceramic base member; a metal electrode layer embedded in the ceramic base member; a conductive member embedded in the ceramic base member so as to be electrically connected to the metal electrode layer and form a bottom of the hole; a first metal member joined to the conductive member by a brazing material and having an average linear expansion coefficient not less than the average linear expansion coefficient of the conductive member; one or a plurality of second metal members having a greater average linear expansion coefficient than the first metal member; and a metal terminal joined to the one or the plurality of second metal members and having a greater average linear expansion coefficient than each second metal member.

A manufactured article is comprised of an additively manufactured component having sequentially joined layers of metallic powder. A braze material is disposed on at least a portion of an outer surface of the component. The braze material is located in expected crack locations in the outer surface. At least one crack formed in the outer surface, during a heat treatment, is filled with the braze material. The additively manufactured component comprises a metallic material from a precipitation hardened nickel-based superalloy, which forms a γ′ phase.

A substrate support pedestal connectable to a shaft includes a thermally conductive body, a first fluid channel disposed within an outer zone of the thermally conductive body, and a second fluid channel disposed within an inner zone of the thermally conductive body. The first fluid channel and the second fluid channel are not in fluid communication with each other and are thermally isolated from each other by a thermal barrier within the substrate support channel.