An induction-heating welding method for vacuum insulated glass comprising upper and lower glass substrates is disclosed. Metal layers are prepared in regions to be sealed for the upper and lower glass substrates. A continuous solder is distributed on the metal layer in the lower glass substrate's region to be sealed. The upper and lower glass substrates are superposed. During welding, a high-frequency induction welding head's center moves forward along a centerline of a width of the metal layers; during induction heating of the metal layers in a corner region, a relative position between a movement route of the high-frequency induction welding head's center and the centerline of the width of the metal layers is changed, so that the movement route deviates from the centerline of the width of the metal layers, and thus reducing induction power and avoiding overheating of the metal layers in the corner region.

An induction-heating welding method for vacuum insulated glass comprising upper and lower glass substrates is disclosed. Metal layers are prepared in regions to be sealed for the upper and lower glass substrates. A continuous solder is distributed on the metal layer in the lower glass substrate's region to be sealed. The upper and lower glass substrates are superposed. During welding, a high-frequency induction welding head's center moves forward along a centerline of a width of the metal layers; during induction heating of the metal layers in a corner region, a relative position between a movement route of the high-frequency induction welding head's center and the centerline of the width of the metal layers is changed, so that the movement route deviates from the centerline of the width of the metal layers, and thus reducing induction power and avoiding overheating of the metal layers in the corner region.

A vacuum insulated glass product and the method for making the same, wherein the vacuum insulated glass comprises: a first glass substrate; a second glass substrate disposed facing the first glass substrate; a sealing structure provided between the first glass substrate and the second glass substrate and used for airtight binding of the first glass substrate and the second glass substrate to form a vacuum cavity; and a plurality of supports provided inside the vacuum cavity for bearing pressure from the first glass substrate and the second glass substrate. The sealing structure comprises: metal layers which are fixedly formed on facing surfaces of the first glass substrate and the second glass substrate, and an intermediate solder layer which is disposed between and connects the metal layers. The sealing structure has arc-shaped transition structures at the corner areas of the glass substrates.

A high-frequency heating device for mounting an LED including a carrier substrate and a high-frequency heating module is provided. The carrier substrate is disposed to carry a circuit substrate, and the circuit substrate includes a plurality of conductive pads, a plurality of conductors, and a plurality of LED chips. The conductors are respectively disposed on the conductive pads, and each of the LED chips is disposed on at least two of the plurality of conductors. The high-frequency heating module includes at least one coil assembly disposed above an upper surface of the plurality of LED chips, an upper surface of the carrier substrate, a lower surface of the carrier substrate, or an interior of the carrier substrate. Each of the LED chips is mounted onto the circuit substrate by heating the coil assembly.

An apparatus for soldering a terminal to which a solder alloy is attached on window glass for a vehicle, includes a terminal to which the solder alloy is attached; a coil unit including a coil which generates induction heat; a gripper which grips and releases the terminal and is configured to be movable upward and downward relative to the coil unit in a state of gripping the terminal; and a ferrite core unit including a ferrite core which is configured to be surrounded by the coil unit to receive the induction heat, and is configured to be movable upward and downward relative to the coil unit, wherein the solder alloy attached to the terminal, in a state of being in contact with the window glass, is melted by the induction heat from the coil unit and the ferrite core unit such that the terminal is attached to the window glass.

An apparatus for soldering a terminal to which a solder alloy is attached on window glass for a vehicle, includes a terminal to which the solder alloy is attached; a coil unit including a coil which generates induction heat; a gripper which grips and releases the terminal and is configured to be movable upward and downward relative to the coil unit in a state of gripping the terminal; and a ferrite core unit including a ferrite core which is configured to be surrounded by the coil unit to receive the induction heat, and is configured to be movable upward and downward relative to the coil unit, wherein the solder alloy attached to the terminal, in a state of being in contact with the window glass, is melted by the induction heat from the coil unit and the ferrite core unit such that the terminal is attached to the window glass.

A radial bearing having a wear surface with improved wear characteristics comprises a steel support, to which is bonded a metal carbide composite wear surface made by first arranging, within a cavity defined between a steel mold and the steel support, tiles made of microwave sintered, cemented metal carbide, closely packing the voids between the tiles with metal carbide powder, and infiltrating the mold cavity with a metal brazing alloy by subjecting the filled mold to rapid heating. The brazing alloy fills voids between the metal carbide particles, the microwave sintered metal carbide tiles, and the metal support, thereby relatively rapidly consolidating the carbide into a wear layer bonded with the steel support without substantially damaging the properties of the microwave-sintered metal carbide tiles.

A radial bearing having a wear surface with improved wear characteristics comprises a steel support, to which is bonded a metal carbide composite wear surface made by first arranging, within a cavity defined between a steel mold and the steel support, tiles made of microwave sintered, cemented metal carbide, closely packing the voids between the tiles with metal carbide powder, and infiltrating the mold cavity with a metal brazing alloy by subjecting the filled mold to rapid heating. The brazing alloy fills voids between the metal carbide particles, the microwave sintered metal carbide tiles, and the metal support, thereby relatively rapidly consolidating the carbide into a wear layer bonded with the steel support without substantially damaging the properties of the microwave-sintered metal carbide tiles.

A process for the formation of an LiM0.sub.2 (e.g., LiCoO.sub.2) sputtering target with a bi-modal grain size distribution (as in a hollow cylinder target body) that includes a CIP-based process involving, for example, forming or sourcing an LiMO.sub.2 (e.g., LiCoO.sub.2) powder; dispersion and milling (e.g., wet milling); binder introduction; drying (e.g., spray drying) to form a granulate; CIP processing of the granulate into a molded shape; and a heating cycle for debinding and sintering to form a densified sintered shape. The target body produced is suited for inclusion on a sputtering target assembly (as in a rotary sputtering target assembly with a plurality of cylindrical target bodies attached to a backing support). The invention is inclusive of the resultant target bodies formed under the CIP based process as well as an induction heater based process for attachment (e.g., metal solder bonding) of the low conductivity target body(ies) of LiMO.sub.2 (e.g., LiCoO.sub.2) to a common backing support through use of an added conductive wrap or layer provided to the target body and heated with the induction heater during the attachment process.

A process for the formation of an LiM0.sub.2 (e.g., LiCoO.sub.2) sputtering target with a bi-modal grain size distribution (as in a hollow cylinder target body) that includes a CIP-based process involving, for example, forming or sourcing an LiMO.sub.2 (e.g., LiCoO.sub.2) powder; dispersion and milling (e.g., wet milling); binder introduction; drying (e.g., spray drying) to form a granulate; CIP processing of the granulate into a molded shape; and a heating cycle for debinding and sintering to form a densified sintered shape. The target body produced is suited for inclusion on a sputtering target assembly (as in a rotary sputtering target assembly with a plurality of cylindrical target bodies attached to a backing support). The invention is inclusive of the resultant target bodies formed under the CIP based process as well as an induction heater based process for attachment (e.g., metal solder bonding) of the low conductivity target body(ies) of LiMO.sub.2 (e.g., LiCoO.sub.2) to a common backing support through use of an added conductive wrap or layer provided to the target body and heated with the induction heater during the attachment process.