Patent classifications
B23K1/002
Ni-Cr Based Alloy Brazing Material Containing Trace Amount of V
Disclosed is a NiCr-based brazing alloy including, on the basis of mass %: 15%<Cr<30%; 3%<P<12%; 0%<Si<8%; 0.01%<C<0.06%; 0%Ti+Zr<0.1%; 0.01%<V<0.1%; 0%Al<0.01%; 0.005%<O<0.025%; 0.001%<N<0.050%; 0%Nb<0.1%; and the balance being Ni and incidental impurities. Inequality (1): 0.20.24V %/C %1.0 is satisfied if the alloy contains no Nb, and Inequality (2): 0.2(0.24V %+0.13Nb %)/C %1.0 is satisfied if the alloy contains Nb. Also disclosed is an inexpensive NiCr-based brazing alloy containing a trace amount of V for use in the production of stainless steel heat exchangers and other steel articles. The alloy has a low liquidus temperature and high corrosion resistance, and achieves high brazing strength.
Metal joined body and manufacturing method for metal joined body
A metal joined body in which a joint is formed from a first metal member and a second metal member. Brazed joint portions provided intermittently with a brazing material and solder joints filling the spaces between the brazed joint portions with a solder having a fusion point lower than the brazing material, are formed at a seam of the joint. The resulting metal joint has excellent sealing properties and little thermal strain.
Metal joined body and manufacturing method for metal joined body
A metal joined body in which a joint is formed from a first metal member and a second metal member. Brazed joint portions provided intermittently with a brazing material and solder joints filling the spaces between the brazed joint portions with a solder having a fusion point lower than the brazing material, are formed at a seam of the joint. The resulting metal joint has excellent sealing properties and little thermal strain.
Apparatuses and methods for induction heating
A heating apparatus for induction heating is disclosed. The heating apparatus may comprise a bearing ring, at least one bearing element disposed in the bearing ring, and a braze material adjacent to the at least one bearing element and the bearing ring. The heating apparatus may additionally comprise an inductor positioned radially adjacent to at least a portion of the bearing ring. A current source may be electrically coupled to the inductor. A bearing orienting member may also abut a surface of the at least one bearing element. The bearing orienting member may orient a surface of the at least one bearing element. A heating method is also disclosed.
Apparatuses and methods for induction heating
A heating apparatus for induction heating is disclosed. The heating apparatus may comprise a bearing ring, at least one bearing element disposed in the bearing ring, and a braze material adjacent to the at least one bearing element and the bearing ring. The heating apparatus may additionally comprise an inductor positioned radially adjacent to at least a portion of the bearing ring. A current source may be electrically coupled to the inductor. A bearing orienting member may also abut a surface of the at least one bearing element. The bearing orienting member may orient a surface of the at least one bearing element. A heating method is also disclosed.
Electrical connector assembly method
An electrical connector assembly method, including the steps of: step 1: providing a terminal having a soldering portion; step 2: heating the soldering portion to a melting temperature of a solder; step 3: providing the solder, and press-fitting the solder to the soldering portion by a jig, so that the solder is fused and fixed to the soldering portion; and step 4: inserting the terminal fixed with the solder into an insulating body. Because only the soldering portion of the terminal is heated, less thermal energy is needed, thereby saving energy and reducing the production cost of the electrical connector. Moreover, the insulating body does not need to be heated, thus preventing the insulating body from being warped and deformed due to heat.
Electrical connector assembly method
An electrical connector assembly method, including the steps of: step 1: providing a terminal having a soldering portion; step 2: heating the soldering portion to a melting temperature of a solder; step 3: providing the solder, and press-fitting the solder to the soldering portion by a jig, so that the solder is fused and fixed to the soldering portion; and step 4: inserting the terminal fixed with the solder into an insulating body. Because only the soldering portion of the terminal is heated, less thermal energy is needed, thereby saving energy and reducing the production cost of the electrical connector. Moreover, the insulating body does not need to be heated, thus preventing the insulating body from being warped and deformed due to heat.
Method for manufacturing induction coil assembly
A method for manufacturing an induction coil assembly is disclosed. The method includes preparing a Computer Aided Design (CAD) model of an induction coil. The method further includes communicating the CAD model of the induction coil with a Three Dimensional (3D) printing machine The method further includes operating the 3D printing machine to deposit a plurality of layers of copper material one above other to manufacture the induction coil corresponding to the CAD model. The method further includes forming at least one hole in an annular member of the induction coil to receive a coolant and at least one hole in a first leg and a second leg to discharge the coolant.
SOLDERING SYSTEM, CONTROL DEVICE, CONTROL METHOD, AND PROGRAM
A soldering system includes a temperature measurement device that measures a temperature distribution of a surface of a substrate. The soldering system also includes a driver that drives the soldering system based on a control parameter obtained from the temperature distribution measured by the temperature measurement device.
SOLDERING SYSTEM, CONTROL DEVICE, CONTROL METHOD, AND PROGRAM
A soldering system includes a temperature measurement device that measures a temperature distribution of a surface of a substrate. The soldering system also includes a driver that drives the soldering system based on a control parameter obtained from the temperature distribution measured by the temperature measurement device.