B23K1/002

Method and apparatus for manufacturing a brazed heat exchanger
20190217409 · 2019-07-18 · ·

A method and apparatus for manufacturing a brazed heat exchanger. The method includes the steps of: assembling the heat exchanger components to form at least one unbrazed heat exchanger core in a core builder machine; without removing the at least one heat exchanger core from the core builder machine, enclosing the heat exchanger core with a brazing tool arrangement adapted to form a chamber, optionally, evacuating the chamber and/or filling the chamber with a controlled atmosphere; brazing the heat exchanger core in the chamber to form a brazed heat exchanger.

Method and apparatus for manufacturing a brazed heat exchanger
20190217409 · 2019-07-18 · ·

A method and apparatus for manufacturing a brazed heat exchanger. The method includes the steps of: assembling the heat exchanger components to form at least one unbrazed heat exchanger core in a core builder machine; without removing the at least one heat exchanger core from the core builder machine, enclosing the heat exchanger core with a brazing tool arrangement adapted to form a chamber, optionally, evacuating the chamber and/or filling the chamber with a controlled atmosphere; brazing the heat exchanger core in the chamber to form a brazed heat exchanger.

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR

An electronic device includes an injection mold including a mounting part and a wiring groove, a plated wiring plated on the wiring groove, and an electronic element mounted on the mounting part and electrically connected to the plated wiring, wherein the plated wiring is plated on an outer region of the injection mold, and the electronic element mounted on the injection mold dispensed on the plated wiring.

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR

An electronic device includes an injection mold including a mounting part and a wiring groove, a plated wiring plated on the wiring groove, and an electronic element mounted on the mounting part and electrically connected to the plated wiring, wherein the plated wiring is plated on an outer region of the injection mold, and the electronic element mounted on the injection mold dispensed on the plated wiring.

Exhaust system

An exhaust gas system includes a first exhaust component and a second exhaust component that are spaced apart from each other by a solder gap that can be has great as 1.20 mm. A high temperature solder material is provided near the solder gap and is heated by an inductor to form an induction solder joint between the first and second exhaust components.

Exhaust system

An exhaust gas system includes a first exhaust component and a second exhaust component that are spaced apart from each other by a solder gap that can be has great as 1.20 mm. A high temperature solder material is provided near the solder gap and is heated by an inductor to form an induction solder joint between the first and second exhaust components.

Method and apparatus for forming a vehicle window assembly using induction soldering

Induction soldering via an assembly fixture is utilized to bond one or more items of hardware to a vehicle window to form a vehicle window assembly. A method of operating the assembly fixture to bond the one or more items of hardware to a vehicle window by induction soldering is also an aspect of the invention.

Method and apparatus for forming a vehicle window assembly using induction soldering

Induction soldering via an assembly fixture is utilized to bond one or more items of hardware to a vehicle window to form a vehicle window assembly. A method of operating the assembly fixture to bond the one or more items of hardware to a vehicle window by induction soldering is also an aspect of the invention.

Low temperature high reliability alloy for solder hierarchy

A lead-free, antimony-free solder alloy_suitable for use in electronic soldering applications. The solder alloy comprises (a) from 1 to 4 wt. % silver; (b) from 0.5 to 6 wt. % bismuth; (c) from 3.55 to 15 wt. % indium, (d) 3 wt. % or less of copper; (e) one or more optional elements and the balance tin, together with any unavoidable impurities.

Low temperature high reliability alloy for solder hierarchy

A lead-free, antimony-free solder alloy_suitable for use in electronic soldering applications. The solder alloy comprises (a) from 1 to 4 wt. % silver; (b) from 0.5 to 6 wt. % bismuth; (c) from 3.55 to 15 wt. % indium, (d) 3 wt. % or less of copper; (e) one or more optional elements and the balance tin, together with any unavoidable impurities.