Patent classifications
B23K1/002
Induction curing of cell-based structural arrays
Adhesive bondlines in a cell-based structural array are thermally cured using tooling blocks inserted into the cells. The tooling blocks have embedded susceptors that are inductively heated by an alternating electromagnetic field generated by an electromagnet.
Induction curing of cell-based structural arrays
Adhesive bondlines in a cell-based structural array are thermally cured using tooling blocks inserted into the cells. The tooling blocks have embedded susceptors that are inductively heated by an alternating electromagnetic field generated by an electromagnet.
PTC Heating Cell and Method for Manufacturing the Same
A method is provided for manufacturing a PTC heating cell with at least one PTC element and contact elements which are made of an electrically conductive material, which are electrically conductively abutted against the PTC element, and which are connected to the PTC element and a corresponding heating cell. In order to improve heat extraction and the connection between the contact element and the PTC element, the contact elements are connected to the PTC element by induction soldering. Also disclosed is a PTC cell in which there is only solder of the solder connection between the thermistor material of the PTC element and the contact element.
PTC Heating Cell and Method for Manufacturing the Same
A method is provided for manufacturing a PTC heating cell with at least one PTC element and contact elements which are made of an electrically conductive material, which are electrically conductively abutted against the PTC element, and which are connected to the PTC element and a corresponding heating cell. In order to improve heat extraction and the connection between the contact element and the PTC element, the contact elements are connected to the PTC element by induction soldering. Also disclosed is a PTC cell in which there is only solder of the solder connection between the thermistor material of the PTC element and the contact element.
DUAL-WALLED COMPONENTS FOR A GAS TURBINE ENGINE
An assembly for a dual-walled component of a gas turbine engine and methods of forming and repairing a dual-walled component. The assembly includes a cold section part having an outer surface that defines a plurality of impingement apertures, a hot section part including a pre-sintered preform, the hot section part positioned over the outer surface of the cold section part, and a plurality of support structures including the pre-sintered preform, the plurality of support structures positioned between the hot section part and the cold section part, the plurality of support structures separating the hot section part from the cold section part to define at least one cooling channel therebetween.
METHOD FOR PRODUCING A COMPONENT OF A SLIDING BEARING, AND COMPONENT, SLIDING BEARING AND TRANSMISSION OF A WIND TURBINE
A method for producing a component of a sliding bearing includes a) providing a metal bolt with a cylindrical lateral surface and two end faces; b) coating the lateral surface of the bolt with a soldering flux or solder material; c) providing a metal sheet made of bronze and forming it into a cylindrical sleeve having a longitudinal slot, wherein a first side of the metal sheet forming an inside is coated with a solder material or a soldering flux before or after the forming process, either the lateral surface of the bolt or the inside of the sleeve having soldering flux; d) sliding the sleeve onto the lateral surface of the bolt; e) integrally bonding the lateral surface and the sleeve soldering; f) optionally closing the longitudinal slot by welding; and g) optionally machining a second side of the metal sheet facing away from the bolt.
LEAD-FREE AND ANTIMONY-FREE TIN SOLDER RELIABLE AT HIGH TEMPERATURES
A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises from 3.5 to 4.5 wt.% of silver, 2.5 to 4 wt.% of bismuth, 0.3 to 0.8 wt.% of copper, 0.03 to 1 wt.% nickel, 0.005 to 1 wt.% germanium, and a balance of tin, together with any unavoidable impurities.
LEAD-FREE AND ANTIMONY-FREE TIN SOLDER RELIABLE AT HIGH TEMPERATURES
A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises from 3.5 to 4.5 wt.% of silver, 2.5 to 4 wt.% of bismuth, 0.3 to 0.8 wt.% of copper, 0.03 to 1 wt.% nickel, 0.005 to 1 wt.% germanium, and a balance of tin, together with any unavoidable impurities.
INDUCTION HEATING SYSTEMS
An induction cooking system includes a first container that receives first contents and a second container sized to fit within the first container. The second container is composed of a ferromagnetic material such that the second container is heated in response to received electromagnetic radiation. An exterior surface of the second container is in contact with the first contents of the first container, and an interior surface of the second container is in contact with second contents placed within the second container.
INDUCTION HEATING SYSTEMS
An induction cooking system includes a first container that receives first contents and a second container sized to fit within the first container. The second container is composed of a ferromagnetic material such that the second container is heated in response to received electromagnetic radiation. An exterior surface of the second container is in contact with the first contents of the first container, and an interior surface of the second container is in contact with second contents placed within the second container.