B23K1/005

Techniques for bonding multiple semiconductor lasers

Embodiments of the present disclosure include method for sequentially mounting multiple semiconductor devices onto a substrate having a composite metal structure on both the semiconductor devices and the substrate for improved process tolerance and reduced device distances without thermal interference. The mounting process causes “selective” intermixing between the metal layers on the devices and the substrate and increases the melting point of the resulting alloy materials.

TERMINAL FIXING METHOD
20220181832 · 2022-06-09 · ·

A terminal fixing method, for fixing one or more terminals to a plurality of lands provided on a substrate by laser welding, includes: constructing the plurality of lands by one or more terminal installation lands on which the terminals are installed and one or more dummy lands each larger than each of the terminal installation lands; irradiating each of divided laser beams emitted from a laser oscillator toward a corresponding land of two or more lands in the plurality of lands by the laser welding; and constructing the two or more lands by two or more terminal installation lands in the terminal installation lands, or one or more terminal installation lands in the terminal installation lands and the one or more dummy lands.

Laser soldering system

A laser soldering system is disclosed. The laser soldering system has a moving system, a gripper mounted on the moving system, a presser mounted on the moving system and having a transparent member, and a laser. The gripper grips an object and places the object at a target location on a product to be soldered. The transparent member presses the object against the product. The laser emits a laser beam through the transparent member to solder the object to the target location while the object is pressed against the product.

METHOD FOR MANUFACTURING HETEROMETALLIC ASSEMBLY AND HETEROMETALLIC ASSEMBLY

A method for manufacturing a dissimilar metal joint product includes: spraying a metal powder capable of being joined to a steel material to at least a part of a surface of an aluminum or aluminum-alloy material at a low temperature and at a high speed to form a coating thereon; disposing the aluminum or aluminum-alloy material and the steel material such that the coating and the steel material face each other; and performing brazing using a brazing material or welding using a welding material between the coating and the steel material.

Method and device for producing and filling containers
11345073 · 2022-05-31 · ·

An apparatus for transforming a preform into a container filled with liquid filling material includes a mold that forms a mold head, a sterilization system, a chamber that is common to a group of mold heads, an evacuation system that is connected to the chamber, and conduit lines, each of which connects a mold head to the chamber. The sterilization system sterilizes the interior of the preform while it is in sealing engagement with the mold head. The evacuation system creates a vacuum in the preform. Liquid filling material enters the preform under pressure and causes it to transform into a container.

METHOD FOR REPAIRING SOLDER JOINT LEAKAGES AND WELDING OR SOLDERING APPARATUS FOR CARRYING OUT THE METHOD

A method for repairing solder joint leakages on a connection unit designed to feed cooling water into hollow metallic stator bars of a stator winding of an electrical machine. A welding or soldering apparatus is designed for carrying out the method.

DEVICE AND METHOD FOR REEL-TO-REEL LASER REFLOW
20220157769 · 2022-05-19 ·

The present invention relates to a reel-to-reel layer reflow method, which emits a uniformized laser beam, which can easily adjust the emission area, and which is for the purpose of improving productivity. An embodiment of the present invention provides a reel-to-reel layer reflow method comprising the steps of: a) transferring a substrate, which has been wound in a roll type, to one side while unwinding the same; b) forming a solder portion on the substrate; c) seating an emission target element on the solder portion and seating a non-emission target element on the substrate; d) surface-emitting a laser beam to the solder portion, on which the emission target element is seated, such that the emission target element is attached to the substrate; e) inspecting the substrate structure manufactured through said step d); and f) winding the substrate structure in a roll type.

Laser reflow apparatus and method for electronic components with micron-class thickness
20220157768 · 2022-05-19 ·

Provided is a laser reflow apparatus for reflowing electronic components on a substrate disposed on a stage, the apparatus including: a laser emission unit comprised of a plurality of laser modules for emitting a laser beam having a flat top output profile in at least one section of the substrate on which the electronic components are disposed; a camera unit comprising at least one camera module for capturing a reflowing process of the electronic components performed by the laser beam; and a laser output control unit configured to generate a control signal for independently controlling the respective laser modules of the laser emission unit based on a signal output from the camera unit and apply the control signal to the laser emission unit.

LASER BRAZING SYSTEM

Provided is a laser brazing system that can collectively control a robot and devices such as a laser oscillator and a wire feeding device and that can also collectively display the state of the robot and the state of the devices. A laser brazing system 1 that comprises a gas supply device 16, a wire feeding device 17, a laser oscillator 15, a robot 12 that supports a wire feeding nozzle 14 and a laser processing head 13 on the tip of an arm 121, and a robot control device 10 that controls the robot 12. In addition to the robot 12, the robot control device 10 of the laser brazing system 1 controls the wire feeding device 17, the gas supply device 16, and the laser oscillator 15 and has an operation panel 11 that includes a display unit 112 that can display the state of at least one of the wire feeding device 17, the gas supply device 16, and the laser oscillator 15.

Device for working a surface of a workpiece by means of a laser beam and method for operating the device
11731216 · 2023-08-22 · ·

The invention relates to a device (2) for working a surface (4) of a workpiece (6) by means of a laser beam (8), comprising a laser system (12) for providing the laser beam (8) and a plasma nozzle (14), which is designed to produce an atmospheric plasma jet (16), wherein the plasma nozzle (14) has a nozzle opening (24, 24′), from which a plasma jet (8) produced in the plasma nozzle (24, 24′) exits during operation, wherein the laser system (12) and the plasma nozzle (14) are arranged in relation to each other and designed in such a way that, during operation, the laser beam (8) exits from the nozzle opening (24, 24′) of the plasma nozzle (14) together with the plasma jet (16). The invention further relates to an assembly (100) having such a device and to a method for operating said device (2).