An article of manufacture comprises a first component having a first mating surface and a second component having a second mating surface. The first component may include an aperture having internal splines or gear teeth, and/or an outer perimeter having external splines or gear teeth. The first and second components are disposed such that a gap is provided between the first and second mating surfaces. Brazing material is disposed between the first and second mating surfaces so as to mechanically couple the first and second components. The first component may be made of a powdered metal or a non-powdered metal, and the second component may be made of the other of such two metals. In one embodiment, the first component may be a planetary carrier plate portion having internal splines and the second component may be a planetary carrier spider portion.

A laser bonding system which improves bonding between a semiconductor chip and a substrate is provided. A laser bonding system comprises a laser bonding apparatus; and a controller configured to control the laser bonding apparatus, wherein the laser bonding apparatus includes a stage which supports a substrate including a pad, and a semiconductor chip including a connection terminal; a pressurizer which moves up and down above the stage; a temperature measuring sensor configured to measure a temperature of the semiconductor chip and generate a temperature value; and a laser radiation apparatus configured to bond a pad of the substrate and a connection terminal of the semiconductor chip, using a laser beam passing through the pressurizer, and the controller lifts the pressurizer in response to the temperature value.

Methods of reflowing electrically conductive elements on a wafer may involve directing a laser beam toward a region of a surface of a wafer supported on a film of a film frame to reflow at least one electrically conductive element on the surface of the wafer. In some embodiments, the wafer may be detached from a carrier substrate and be secured to the film frame before laser reflow. Apparatus for performing the methods, and methods of repairing previously reflowed conductive elements on a wafer are also disclosed.

A method and structure are provided for implementing manufacture of a printed circuit board (PCB) with one of an infrared (IR) reflective mask or a novel solder mask to minimize coefficient of thermal expansion (CTE) mismatch between PCB laminate and plated through hole (PTH) copper. At least one of an IR-reflective mask and a solder mask composition for use in IR reflow processes is created such that radiant heat is reflected away from the major portion of the PCB yet permitted to impinge upon the PTHs. The copper within the PTH expands due to radiant heating while the bulk laminate expansion is significantly reduced due to the reflected IR radiation. Consequently, the CTE mismatch is minimized and tensile strain of the copper in the PTH is reduced, providing enhanced reliability.

The present invention relates to a method for process control in laser material processing and provides a method for process control and regulation in laser material processing, comprising generating at least two ST individual diagrams in the regions of interest of images of laser material processing and orienting the at least two ST individual diagrams in a previously determined pattern

Provided is an apparatus for attaching semiconductor parts. The apparatus includes a substrate loading unit, at least one semiconductor part loader, a first vision examination unit, at least one semiconductor part picker, at least one adhesive hardening unit, and a substrate unloading unit, wherein the substrate loading unit supplies a substrate on which semiconductor units are arranged, the at least one semiconductor part loader supplies semiconductor parts, the first vision examination unit examines arrangement states of the semiconductor units, the at least one semiconductor part picker mounts semiconductor parts in the semiconductor units, the at least one adhesive hardening unit hardens and attaches adhesives interposed between the semiconductor units and the semiconductor parts, and the substrate unloading unit releases the substrate on which semiconductor parts are mounted. The adhesive hardening units restrictively transmit a heat source only to at least one semiconductor unit, which is to be hardened.

There is provided a tool blade, comprising a backing strip particles of abrasive material and a binder layer of binding material which binds the abrasive particles along an edge of the backing strip, wherein the edge of the backing strip is pre-formed with teeth, on which the abrasive particles are bound by the binding material. A profiled cutting portion extends beyond the pre-formed teeth. The pre-formed teeth are shaped as generally triangular waves or are flattened at least partially along an upper edge on which the cutting portion is at least partially disposed. A method of making such a blade is also provided.

The disclosure discloses a manufacturing method of tempered vacuum glass, comprising the following steps: (1) manufacturing metalized layers, and performing tempering or thermal enhancement on the glass substrates; (2) placing a metal solder on the metalized layers; (3) superposing the glass substrates to form a tempered glass assembly; (4) heating the tempered glass assembly to 60-230° C.; (5) keeping the tempered glass assembly within the heating temperature range of step (4) in a vacuum chamber, and vacuumizing the vacuum chamber to a preset vacuum degree; and (6) hermetically sealing the metalized layers by adopting a metal brazing process. By adopting the manufacturing method of the disclosure, the stress when the two glass substrates are sealed can be greatly reduced, and the connection strength can be increased; moreover, when gas is exhausted within the temperature range, the exhaust efficiency is high, and the exhaust effect is better, vacuum glass with high vacuum degree can be obtained, and the service life of the vacuum glass is prolonged. The disclosure further discloses a tempered vacuum glass production line based on the above mentioned manufacturing method.

The present invention provides a method for producing a solar cell module; the present invention is characterized in that: in the process of soldering and connecting crystalline silicon solar cells, the crystalline silicon solar cells are kept still at positions on a bottom layer, and soldering and connecting of all crystalline silicon solar cells are implemented by moving a soldering apparatus or by moving the bottom layer; by means of the method for soldering and connecting crystalline silicon solar cells in the present invention, the process of soldering and connecting crystalline silicon solar cells is simplified and accelerated, and meanwhile, problems such as hidden fractures and power attenuation of the module occurring in the process of soldering and connecting solar cells are resolved.

A method for repairing a test contact arrangement in which a test contact which is disposed on a test contact carrier by means of solder material and is incorrectly positioned is gripped at a body edge by means of a gripping tool in a gripping contact phase, an absorption surface which is realized on an outer surface of the gripping tool is treated with laser radiation during the gripping contact phase, and the gripping tool performs a movement on at least one axis when the temperature is at the softening point of the solder material, in such a manner that the incorrect position is corrected by means of the movement to bring the test contact into a desired position.