A solder device includes a light source, a solder module, an optical guiding assembly, a sensor and a feedback controller. The light source emits waveband light guided to a to-be-soldered area for heating. The optical guiding assembly is disposed between the light source and the solder module, and the waveband light is guided to the solder module by the optical guiding assembly. The sensor is disposed on another side of the optical guiding assembly for receiving a sensing light beam and then generating a sensing signal. The sensing light beam is guided to the sensor by the optical guiding assembly. The feedback controller is connected with the sensor and the light source for receiving the sensing signal and then controlling the light source. The optical guiding assembly, the sensor and the feedback controller are integrated as a system controller. Therefore, the volume and weight of the solder module are compacted.

A method of producing a solderable aluminum contact comprises formulating an ink, applying the ink to an aluminum substrate to form an ink layer on a surface of the aluminum substrate, and melting the ink layer. The ink includes a solderable element that is conductive. The melting of the ink layer forms an alloy on the surface of the aluminum substrate including the solderable element.

Embodiments relate to using flux or underfill as a trapping layer for temporarily attaching light emitting diodes (LEDs) to a substrate and heating to simultaneously bond multiple LEDs onto the substrate. The flux or underfill may be selectively coated at the ends of electrodes of the LEDs prior to placing the LEDs on the substrate. Due to adhesive properties of the flux or underfill, multiple LEDs can be placed on and attached to the substrate prior to performing the bonding process. Once LEDs are placed on the substrate, the flux or underfill facilitates formation of metallic contacts between electrodes of the LED and contacts of the substrate during the bonding process. By using the flux or underfill, the formation of metallic contacts can be performed even without applying pressure.

A bonding structure of dissimilar metal members, including a first metal member, a second metal member, and a brazing filler metal, wherein the brazing filler metal bonds a bonding end surface of the first metal member and a bonding end surface of the second metal member, and any one or both of the following conditions (1) and (2) are satisfied: (1) at least a part of the bonding end surface of the first metal member in a thickness direction of the first metal member is an inclined surface inclined with respect to a plane perpendicular to the thickness direction of the first metal member, and (2) at least a part of the bonding end surface of the second metal member in a thickness direction of the second metal member is an inclined surface inclined with respect to a plane perpendicular to the thickness direction of the second metal member.

A bonding structure of dissimilar metal members, including a first metal member, a second metal member, and a brazing filler metal, wherein the brazing filler metal bonds a bonding end surface of the first metal member and a bonding end surface of the second metal member, and any one or both of the following conditions (1) and (2) are satisfied: (1) at least a part of the bonding end surface of the first metal member in a thickness direction of the first metal member is an inclined surface inclined with respect to a plane perpendicular to the thickness direction of the first metal member, and (2) at least a part of the bonding end surface of the second metal member in a thickness direction of the second metal member is an inclined surface inclined with respect to a plane perpendicular to the thickness direction of the second metal member.

In some embodiments, a method may bond titanium to an intermediate alloy. The method may include layering a portion of an intermediate alloy onto a portion of titanium. The method may include focusing a controlled heat source on a spot of the intermediate alloy to form a weld pool in the intermediate alloy at the spot. The method may include superheating the intermediate alloy in the weld pool above the melting point of the intermediate alloy but below the melting point of titanium such that liquid intermediate alloy contacts the surface of the portion of the titanium heating the portion of the titanium. The method may include diffusing the portions of titanium and intermediate alloy together such that upon the intermediate alloy cooling below the melting point of the intermediate alloy the portions of the intermediate alloy and titanium are bonded forming a weldment.

A method comprising applying braze to a joint location of two work pieces and applying local heating to the joint location of the two work pieces until braze melting temperature is achieved to melt the braze while maintaining temperature of more remote portions of each work piece. The method includes reducing heating of the braze to form a braze joint joining the joint location of the two work pieces.

A method for curing solder paste on a thermally fragile substrate is disclosed. An optically reflective layer and an optically absorptive layer are printed on a thermally fragile substrate. Multiple conductive traces are selectively deposited on the optically reflective layer and on the optically absorptive layer. Solder paste is then applied on selective locations that are corresponding to locations of the optically absorptive layer. After a component has been placed on the solder paste, the substrate is irradiated from one side with uniform pulsed light. The optically absorptive layer absorbs the pulsed light and becomes heated, and the heat is subsequently transferred to the solder paste and the component via thermal conduction in order to heat and melt the solder paste.

A method for curing solder paste on a thermally fragile substrate is disclosed. An optically reflective layer and an optically absorptive layer are printed on a thermally fragile substrate. Multiple conductive traces are selectively deposited on the optically reflective layer and on the optically absorptive layer. Solder paste is then applied on selective locations that are corresponding to locations of the optically absorptive layer. After a component has been placed on the solder paste, the substrate is irradiated from one side with uniform pulsed light. The optically absorptive layer absorbs the pulsed light and becomes heated, and the heat is subsequently transferred to the solder paste and the component via thermal conduction in order to heat and melt the solder paste.

Embodiments relate to using flux or underfill as a trapping layer for temporarily attaching light emitting diodes (LEDs) to a substrate and heating to simultaneously bond multiple LEDs onto the substrate. The flux or underfill may be selectively coated at the ends of electrodes of the LEDs prior to placing the LEDs on the substrate. Due to adhesive properties of the flux or underfill, multiple LEDs can be placed on and attached to the substrate prior to performing the bonding process. Once LEDs are placed on the substrate, the flux or underfill facilitates formation of metallic contacts between electrodes of the LED and contacts of the substrate during the bonding process. By using the flux or underfill, the formation of metallic contacts can be performed even without applying pressure.