A method for fabrication includes providing a donor sheet, including a donor substrate, which is transparent in a specified spectral range, a sacrificial layer, which absorbs optical radiation within the specified spectral range and is disposed over the donor substrate, and a donor film, which includes a paste and is disposed over the sacrificial layer. The donor sheet is positioned so that the donor film is in proximity to a target location on an acceptor substrate. A pulsed laser beam impinges on the sacrificial layer with a pulse energy and spot size selected so as to ablate the sacrificial layer, thus causing a viscoelastic jet of the paste to be ejected from the donor film and to deposit, at the target location on the acceptor substrate, a dot having a diameter less than the spot size of the laser beam.

In one example, a system comprises a laser assisted bonding (LAB) tool. The LAB tool comprises a stage block and a first lateral laser source facing the stage block from a lateral side of the stage block. The stage block is configured to support a substrate and a first electronic component coupled with the substrate, and the first electronic component comprises a first interconnect. The first lateral laser source is configured to emit a first lateral laser beam laterally toward the stage block to induce a first heat on the first interconnect to bond the first interconnect with the substrate. Other examples and related methods are also disclosed herein.

A method and system for heat bonding a chip to a substrate by means of heat bonding material disposed there between. At least the substrate is preheated from an initial temperature to an elevated temperature below a damage temperature of the substrate. A light pulse applied to the chip momentarily increases the chip temperature to a pulsed peak temperature below a peak damage temperature of the chip. The momentarily increased pulsed peak temperature of the chip causes a flow of conducted heat from the chip to the bonding material, causing the bonding material to form a bond.

A method and system for heat bonding a chip to a substrate by means of heat bonding material disposed there between. At least the substrate is preheated from an initial temperature to an elevated temperature below a damage temperature of the substrate. A light pulse applied to the chip momentarily increases the chip temperature to a pulsed peak temperature below a peak damage temperature of the chip. The momentarily increased pulsed peak temperature of the chip causes a flow of conducted heat from the chip to the bonding material, causing the bonding material to form a bond.

A method for producing a component by brazing and a related component are disclosed. The component may include a first part, a second part and a third part, wherein the first part includes a first junction part, the second part includes a second junction part and a cross junction part, and the third part includes a third junction part, and wherein the third junction part has a part and a remaining part. In an embodiment the method includes coupling the first part and the second part to each other by performing a preceding weld in a state of overlapping a part of the first junction part and the second junction part and, after performing the preceding weld, coupling the first part, the second part, and the third part to each other by performing a following weld.

The control device includes a brazing controller configured to control a brazing material moving mechanism so as to retract a tip of a brazing material from a heating position to interrupt the brazing, during execution of the brazing, and a movement controller configured to, when the brazing is interrupted, control a movement machine so as to retract a heating device or a base material in a direction opposite to a movement direction during the execution of the brazing, and subsequently advance the heating device or the base material in the movement direction again. The brazing controller resumes the brazing by controlling the brazing material moving mechanism so as to cause the tip of the brazing material to reach the heating position at the same time when the heating device or the base material advanced by the movement controller reaches an interruption position at which the brazing is interrupted.

A method for soldering electronic components includes providing a circuit substrate; providing a plurality of electronic components; placing the plurality of electronic components onto the circuit substrate; applying a conductor between the plurality of electronic components and the circuit substrate; providing an energy source which projects an energy beam with a first coverage; enlarging the energy beam and projecting the energy beam onto the circuit substrate with a second coverage; and melting the conductor within the second coverage via the energy beam and fixing the corresponding electronic components on the circuit substrate through the melted conductor. Besides, a method for manufacturing a LED display is disclosed.

Embodiments of the present disclosure include method for sequentially mounting multiple semiconductor devices onto a substrate having a composite metal structure on both the semiconductor devices and the substrate for improved process tolerance and reduced device distances without thermal interference. The mounting process causes “selective” intermixing between the metal layers on the devices and the substrate and increases the melting point of the resulting alloy materials.

The present invention provides a laser soldering device including a transfer unit configured to transfer a plurality of objects, a solder unit configured to operate under control of the controller to solder the object positioned on the transfer unit, and form a bonding surface by performing the soldering by a laser beam, and at least one nozzle unit in which a solder ball to which the laser beam is irradiated is accommodated, in which the laser beam irradiated from the solder unit is eccentric with respect to a center line of the solder ball and adjusted to be irradiated.

A solder device includes a light source, a solder module, an optical guiding assembly, a sensor and a feedback controller. The light source emits waveband light guided to a to-be-soldered area for heating. The optical guiding assembly is disposed between the light source and the solder module, and the waveband light is guided to the solder module by the optical guiding assembly. The sensor is disposed on another side of the optical guiding assembly for receiving a sensing light beam and then generating a sensing signal. The sensing light beam is guided to the sensor by the optical guiding assembly. The feedback controller is connected with the sensor and the light source for receiving the sensing signal and then controlling the light source. The optical guiding assembly, the sensor and the feedback controller are integrated as a system controller. Therefore, the volume and weight of the solder module are compacted.