System and methods for solder flux removal from a gas stream is disclosed. In one aspect, the system includes: a scrubber chamber having a gas inlet and a gas outlet through which the gas stream is introduced into and withdrawn from the scrubber chamber; at least one rinse agent delivery mechanism for introducing a rinse agent into the scrubber chamber for contact with the gas stream, the rinse agent being at a temperature for condensing a first portion of the flux from the gas stream; a condenser portion of the scrubber chamber containing the rinse agent for receiving the gas stream, the rinse agent being at a temperature for condensing a second portion of the flux in the gas stream; and a condensed flux removal apparatus adapted for removal from the scrubber chamber of at least a portion of the rinse agent and the flux which has condensed.

A method according to the invention for producing a connection between two surfaces or surface sections of two ceramic parts comprises: provision of a first ceramic part and of a second ceramic part; provision of an active brazing solder material on at least one surface section of at least one of the ceramic parts; and heating the active brazing solder in a vacuum brazing process. The whole active brazing solder material is provided for connecting the first and the second ceramic part by a sputtering method, wherein at least one surface section of at least one of the ceramic parts, preferably of the two ceramic parts, is layered with a layer sequence of individual components of the active brazing solder material, wherein the average strength of the layers of an individual component of the active brazing solder is no more than 0.5%, in particular not more than 0.2%, preferably not more than 0.1% and especially preferably not more than 0.05% of the strength of the joining region.

A component includes a magnetic core having a body formed of a first material, defining a first opening and a second opening thereon. A duct formed of a second material extends at least partially through the body between the first opening and the second opening. The first opening and the second opening are in fluid communication by way of the duct.

A method for assembling a set including an inner wall, a shrouded outer wall and an intermediate element, each presenting substantially circular sections, the shrouded outer wall presenting a shape substantially complementary to a shape of outer and inner surfaces of the intermediate element, and whose inner surface covers the outer surface of the intermediate element. In particular, the method includes a step of placing a brazing sheet, whose melting temperature is lower than melting temperatures of other elements of the set, over an assembly surface in contact with another assembly surface, and a step of heating, by a furnace, a set including the outer or inner walls and the intermediate element between which is interposed a brazing sheet so as to fix the outer or inner wall by brazing on the intermediate element.

A method for assembling a set including an inner wall, a shrouded outer wall and an intermediate element, each presenting substantially circular sections, the shrouded outer wall presenting a shape substantially complementary to a shape of outer and inner surfaces of the intermediate element, and whose inner surface covers the outer surface of the intermediate element. In particular, the method includes a step of placing a brazing sheet, whose melting temperature is lower than melting temperatures of other elements of the set, over an assembly surface in contact with another assembly surface, and a step of heating, by a furnace, a set including the outer or inner walls and the intermediate element between which is interposed a brazing sheet so as to fix the outer or inner wall by brazing on the intermediate element.

An improved method for forming a capacitor is provided as is a capacitor, or electrical component, formed by the method. The method includes providing an aluminum containing anode with an aluminum oxide dielectric thereon; forming a cathode on a first portion of the aluminum oxide dielectric; bonding an anode lead to the aluminum anode on a second portion of the aluminum oxide by a transient liquid phase sintered conductive material thereby metallurgical bonding the aluminum anode to the anode lead; and bonding a cathode lead to said cathode.

An improved method for forming a capacitor is provided as is a capacitor, or electrical component, formed by the method. The method includes providing an aluminum containing anode with an aluminum oxide dielectric thereon; forming a cathode on a first portion of the aluminum oxide dielectric; bonding an anode lead to the aluminum anode on a second portion of the aluminum oxide by a transient liquid phase sintered conductive material thereby metallurgical bonding the aluminum anode to the anode lead; and bonding a cathode lead to said cathode.

The present disclosure provides a plow blade edge device for mounting to a moldboard of a plow comprising at least one adapter blade including a bottom edge having selectively carbide insert(s) along at least a portion of the bottom edge. The disclosure further provides for a method of brazing the carbide insert(s) in a cavity along at least a portion of the bottom edge. The device further includes at least one wear block selectively reversible to present the adapter blade at a first angle or a second angle. The at least one wear block can include a bottom edge having a carbide insert along at least a portion of the bottom edge.

The present disclosure provides a plow blade edge device for mounting to a moldboard of a plow comprising at least one adapter blade including a bottom edge having selectively carbide insert(s) along at least a portion of the bottom edge. The disclosure further provides for a method of brazing the carbide insert(s) in a cavity along at least a portion of the bottom edge. The device further includes at least one wear block selectively reversible to present the adapter blade at a first angle or a second angle. The at least one wear block can include a bottom edge having a carbide insert along at least a portion of the bottom edge.

A material for Cu pillars is formed as cylindrical preforms in advance and connecting these cylindrical preforms to electrodes on a semiconductor chip to form Cu pillars. Due to this, it becomes possible to make the height/diameter ratio of the Cu pillars 2.0 or more. Since electroplating is not used, the time required for production of the Cu pillars is short and the productivity can be improved. Further, the height of the Cu pillars can be raised to 200 μm or more, so these are also preferable for moldunderfill. The components can be freely adjusted, so it is possible to easily design the alloy components to obtain highly reliable Cu pillars.