The invention enables quick evacuation of a chamber to a specified target degree of vacuum while increasing selectivity of evacuation conditions. A vacuum-processing device contains a chamber 40 that enables a workpiece to be soldered in a vacuum environment, an operating part 20 that sets a condition for evacuating the chamber 40, a pump 23 that evacuates the chamber 40, and a control portion 61 that calculates the amount of decrease in the degree of vacuum when evacuating the chamber 40 using a predetermined pump output, sets the calculated value as a reference value and switches an evacuation property from the evacuation property including a lower pump output to the evacuation property including a higher pump output when the calculated amount of decrease in degree of vacuum in real time has become smaller than the reference value.

The invention enables quick evacuation of a chamber to a specified target degree of vacuum while increasing selectivity of evacuation conditions. A vacuum-processing device contains a chamber 40 that enables a workpiece to be soldered in a vacuum environment, an operating part 20 that sets a condition for evacuating the chamber 40, a pump 23 that evacuates the chamber 40, and a control portion 61 that calculates the amount of decrease in the degree of vacuum when evacuating the chamber 40 using a predetermined pump output, sets the calculated value as a reference value and switches an evacuation property from the evacuation property including a lower pump output to the evacuation property including a higher pump output when the calculated amount of decrease in degree of vacuum in real time has become smaller than the reference value.

A brazing furnace (1) includes a preheating chamber (2) and a brazing chamber (3). The preheating chamber (2) includes: a vacuum pump (21) for reducing the pressure inside the preheating chamber (2) while a material to be processed (100) is housed therein; a preheating apparatus (22), which preheats the material to be processed (100) in a reduced-pressure atmosphere; and a gas introducing apparatus (23), which introduces inert gas into the preheating chamber (2) to restore the pressure inside the preheating chamber (2) after the preheating. The brazing chamber (3) includes: a gas-replacing apparatus (31), which introduces inert gas into the brazing chamber (3); and a main heating apparatus (32), which heats the material to be processed (100) to a brazing temperature while it is housed in the brazing chamber (3).

A brazing furnace (1) includes a preheating chamber (2) and a brazing chamber (3). The preheating chamber (2) includes: a vacuum pump (21) for reducing the pressure inside the preheating chamber (2) while a material to be processed (100) is housed therein; a preheating apparatus (22), which preheats the material to be processed (100) in a reduced-pressure atmosphere; and a gas introducing apparatus (23), which introduces inert gas into the preheating chamber (2) to restore the pressure inside the preheating chamber (2) after the preheating. The brazing chamber (3) includes: a gas-replacing apparatus (31), which introduces inert gas into the brazing chamber (3); and a main heating apparatus (32), which heats the material to be processed (100) to a brazing temperature while it is housed in the brazing chamber (3).

A soldering apparatus includes a reflow oven, a transmission mechanism, and a controlling unit. The reflow oven includes an inlet and an output mechanism. The output mechanism includes two guide rails and two link belts. An end of a first guide rail has a first alignment structure. The two link belts are movably disposed on the guide rails for outputting a printed wiring board. A distance between the guide rails is previously adjusted to be equal to a width of the printed wiring board. The transmission mechanism includes two tracks and two conveyor belts. An end of a first track has a second alignment structure. The two conveyor belts are movably disposed on the two tracks for transporting the printed wiring board. The controlling unit controls a movement of the first track, so that the first alignment structure and the second alignment structure are automatically aligned with each other.

A soldering apparatus includes a reflow oven, a transmission mechanism, and a controlling unit. The reflow oven includes an inlet and an output mechanism. The output mechanism includes two guide rails and two link belts. An end of a first guide rail has a first alignment structure. The two link belts are movably disposed on the guide rails for outputting a printed wiring board. A distance between the guide rails is previously adjusted to be equal to a width of the printed wiring board. The transmission mechanism includes two tracks and two conveyor belts. An end of a first track has a second alignment structure. The two conveyor belts are movably disposed on the two tracks for transporting the printed wiring board. The controlling unit controls a movement of the first track, so that the first alignment structure and the second alignment structure are automatically aligned with each other.

A method of manufacturing a semiconductor package including coating a flux on a connection pad provided on a first surface of a substrate, the flux including carbon nanotubes (CNTs), placing a solder ball on the connection pad coated with the flux, forming a solder layer attached to the connection pad from the solder ball through a reflow process, and mounting a semiconductor chip on the substrate such that the solder layer faces a connection pad in the semiconductor chip may be provided.

Disclosed are a method of manufacturing a non-slip plate and a non-slip plate manufactured thereby. The method includes preparing a base metal plate for joint design, washing and surface treatment, preparing a non-slip material, adhering the non-slip material to the bonding surface of the base metal plate to form a protrusion, and brazing the base metal plate having the non-slip material adhered thereto in a brazing furnace. The non-slip plate is applied to vehicles to impart non-slip performance thereto, and can be semi-permanently used.

A flux recovery device that recovers a flux component from a gaseous mixture. The flux recovery device includes a first water spray unit that sprays water into a gaseous mixture containing the flux component, a separation unit that includes an introduction port for introducing the gaseous mixture into which water is sprayed from the first water spray unit, and a second water spray unit that forms a precipitation flow inside of the separation unit. The separation unit uses a swirling flow to separate the flux component from the gaseous mixture. A condensation unit cools water vapor generated in the separation unit to change the water vapor to water droplets, thereby removing the water vapor. Water vapor generated in a separation unit is cooled by a condensation unit, recovered as water droplets, and reused.

A flux recovery device that recovers a flux component from a gaseous mixture. The flux recovery device includes a first water spray unit that sprays water into a gaseous mixture containing the flux component, a separation unit that includes an introduction port for introducing the gaseous mixture into which water is sprayed from the first water spray unit, and a second water spray unit that forms a precipitation flow inside of the separation unit. The separation unit uses a swirling flow to separate the flux component from the gaseous mixture. A condensation unit cools water vapor generated in the separation unit to change the water vapor to water droplets, thereby removing the water vapor. Water vapor generated in a separation unit is cooled by a condensation unit, recovered as water droplets, and reused.