A shield for shielding a portion of an electronic component from undesirable emissions from neighboring components. The shield comprises a metal body configured to be attached to a substrate, and solder selectively applied to a lower portion of the metal body in manner that allows for both location and volume of the solder to be controlled. A bond is created between the solder and the metal body. The bond may be a metallurgical bond created by proximity of the solder to the at least one leg and sufficient heat and time to bring the solder to a melting temperature of the solder; or a diffusion bond created by heat and pressure. A method of attaching the shield to the substrate is also described.

A shield for shielding a portion of an electronic component from undesirable emissions from neighboring components. The shield comprises a metal body configured to be attached to a substrate, and solder selectively applied to a lower portion of the metal body in manner that allows for both location and volume of the solder to be controlled. A bond is created between the solder and the metal body. The bond may be a metallurgical bond created by proximity of the solder to the at least one leg and sufficient heat and time to bring the solder to a melting temperature of the solder; or a diffusion bond created by heat and pressure. A method of attaching the shield to the substrate is also described.

A screen (24A-H) of a specified thickness (T) for insertion in a gap (32) between surfaces of workpieces (32, 34) to be joined by brazing. The screen thickness determines and maintains the gap thickness during brazing. The screen has a higher melting point than the braze filler material (22), is wettable by a melt of the braze filler material, and may have a higher tensile strength than the braze filler material at operating temperatures of the braze joint. The screen may include electrical resistance heating wires (52, 62) to melt the filler material (46). The screen may be covered by the filler material, forming a brazing foil (20B). The screen may include electrically conductive insulated wires (92, 93) connected to a sensor (95) such as a thermocouple or strain gauge to monitor a condition of the braze joint during subsequent operation.

A method includes forming a first tacking layer on a first connection partner, arranging a first layer on the first tacking layer, forming a second tacking layer on the first layer, arranging a second connection partner on the second tacking layer, heating the tacking layers and first layer, and pressing the first connection partner towards the second connection partner, with the first layer arranged between the connection partners, such that a permanent mechanical connection is formed between the connection partners. Either the tacking layers each include a second material evenly distributed within a first material, the second material being configured to act as or to release a reducing agent, or the tacking layers each include a mixture of at least a third material and a fourth material, the materials in the mixture chemically reacting with each other under the influence of heat such that a reducing agent is formed.

A tube used in a heat exchanger, wherein a tube body includes a curved end portion, a pair of parallel portions, a pair of inclination portions, and a fixed portion in which a long end part extending from one of the pair of inclination portions is bent to hold therebetween a short end part extending from the other of the pair of inclination portions, and the tube is a pipe member having a flattened shape in cross-section. Poor brazing is reduced by making the inclination angle of at least part of the other inclination portion with respect to the flat plate portion larger than that of the one inclination portion.

A tube used in a heat exchanger, wherein a tube body includes a curved end portion, a pair of parallel portions, a pair of inclination portions, and a fixed portion in which a long end part extending from one of the pair of inclination portions is bent to hold therebetween a short end part extending from the other of the pair of inclination portions, and the tube is a pipe member having a flattened shape in cross-section. Poor brazing is reduced by making the inclination angle of at least part of the other inclination portion with respect to the flat plate portion larger than that of the one inclination portion.

An example engine-driven power system includes: an engine; a generator configured to convert mechanical engine power to electrical power; first and second power subsystems configured to convert the mechanical or electrical power to first and second power outputs, wherein the first and second power subsystems are configurable to output the first and second power outputs simultaneously; an input device configured to control a load management priority, wherein the load management priority comprises at least one of an adjustable ranking, an adjustable balance, or bus voltage thresholds; and control circuitry configured to: control the first and second power subsystems to output the first and second power outputs based on first and second demands; and, in response to determining that a total demand exceeds a capacity, control the first or second power subsystems to reduce the power outputs or the demands based on the load management priority.

A heat-bonding apparatus and method of manufacturing a heat-bonded product without overheating during cooling thereof after the completion of the heat-bonding, where the object can be cooled in a shorter time than the conventional when the heat-bonding is performed in a vacuum. A heat-bonding apparatus having a vacuum chamber for housing an object to be heat-bonded and a buffer part, a heater for applying heat to the buffer part placed into contact with the object, an object temperature sensor for detecting a temperature of the object heated through the buffer part, a buffer temperature sensor for detecting a temperature of the buffer part, a vacuum breaker for breaking the vacuum, and a controller for operating the vacuum breaker to break the vacuum when a temperature difference between a temperature detected by the object temperature sensor and a temperature detected by the buffer temperature sensor falls within a range of specified temperature difference.

A heat-bonding apparatus and method of manufacturing a heat-bonded product without overheating during cooling thereof after the completion of the heat-bonding, where the object can be cooled in a shorter time than the conventional when the heat-bonding is performed in a vacuum. A heat-bonding apparatus having a vacuum chamber for housing an object to be heat-bonded and a buffer part, a heater for applying heat to the buffer part placed into contact with the object, an object temperature sensor for detecting a temperature of the object heated through the buffer part, a buffer temperature sensor for detecting a temperature of the buffer part, a vacuum breaker for breaking the vacuum, and a controller for operating the vacuum breaker to break the vacuum when a temperature difference between a temperature detected by the object temperature sensor and a temperature detected by the buffer temperature sensor falls within a range of specified temperature difference.

A soldered product manufacturing device 1 includes a stage 13 on which a substrate W is placed, solder being arranged on the substrate W; a cover 16 configured to cover at least an upper part of the substrate W placed on the stage 13 at a predetermined distance therefrom; a chamber 11 configured to house the stage 13 and the cover 16; a heater 15 configured to heat the substrate W on the stage 13; and a reducing gas supply device 19 configured to supply a reducing gas F. A method for manufacturing a soldered product includes, by using the soldered product manufacturing device 1, placing the substrate W on the stage 13; covering the substrate W placed on the stage 13 with the cover 16; heating the substrate W; and supplying the reducing gas F into the chamber 11.