A connector set is disclosed that includes a plurality of connectors and a cap to be attached to the plurality of connectors when the plurality of connectors are reflow-mounted on an external substrate. Each one end portion of the connectors and the cap is provided with a fitted portion and a fitting portion to be fitted in the fitted portion. The fitted portion is provided with an opening portion for moving the fitting portion so as to absorb thermal expansion from one end portion side to the other end portion side due to temperature conversion of reflow.

An exemplary method includes at a bonding temperature, bonding a semiconductor chip to an organic laminate substrate using solder; without cooldown from the bonding temperature to room temperature, at an underfill dispense temperature, dispensing underfill between the semiconductor chip and the organic laminate substrate; and curing the underfill within a range of temperatures above the underfill dispense temperature. Another exemplary method includes depositing a first solder on pads of an organic laminate substrate; contacting a second solder on pillars of a semiconductor chip to the first solder on the pads of the organic laminate substrate; and solder bonding the semiconductor chip to the organic laminate substrate.

A method of applying a braze component to a honeycomb structure may comprise: applying at least a partial vacuum within a chamber, the chamber defined at least partially by a vacuum device and a cover, the honeycomb structure disposed within the chamber, the braze component disposed between the honeycomb structure and the cover; pulling the cover towards the braze component in response to applying the partial vacuum; and pulling the braze component into a plurality of hexagonal cells defined by the honeycomb structure in response to pulling the cover towards the braze component.

A flux used for soldering with a tin-silver-copper alloy comprises an imidazole compound and/or an imidazoline compound; a dicarboxylic acid having 3 or more and 36 or less carbons; and a quaternary ammonium iodine salt. Relative to the total amount of the flux, the dicarboxylic acid content is 6 mass % or more and 25 mass % or less, and the iodine content is 200 ppm or more and 3600 ppm or less.

An aluminum alloy brazing sheet used for brazing in an inert gas atmosphere without using a flux includes a brazing material cladded onto at least one side surface of a core material. An oxide is formed on a surface of the aluminum alloy brazing sheet by brazing heating, the oxide including any one or two or more of Mg, Li, and Ca and having a volume change ratio of 0.990 or less to a surface oxide film formed before brazing heating, and an atomic molar ratio of Mg, Li, and Ca to Al in the oxide formed on the surface of the aluminum alloy brazing sheet before brazing heating is 0.50 or less. The present invention provides an aluminum alloy brazing sheet having excellent brazability in brazing in an inert gas atmosphere without using a flux, and a method for manufacturing the same.

Implementations of the disclosure are directed to a lead-free mixed solder powder paste suitable for low temperature to middle temperature soldering applications. The lead-free solder paste may consist of: an amount of a first solder alloy powder between 44 wt % and 83 wt %, the first solder alloy powder comprising Sn; an amount of a second solder alloy powder between 5 wt % to 44 wt %, the second alloy powder comprising Sn, where the first solder alloy powder has a liquidus temperature lower than a solidus temperature of the second solder alloy powder; and a remainder of flux. The solder paste may be used for reflow at a peak temperature below the solidus temperature of the higher solidus temperature solder powder but above the melting temperature of the lower solidus temperature one.

Implementations of the disclosure are directed to a lead-free mixed solder powder paste suitable for low temperature to middle temperature soldering applications. The lead-free solder paste may consist of: an amount of a first solder alloy powder between 44 wt % and 83 wt %, the first solder alloy powder comprising Sn; an amount of a second solder alloy powder between 5 wt % to 44 wt %, the second alloy powder comprising Sn, where the first solder alloy powder has a liquidus temperature lower than a solidus temperature of the second solder alloy powder; and a remainder of flux. The solder paste may be used for reflow at a peak temperature below the solidus temperature of the higher solidus temperature solder powder but above the melting temperature of the lower solidus temperature one.

The disclosure describes example techniques and assemblies for joining a first component and a second component. The techniques may include positioning the first and second component adjacent to each other to define a joint region between adjacent portions of the first component and the second component, the joint region being coated with an adhesion resistant coating. The techniques may also include positioning a braze material in the joint region, heating the braze material to form an at least softened material, and cooling the at least softened material to form a mechanical interlock including the braze material in the joint region joining the first and second components. The braze material does not metallurgically bond to the joint surface.

The disclosure describes example techniques and assemblies for joining a first component and a second component. The techniques may include positioning the first and second component adjacent to each other to define a joint region between adjacent portions of the first component and the second component, the joint region being coated with an adhesion resistant coating. The techniques may also include positioning a braze material in the joint region, heating the braze material to form an at least softened material, and cooling the at least softened material to form a mechanical interlock including the braze material in the joint region joining the first and second components. The braze material does not metallurgically bond to the joint surface.

A bonding tool for bonding a semiconductor element to a substrate on a bonding machine is provided. The bonding tool includes a body portion including a contact region for contacting the semiconductor element during a bonding process on the bonding machine. The bonding tool also includes a standoff extending from the body portion, and configured to contact the substrate during at least a portion of the bonding process.