A soldering tool, comprising nozzle shaped soldering tip and a hot gas feed channel that runs in the soldering tip, wherein the hot gas feed channel includes openings that provide a hot gas exhaust, and wherein the soldering tip as well as a portion of a soldering environment is heatable by the hot gas, characterized in that the soldering tip includes one or plural contact surfaces that have a surface structure which corresponds to a surface structure of a soldering object so that the soldering object is thermally contactable by the soldering tip with a minimum heat resistance, wherein a hot gas jet that passes through the openings is forced to perform at least one directional reversal or directional deflection by placement of the soldering tip and contacting the soldering object.

A thermal interface material and method of making the same includes growing a carbon nanotube array on a first substrate and brazing the distal ends of the carbon nanotube array to a second substrate using a braze material. In at least one embodiment, the braze material includes active elements. The method further includes performing the brazing process in an inert or vacuum atmosphere.

A thermal interface material and method of making the same includes growing a carbon nanotube array on a first substrate and brazing the distal ends of the carbon nanotube array to a second substrate using a braze material. In at least one embodiment, the braze material includes active elements. The method further includes performing the brazing process in an inert or vacuum atmosphere.

A reflow device configured to perform reflow soldering on a substrate having a first component and a second component having a heat capacity larger than a heat capacity of the first component. The reflow device includes a plurality of heating sections applying gas to the substrate, a booth accommodating the heating sections, and a controller configured to perform, at least twice or more times, a heating control of controlling the heating sections to increase both of a temperature of the first component and a temperature of the second component, and then reduce the temperature of the first component while increasing the temperature of the second component.

A reflow device configured to perform reflow soldering on a substrate having a first component and a second component having a heat capacity larger than a heat capacity of the first component. The reflow device includes a plurality of heating sections applying gas to the substrate, a booth accommodating the heating sections, and a controller configured to perform, at least twice or more times, a heating control of controlling the heating sections to increase both of a temperature of the first component and a temperature of the second component, and then reduce the temperature of the first component while increasing the temperature of the second component.

A heat transfer tube includes: a tube body made of an extruded material of an aluminum alloy having a composition including: 0.3 mass % or more and less than 0.8 mass % of Mn; more than 0.1 mass % and less than 0.32 mass % of Si; 0.3 mass % or less of Fe; 0.06 mass % or more and 0.3 mass % or less of Ti; and Al balance including inevitable impurities, a ratio of a Mn content to a Si content, Mn %/Si %, exceeding 2.5; and a Zn-containing layer provided to an outer surface of the tube body.

A heat transfer tube includes: a tube body made of an extruded material of an aluminum alloy having a composition including: 0.3 mass % or more and less than 0.8 mass % of Mn; more than 0.1 mass % and less than 0.32 mass % of Si; 0.3 mass % or less of Fe; 0.06 mass % or more and 0.3 mass % or less of Ti; and Al balance including inevitable impurities, a ratio of a Mn content to a Si content, Mn %/Si %, exceeding 2.5; and a Zn-containing layer provided to an outer surface of the tube body.

A connector structure used in pin in paste soldering includes a standoff region with dimensions that provide reflow air convection on at least two sides of a surface of the connector structure during Pin In Paste (PIP) soldering. For example, the standoff region has a depth or height of approximately 0.3 mm, a length of approximately 15.1 mm, and a width of approximately 4.95 mm. The standoff region can also have a depth or height in a range of 0.3 mm to 0.5 mm. The connector structure is a single or dual port connector structure with the standoff region configured as a void or gap proximate to the connector pins, which creates a reflow air convection gate way across a surface of the connector structure during PIP soldering.

A soldering apparatus, in particular a reflow soldering apparatus, for continuous soldering of printed circuit boards along a transport direction, having a process channel that includes a preheating zone, a soldering zone and a cooling zone, having a base body and a cover hood movable between a closed position and an open position, wherein nozzle plates, fan units with fan motors, air channels carrying the process gas, filter elements and/or cooling elements are provided in the base body. At least one fan unit is arranged in or on the base body laterally next to the process channel in the transport direction, and air channels are arranged and provided in such a manner that process gas is blown into the process channel during operation of the at least one fan unit, with the process gas directed through a filter element provided in a filter region after passing through the process channel, and the filtered process gas drawn in by the at least one fan unit.

A soldering apparatus, in particular a reflow soldering apparatus, for continuous soldering of printed circuit boards along a transport direction, having a process channel that includes a preheating zone, a soldering zone and a cooling zone, having a base body and a cover hood movable between a closed position and an open position, wherein nozzle plates, fan units with fan motors, air channels carrying the process gas, filter elements and/or cooling elements are provided in the base body. At least one fan unit is arranged in or on the base body laterally next to the process channel in the transport direction, and air channels are arranged and provided in such a manner that process gas is blown into the process channel during operation of the at least one fan unit, with the process gas directed through a filter element provided in a filter region after passing through the process channel, and the filtered process gas drawn in by the at least one fan unit.