An optical unit includes: a cylindrical member whose thickness varies in a circumferential direction; a transparent member disposed at one end, in an axial direction, of the cylindrical member; and a joining member which joins the transparent member to the cylindrical member and thereby seals the cylindrical member at the one end in the axial direction, and a portion, joining a side surface of the transparent member to an inner circumferential surface of the cylindrical member, of the joining member is thicker at a position where the cylindrical member is thick than at a position where the cylindrical member is thin.

An optical unit includes: a cylindrical member whose thickness varies in a circumferential direction; a transparent member disposed at one end, in an axial direction, of the cylindrical member; and a joining member which joins the transparent member to the cylindrical member and thereby seals the cylindrical member at the one end in the axial direction, and a portion, joining a side surface of the transparent member to an inner circumferential surface of the cylindrical member, of the joining member is thicker at a position where the cylindrical member is thick than at a position where the cylindrical member is thin.

A soldering apparatus, in particular a reflow soldering apparatus, for the continuous soldering of printed circuit boards along a transport direction, including a process channel that has a preheating zone, a soldering zone and a cooling zone, and further includes a base body and a cover hood movable between a closed position and an open position, wherein nozzle plates, fan units with fan motors, air ducts that conduct the process gas, filter elements and/or cooling elements are provided in the base body. The soldering apparatus further includes a drawer, which extends along a pull-out direction running transversely to the transport direction, is provided in the base body, with a bottom, a front wall and a rear side. Air ducts for conducting the process gas, at least one replaceable filter element in a filter region and at least one cooling device are provided in the drawer.

A device for soldering, in particular for reflow soldering, of at least one assembly, having a process chamber arrangement, comprises at least two process chambers for preparing a soldering method and/or for carrying out a soldering method and/or for post-processing a soldering method, wherein the at least two process chambers are arranged above one another, in particular in a stack-like manner.

A burner work measurement system configured to measure work using a burner is provided. The burner work measurement system includes one or more cameras configured to capture the work and a control unit configured to perform computing processing on images captured by the cameras, the control unit is configured to create work data obtained by calculating, based on the images captured by the cameras, at least one of a positional relation between a work object and the burner or flame, a positional relation between the work object and a brazing filler metal, and a positional relation between the burner or the flame and the brazing filler metal.

A burner work measurement system configured to measure work using a burner is provided. The burner work measurement system includes one or more cameras configured to capture the work and a control unit configured to perform computing processing on images captured by the cameras, the control unit is configured to create work data obtained by calculating, based on the images captured by the cameras, at least one of a positional relation between a work object and the burner or flame, a positional relation between the work object and a brazing filler metal, and a positional relation between the burner or the flame and the brazing filler metal.

A flux comprising one or more amines which is especially useful as a solder flux in soldering operations involving reactive metals such as aluminum; and a process for making aluminum surfaces solderable using the flux and conventional solders.

A flux comprising one or more amines which is especially useful as a solder flux in soldering operations involving reactive metals such as aluminum; and a process for making aluminum surfaces solderable using the flux and conventional solders.

The present applicant presents a structure intended for high temperature use above 30 C. comprising multiple components having metal-to-metal or metal-to-ceramic contacting surfaces wherein the surfaces are joined by a braze composed of pure aluminum. Anticipated devices include but are not limited to igniters as well as electronic applications in the automotive and aerospace industries.

A brazing sheet used for brazing aluminum in an inert gas atmosphere or vacuum is formed by arranging a brazing material on one side or both sides of a core material made of pure aluminum or aluminum alloy, and performing cladding with an intermediate material interposed between the core material and the brazing material. The brazing material includes 6% to 13% of Si and the balance being Al and inevitable impurities. The intermediate material includes 0.01% to 1.5% of Bi, at least one of 0.05% or more of Li, 0.05% or more of Be, 0.05% or more of Ba, and 0.05% or more of Ca, and the balance being Al and inevitable impurities. By promptly supplying Bi and Li, Be, Ca, and/or Mg into the brazing material during brazing heating, these elements are eluted in the molten brazing material, embrittling the oxide film on the surface of the brazing material.