A flux formulation includes an activator and a protic solvent. The activator may be glutaric acid, levulinic acid, 2-ketobutyric acid, 2-oxovaleric acid, or mixtures thereof. Suitable protic solvents include alkanediol, alkoxy propanol and alkoxy ethanol. The flux formulation may be a no-clean flux formulation that may be used in the soldering of electronic circuit board assemblies, for example, in conjunction with a support fixture having a planar back surface that minimizes vibrations during processing that might otherwise cause misalignment between a chip and a substrate prior to solder reflow.

Provided is a soldering system that can raise the work efficiency related to the supply of a soldering target and soldering work, while decreasing the oxygen concentration by maintaining high airtightness in a space surrounding the soldering target. A soldering system includes a soldering device and a robot related to the soldering device, in which the soldering device is equipped with a container having an openable lid and accommodating a soldering target, and the robot performs conveying of the soldering target to the soldering device and opening/closing of the lid. In an embodiment of the soldering device, the container is a double structure in which an inner container is accommodated in an outer container, and a first nitrogen supply pipe and second nitrogen supply pipe, which are inert gas supply parts of separate systems, are respectively connected to the inner container and outer container.

Provided is a soldering system that can raise the work efficiency related to the supply of a soldering target and soldering work, while decreasing the oxygen concentration by maintaining high airtightness in a space surrounding the soldering target. A soldering system includes a soldering device and a robot related to the soldering device, in which the soldering device is equipped with a container having an openable lid and accommodating a soldering target, and the robot performs conveying of the soldering target to the soldering device and opening/closing of the lid. In an embodiment of the soldering device, the container is a double structure in which an inner container is accommodated in an outer container, and a first nitrogen supply pipe and second nitrogen supply pipe, which are inert gas supply parts of separate systems, are respectively connected to the inner container and outer container.

A method and apparatus for flip chip bonding using conductive and inductive heating to heat a plurality of solder bumps located between a chip carrier and a chip.

A method and apparatus for flip chip bonding using conductive and inductive heating to heat a plurality of solder bumps located between a chip carrier and a chip.

A soldering apparatus, that moves a jet nozzle while ensuring that molten solder does not spill to the outside of the jet nozzle, is provided. The soldering apparatus includes a solder tank storing the molten solder, a jetting mechanism including the jet nozzle and a pump, which pumps the molten solder stored in the solder tank, an XY-direction moving mechanism that moves the solder tank, and a control device that controls the acceleration and deceleration of the solder tank according to the height of the molten solder protruding upwards from a tip of the jet nozzle or the height of the molten solder protruding upwards from the tip of the jet nozzle according to the acceleration and deceleration of the solder tank.

A soldering apparatus, that moves a jet nozzle while ensuring that molten solder does not spill to the outside of the jet nozzle, is provided. The soldering apparatus includes a solder tank storing the molten solder, a jetting mechanism including the jet nozzle and a pump, which pumps the molten solder stored in the solder tank, an XY-direction moving mechanism that moves the solder tank, and a control device that controls the acceleration and deceleration of the solder tank according to the height of the molten solder protruding upwards from a tip of the jet nozzle or the height of the molten solder protruding upwards from the tip of the jet nozzle according to the acceleration and deceleration of the solder tank.

An extruded heat transfer tube with an internal passage includes a tube body made of an extruded material of an aluminum alloy having a composition that includes 0.3 mass % or more and less than 0.8 mass % of Mn; more than 0.1 mass % and less than 0.32 mass % of Si; 0.3 mass % or less of Fe; 0.06 mass % or more and 0.3 mass % or less of Ti; and Al balance including inevitable impurities, a ratio of a Mn content to a Si content, Mn %/Si %, exceeding 2.5. The extruded heat transfer tube further includes a Zn-containing layer provided directly on an outer surface of the tube body.

An extruded heat transfer tube with an internal passage includes a tube body made of an extruded material of an aluminum alloy having a composition that includes 0.3 mass % or more and less than 0.8 mass % of Mn; more than 0.1 mass % and less than 0.32 mass % of Si; 0.3 mass % or less of Fe; 0.06 mass % or more and 0.3 mass % or less of Ti; and Al balance including inevitable impurities, a ratio of a Mn content to a Si content, Mn %/Si %, exceeding 2.5. The extruded heat transfer tube further includes a Zn-containing layer provided directly on an outer surface of the tube body.

The invention provides a process for brazing two or three parts. A braze with a composition consisting of Ni.sub.resCr.sub.aB.sub.bP.sub.cSi.sub.d with 20 atomic percent<a<22 atomic percent; 1.2 atomic percentb3.6 percent; 12.5 atomic percentc14.5 atomic percent; 0 atomic percentd<1.5 atomic percent; incidental impurities0.5 atomic percent; and residual Ni is inserted between two or more parts to be joined to form a joint, the parts to be joined having a higher melting temperature than the braze. The joint is heated to a temperature of between 1020 C. and 1070 C. and cooled to form a brazed joint between the parts.