Device (1) for displacing at least one assembly (2, 2) between a provisioning zone (3) and a working zone (4) of at least one process chamber (5) of a process chamber apparatus (6) for soldering, in particular for reflow soldering, comprising at least one displacement device (7), wherein the at least one assembly (2, 2) carries out, at least in sections, a displacement movement (9), or such a displacement movement (9) can be carried out, such that the at least one assembly (2, 2) is displaced by means of a force (8), in particular pushing force, which is transmitted or generated by the displacement device (7), in particular directly, and acts on the assembly (2, 2).

Heat exchange tubes of a heat exchanger are formed of an alloy containing Mn (0.2 to 0.3 mass %), Cu (0.1 mass % or less), and Fe (0.2 mass % or less), the balance being Al and unavoidable impurities. A Zn diffused layer is formed in an outer surface layer portion of the peripheral wall of each heat exchange tube. T200, 0.57A1.5, D/T0.55, and 0.0055A/D0.025 are satisfied, where T is the thickness [m] of the peripheral wall of the heat exchange tube, A is the Zn concentration [mass %] at the outermost surface of the outer surface layer portion, and D is the maximum depth [m] of the Zn diffused layer. The spontaneous potential of the Zn diffused layer is lower than that of a portion of the peripheral wall located on the inner side of the Zn diffused layer.

A method of forming a stacked surface arrangement for semiconductor devices includes joining a first surface to a second surface with a solder bump, the solder bump including a substantially pure first metal; depositing nanoparticles of a second metal onto a surface of the solder bump; performing an annealing operation to form a film of the second metal on the surface of the solder bump; and performing a reflow or a second annealing operation to transform the solder bump from the substantially pure first metal to an alloy of the first metal and the second metal.

A coating method for applying a cover layer to a base material is provided. A solder positioned on a surface of the base material is heated until it is molten, for joining the solder to the base material in a heat treatment. Oxygen is diffused in the molten lot for forming a diffusion layer in the cover layer. A component for a steam turbine is also provided.

The present invention describes a portable device for monitoring and controlling the level of residual oxygen in reflow oven atmosphere (1). This referred equipment is able to determine the quality of the atmosphere of a reflow oven, using parameters predetermined by the user. Therefore, the equipment performs the monitoring of the reflow oven atmosphere (1) controlling the level of residual oxygen of the reflow oven (1) by increasing or decreasing of the feed flow rate of nitrogen by the control that the microcontroller exerts over the proportional valve of nitrogen flow control (9), by opening or closing the valves to kept such predetermined values.

The present invention describes a portable device for monitoring and controlling the level of residual oxygen in reflow oven atmosphere (1). This referred equipment is able to determine the quality of the atmosphere of a reflow oven, using parameters predetermined by the user. Therefore, the equipment performs the monitoring of the reflow oven atmosphere (1) controlling the level of residual oxygen of the reflow oven (1) by increasing or decreasing of the feed flow rate of nitrogen by the control that the microcontroller exerts over the proportional valve of nitrogen flow control (9), by opening or closing the valves to kept such predetermined values.

A reflow flip chip bonding tool apparatus is provided. The bonding tool apparatus includes a heater configured to heat air and a bonding tool body disposed on an upper surface of the chip, wherein a movement path is formed between a lower surface of the bonding tool body and the upper surface of the chip, the air heated by the heater heats the chip through non-contact convection heat transfer while flowing through the movement path, and a solder disposed between the lower surface of the chip and an electrode pad of the substrate is melted.

A reflow flip chip bonding tool apparatus is provided. The bonding tool apparatus includes a heater configured to heat air and a bonding tool body disposed on an upper surface of the chip, wherein a movement path is formed between a lower surface of the bonding tool body and the upper surface of the chip, the air heated by the heater heats the chip through non-contact convection heat transfer while flowing through the movement path, and a solder disposed between the lower surface of the chip and an electrode pad of the substrate is melted.

A method for brazing a plate heat exchanger (10) having a stack of heat exchanger plates with depressions and elevations forming interplate flow channels and port openings being in selective fluid communication with said interplate flow channels, the method comprising the steps of placing the stack of heat exchanger plates in a heating chamber (16) of a furnace (15), conducting a gas for changing the temperature of the stack of heat exchanger plates through a plurality of nozzles (23) inside the heating chamber (16), and conducting gas from at least one of said nozzles (23) into at least one of the port openings (O1-O4) of the stack of heat exchanger plates. Disclosed is also a system for brazing a plate heat exchanger (10).

A method for brazing a plate heat exchanger (10) having a stack of heat exchanger plates with depressions and elevations forming interplate flow channels and port openings being in selective fluid communication with said interplate flow channels, the method comprising the steps of placing the stack of heat exchanger plates in a heating chamber (16) of a furnace (15), conducting a gas for changing the temperature of the stack of heat exchanger plates through a plurality of nozzles (23) inside the heating chamber (16), and conducting gas from at least one of said nozzles (23) into at least one of the port openings (O1-O4) of the stack of heat exchanger plates. Disclosed is also a system for brazing a plate heat exchanger (10).