This disclosure relates to a soldering system containing a soldering apparatus and a heating apparatus. The soldering apparatus includes a heating plate having a body defining a plurality of first air exits, each first air exit extending through the body of the heating plate and the heating plate being configured to supply hot air through the first air exits; a cover disposed on the heating plate, the cover and the heating plate defining a hot air chamber; a plurality of axially movable positioning shafts extending though the body of the heating plate, in which each shaft has a first end and a second end, the first end is in the hot air chamber, and the second end is outside the hot air chamber; and a conduit attached to the cover, the conduit being configured to supply hot air to the hot air chamber.

Each heat exchange tube of a condenser is formed of a first brazing sheet having a core material and a first brazing material covering the core material. The tank body of each header tank is formed of a second brazing sheet having a core material and a third brazing material covering the core material and being lower in flowability than the first brazing material. In a region of a surface of each protrusion portion facing the corresponding heat exchange tube, the region having a predetermined width as measured from the projecting end, the core materials of the two brazing sheets are brazed together by means of the first brazing material. In the region other than the brazed portion, the core materials of the two brazing sheets are brazed together by means of a fillet formed of a mixture of the first and third brazing materials.

Each heat exchange tube of a condenser is formed of a first brazing sheet having a core material and a first brazing material covering the core material. The tank body of each header tank is formed of a second brazing sheet having a core material and a third brazing material covering the core material and being lower in flowability than the first brazing material. In a region of a surface of each protrusion portion facing the corresponding heat exchange tube, the region having a predetermined width as measured from the projecting end, the core materials of the two brazing sheets are brazed together by means of the first brazing material. In the region other than the brazed portion, the core materials of the two brazing sheets are brazed together by means of a fillet formed of a mixture of the first and third brazing materials.

The present invention relates to a smart BGA chip maintenance device comprising a base, a moving worktable, a horizontal slide, a vertical slide, a grinding knife, an electronic microscope and a mini-sized air compressor, wherein the base comprises a platform and a portal frame. The moving worktable is propelled by a first driving mechanism, wherein the horizontal slide is propelled by a second driving mechanism, wherein the vertical slide is propelled by a third driving mechanism. Both a grinding knife and an electronic microscope are provided on the vertical slide. An air pipe is disposed at the side of the grinding knife, wherein the grinding knife is propelled by a fourth driving mechanism to rotate, wherein the device can automatically perceive the flatness of the chip, ensuring a horizontal grinding process and avoiding the damage to the soldering pad of the circuit board.

Fuel gas compositions for use in metal fabrication are provided comprising fuel gases comprising a base fuel gas mixed with from about 1% to less than 30% hydrogen.

A bonding structure bonds a Cu wiring line and a device electrode with each other. The bonding structure is arranged between the Cu wiring line and the device electrode, and comprises a first intermetallic compound (IMC) layer (a layer of an intermetallic compound of Cu and Sn) formed on the interface with the Cu wiring line, a second intermetallic compound (IMC) layer (a layer of an intermetallic compound of Cu and Sn) formed on the interface with the device electrode, and an intermediate layer that is present between the intermetallic compound layers. In the intermediate layer, a network-like IMC (a network-like intermetallic compound of Cu and Sn) is present in Sn.

The present application discloses an end barrier box for blocking ambient gases from entering a hearth of a reflow oven, including: a box body, wherein the box body includes a bottom and a top, the bottom has a mounting bottom plate, the top has an opening, the box body further includes a pair of side walls, and the side walls are oppositely disposed; and a plurality of deflectors, wherein each of the plurality of deflectors is mounted between the pair of side walls, each of the plurality of deflectors includes at least three fins, and the at least three fins are mounted on the mounting bottom plate and extend upward from the mounting bottom plate. According to the end barrier box of the present application, the deflector is set to include at least three fins, so that the deflector can be easily disassembled without disassembling the rails, which is convenient for cleaning and maintenance of the end barrier box.

A method for assembling components implementing includes a pre-treatment of the solder bumps allowing an assembly by fluxless and residue-free soldering. A first component carrying solder bumps is assembled with a second component carrying connectors. Beforehand, a pre-treatment of the components carrying solder bumps is carried out by contacting them with a pre-treatment liquid which makes their subsequent fluxless and residue-free soldering possible.

A method for brazing a plate heat exchanger (10) having a stack of heat exchanger plates with depressions and elevations forming interplate flow channels and port openings being in selective fluid communication with said interplate flow channels, the method comprising the steps of placing the stack of heat exchanger plates in a heating chamber (16) of a furnace (15), conducting a gas for changing the temperature of the stack of heat exchanger plates through a plurality of nozzles (23) inside the heating chamber (16), and conducting gas from at least one of said nozzles (23) into at least one of the port openings (O1-O4) of the stack of heat exchanger plates. Disclosed is also a system for brazing a plate heat exchanger (10).

A method for brazing a plate heat exchanger (10) having a stack of heat exchanger plates with depressions and elevations forming interplate flow channels and port openings being in selective fluid communication with said interplate flow channels, the method comprising the steps of placing the stack of heat exchanger plates in a heating chamber (16) of a furnace (15), conducting a gas for changing the temperature of the stack of heat exchanger plates through a plurality of nozzles (23) inside the heating chamber (16), and conducting gas from at least one of said nozzles (23) into at least one of the port openings (O1-O4) of the stack of heat exchanger plates. Disclosed is also a system for brazing a plate heat exchanger (10).