Patent classifications
B23K1/012
Flux-free joining of aluminium composite materials
Use of an aluminium composite material in a thermal joining method, said material consisting of at least one aluminium core alloy and at least one external brazing layer consisting of an aluminium brazing alloy provided on one or both sides of the aluminium core alloy, wherein the aluminium brazing layer has a pickled surface. Reduced costs and a lower environmental impact is achieved by using an aluminium composite material in which the pickled surface of the aluminium brazing layer had been pickled by pickling with an acid, aqueous pickling solution containing at least one mineral acid and at least one complex-forming agent or a complexing mineral acid, wherein the removal of material in the pickling is between 0.05 g/m.sup.2 and 6 g/m.sup.2, the aluminium composite material is used in a flux-free, thermal joining method, and the joining method is carried out in the presence of a protective gas.
HOLLOW PIPE-SANDWICHING METAL PLATE AND APPLICATIONS THEREOF
Disclosed is a method for forming a hollow pipe-sandwiching metal plate and applications thereof. The hollow pipe-sandwiching metal plate comprises a first panel, a second panel, and multiple hollow pipes between the first panel and the second panel; gaps are arranged among the hollow pipes, and the hollow pipes are connected to the first panel and the second panel by brazing. The present disclosure further includes the applications of the hollow pipe-sandwiching metal plate. The hollow pipe-sandwiching metal plate has advantages, such as light weight, high strength, low stress, high temperature resistance, pressure bearing, thermal insulation and vibration isolation. The metal plate will not deform due to thermal difference, thereby providing permanent service life of the metal plate.
METHOD FOR IMPROVED MANUFACTURING OF A DUAL MICROSTRUCTURE PART
A method for welding together at least two parts of green material, referred to as green parts, by means of co-sintering, comprising the following steps:assembling the at least two green parts at a junction zone of said parts so as to form a green one-piece assembly,de-binding the green one-piece assembly, andsintering the one-piece assembly so as to obtain a dense one-piece assembly forming a final part, characterised in that the two green parts (10, 12) each have a composition of different powder, so as to produce a final part (1) having at least two parts with different grain sizes.
High temperature devices and applications employing pure aluminum braze for joining components of said devices
The present applicant presents a structure intended for high temperature use above 30 C. comprising multiple components having metal-to-metal or metal-to-ceramic contacting surfaces wherein the surfaces are joined by a braze composed of pure aluminum. Anticipated devices include but are not limited to igniters as well as electronic applications in the automotive and aerospace industries.
High temperature devices and applications employing pure aluminum braze for joining components of said devices
The present applicant presents a structure intended for high temperature use above 30 C. comprising multiple components having metal-to-metal or metal-to-ceramic contacting surfaces wherein the surfaces are joined by a braze composed of pure aluminum. Anticipated devices include but are not limited to igniters as well as electronic applications in the automotive and aerospace industries.
Nanoparticle powders, methods for forming braze pastes, and methods for modifying articles
A nanoparticle powder is disclosed including a plurality of stabilized nanoparticles having a superalloy composition. At least about 90% of the particles have a convexity between about 0.980-1 and a circularity between about 0.850-1. A method for forming a braze paste is disclosed including mixing the plurality of stabilized nanoparticles with at least one organometallic precursor and up to about 5 wt % binder. A method for modifying an article is disclosed including applying the braze paste to a substrate including at least one crack, removing at least about 70% of the binder in the braze paste, and then applying additional braze paste over the first portion. Under vacuum or inert gas atmosphere, essentially all remaining binder is evaporated. The braze paste is brazed to the article at about 40-60% of the superalloy's bulk liquidus temperature, forming a brazed material and thereby sealing the at least one crack.
Nanoparticle powders, methods for forming braze pastes, and methods for modifying articles
A nanoparticle powder is disclosed including a plurality of stabilized nanoparticles having a superalloy composition. At least about 90% of the particles have a convexity between about 0.980-1 and a circularity between about 0.850-1. A method for forming a braze paste is disclosed including mixing the plurality of stabilized nanoparticles with at least one organometallic precursor and up to about 5 wt % binder. A method for modifying an article is disclosed including applying the braze paste to a substrate including at least one crack, removing at least about 70% of the binder in the braze paste, and then applying additional braze paste over the first portion. Under vacuum or inert gas atmosphere, essentially all remaining binder is evaporated. The braze paste is brazed to the article at about 40-60% of the superalloy's bulk liquidus temperature, forming a brazed material and thereby sealing the at least one crack.
Soldering Apparatus
A soldering apparatus includes transfer rails as a first transfer means for transferring a printed circuit board, transfer rails as a second transfer means provided in parallel to a transfer direction of the printed circuit board to be transferred by the transfer rails, a muffle as a first reflow furnace main body for heating the printed circuit board transferred by the transfer rails, a muffle as a second reflow furnace main body for heating a printed circuit board transferred by the transfer rails, and a main frame as a frame for housing the muffle and the muffle. The main frame includes an opening/closing part as a first opening/closing means for opening/closing the muffle, and an opening/closing part as a second opening/closing means for opening/closing the muffle.
2D metrology technique for solder paste inspection
A method, apparatus and computer readable memory for solder paste inspection. A light source is configured to irradiate a sample solder joint comprising an organic material, an organic and metal material enclosed by an irregular boundary, and a metal material enclosed by a regular boundary. A first wavelength ultraviolet (UV) energy irradiates the sample to obtain first fluorescence energy, and a second wavelength UV energy irradiates the sample to obtain second fluorescence energy. A two-dimensional (2D) camera is configured to acquire a first image of the sample primarily from the first fluorescence energy and a second image of the sample primarily from the second fluorescence energy. Photo manipulation software is stored on at least one hardware processor, the photo manipulation software configured to overlay the first image and the second image to visually compare the boundary of the organic and metal material with the boundary of the metal material.
Oven-style nozzle for reworking operations involving bottom-side terminated components or other components
An apparatus includes a gas interface configured to be fluidly coupled to a gas source and to receive a heated gas flow from the gas source. The apparatus also includes a convection-to-radiant heat transfer section configured to receive convection heat from the heated gas flow. The apparatus further includes a compartment configured to receive a component. The heat transfer section is configured to convert the convection heat into radiant heat and to provide the radiant heat to the compartment in order to heat the component within the compartment. The apparatus is configured to substantially block the heated gas flow from contacting the component within the compartment. One or more exhaust vent openings may be configured to allow exhaust of the heated gas flow from the apparatus. A damper may be configured to selectively release or block the one or more exhaust vent openings.