A device for dispensing and distributing flux-free solder on a substrate comprises an elongated tool, a tool mount, an ultrasonic generator, a wire guide tube, and optionally a heat sink and a housing. The tool can be fixed to the tool mount and has a longitudinal borehole which opens into an opening on the tip of the tool. The wire guide tube extends along a central longitudinal axis through the ultrasonic generator and the tool mount, protrudes into the longitudinal borehole of the tool and reaches up to a position above the tip of the tool. The wire guide tube does not touch the tool. The ultrasonic generator is fixed to the tool mount. Advantageously, a cooling chamber which can actively be cooled is formed between an inner wall of the housing and the ultrasonic generator.

A device for dispensing and distributing flux-free solder on a substrate comprises an elongated tool, a tool mount, an ultrasonic generator, a wire guide tube, and optionally a heat sink and a housing. The tool can be fixed to the tool mount and has a longitudinal borehole which opens into an opening on the tip of the tool. The wire guide tube extends along a central longitudinal axis through the ultrasonic generator and the tool mount, protrudes into the longitudinal borehole of the tool and reaches up to a position above the tip of the tool. The wire guide tube does not touch the tool. The ultrasonic generator is fixed to the tool mount. Advantageously, a cooling chamber which can actively be cooled is formed between an inner wall of the housing and the ultrasonic generator.

A method includes receiving, during a vibration welding process, a set of sensory signals from a collection of sensors positioned with respect to a work piece during formation of a weld on or within the work piece. The method also includes receiving control signals from a welding controller during the process, with the control signals causing the welding horn to vibrate at a calibrated frequency, and processing the received sensory and control signals using a host machine. Additionally, the method includes displaying a predicted weld quality status on a surface of the work piece using a status projector. The method may include identifying and display a quality status of a suspect weld. The laser projector may project a laser beam directly onto or immediately adjacent to the suspect welds, e.g., as a red, green, blue laser or a gas laser having a switched color filter.

A large surface area ultrasonic block horn includes one or more shaped elements having a node at a mid-point of the shaped element that is narrower than opposed ends of the shaped element.

A bonding apparatus bonds a plurality of device chips on a plurality of electrode pads that are provided to a surface of a substrate. The bonding apparatus includes a stage, a head unit, a head lifting mechanism, a head vibrator, a heater, and a bonding region observation component. The substrate is placed and supported on the stage. The head unit holds the device chips. The head lifting mechanism raises and lowers the head unit in an up and down direction relative to the stage. The head vibrator vibrate the head unit in the up and down direction. The heater heats a bonding paste that bonds the device chips and the electrode pads. The bonding region observation component observes a region that includes at least a peripheral part of the electrode pads.

A bonding apparatus bonds a plurality of device chips on a plurality of electrode pads that are provided to a surface of a substrate. The bonding apparatus includes a stage, a head unit, a head lifting mechanism, a head vibrator, a heater, and a bonding region observation component. The substrate is placed and supported on the stage. The head unit holds the device chips. The head lifting mechanism raises and lowers the head unit in an up and down direction relative to the stage. The head vibrator vibrate the head unit in the up and down direction. The heater heats a bonding paste that bonds the device chips and the electrode pads. The bonding region observation component observes a region that includes at least a peripheral part of the electrode pads.

A method includes performing a first strike process to strike a metal bump of a first package component against a metal pad of a second package component. A first one of the metal bump and the metal pad includes copper. A second one of the metal bump and the metal pad includes aluminum. The method further includes performing a second strike process to strike the metal bump against the metal pad. An annealing is performed to bond the metal bump on the metal pad.

The present invention relates to a reflow film containing a thermoplastic resin which is dissolvable in a solvent, and solder particles, wherein the solder particles are dispersed in the film, and also relates to a solder bump formation method which comprises: (A) a step of mounting the reflow film on the electrode surface side of a substrate, (B) a step of mounting and fixing a flat plate, (C) a step of heating, and (D) a step of dissolving and removing the reflow film, and herewith, a reflow film is provided which, by causing localization of the solder component on the electrodes of the substrate by self-assembly, exhibits excellent storage properties, transportability and handling properties during use, and can form solder bumps or solder joints selectively on only the electrodes.

The present invention relates to a reflow film containing a thermoplastic resin which is dissolvable in a solvent, and solder particles, wherein the solder particles are dispersed in the film, and also relates to a solder bump formation method which comprises: (A) a step of mounting the reflow film on the electrode surface side of a substrate, (B) a step of mounting and fixing a flat plate, (C) a step of heating, and (D) a step of dissolving and removing the reflow film, and herewith, a reflow film is provided which, by causing localization of the solder component on the electrodes of the substrate by self-assembly, exhibits excellent storage properties, transportability and handling properties during use, and can form solder bumps or solder joints selectively on only the electrodes.

Provided is a method capable of reducing the amount of a coating part remaining between a conductor and a bonding object. A chip comes closer to an anvil so that the flat cable and the terminal are sandwiched between the chip and the anvil. The flat cable and the terminal are pressed so as to come close to each other. When the chip ultrasonically vibrates, vibrations of the chip propagate to the terminal, causing the terminal to ultrasonically vibrate. Then heat is generated in a plate part by friction between the chip and the plate part. The coating part being positioned between the conductor and the plate part melts from the generated heat and is removed. Thereby the conductor and the plate part come into contact with each other resulting in a solid-phase bonding together.