A soldering device for soldering a printed circuit board includes at least one heating appliance melting solder situated between electrical or electronic components being soldered onto a printed circuit board and the printed circuit board. At least one actuator mechanically oscillates the printed circuit board at a variable frequency of oscillation in a direction of a plane defioned by the printed circuit board. A second lateral edge of the printed circuit board, the second lateral edge being opposite to the first lateral edge of the printed circuit board, rests against iand supported by a fixed stop.

A soldering device for soldering a printed circuit board includes at least one heating appliance melting solder situated between electrical or electronic components being soldered onto a printed circuit board and the printed circuit board. At least one actuator mechanically oscillates the printed circuit board at a variable frequency of oscillation in a direction of a plane defioned by the printed circuit board. A second lateral edge of the printed circuit board, the second lateral edge being opposite to the first lateral edge of the printed circuit board, rests against iand supported by a fixed stop.

A method for creating and using an assembly includes arranging a bonding material between a first component and a second component. The first component, the bonding material and the second component are heated to a predetermined temperature for a predetermined period to melt the bonding material and to create an assembly. The predetermined temperature is at or greater than a melting temperature of the bonding material and less than a melting temperature of the first component and the second component. The method includes using the assembly inside a batch furnace of a substrate processing system or a processing chamber of a substrate processing system. The first component and the second component are made from a material selected from a group consisting of silicon and silicon carbide. The bonding material is selected from a group consisting of aluminum, gold, germanium, indium or an alloy of silicon and aluminum, gold, germanium, or indium.

A method includes performing a first strike process to strike a metal bump of a first package component against a metal pad of a second package component. A first one of the metal bump and the metal pad includes copper. A second one of the metal bump and the metal pad includes aluminum. The method further includes performing a second strike process to strike the metal bump against the metal pad. An annealing is performed to bond the metal bump on the metal pad.

A method includes performing a first strike process to strike a metal bump of a first package component against a metal pad of a second package component. A first one of the metal bump and the metal pad includes copper. A second one of the metal bump and the metal pad includes aluminum. The method further includes performing a second strike process to strike the metal bump against the metal pad. An annealing is performed to bond the metal bump on the metal pad.

A welding assembly includes a sonotrode, cleaning station, and controller. The controller periodically commands clamping of the sonotrode onto the cleaning block, and a transmission of ultrasonic energy into the cleaning block for a calibrated duration sufficient for removing residual amounts of metal from welding pads of the sonotrode. The cleaning block may include an aluminum bar coated with a polymeric material, e.g., porous polyethylene silica or alumina composite. A thin sacrificial layer of an anti-adhesion material, e.g., colloidal silica, may be periodically applied to the welding pads, particularly after a transition from welding a first metal to welding a second metal. The sacrificial layer may be applied via a sponge, a saturated surface, or spraying.

A welding assembly includes a sonotrode, cleaning station, and controller. The controller periodically commands clamping of the sonotrode onto the cleaning block, and a transmission of ultrasonic energy into the cleaning block for a calibrated duration sufficient for removing residual amounts of metal from welding pads of the sonotrode. The cleaning block may include an aluminum bar coated with a polymeric material, e.g., porous polyethylene silica or alumina composite. A thin sacrificial layer of an anti-adhesion material, e.g., colloidal silica, may be periodically applied to the welding pads, particularly after a transition from welding a first metal to welding a second metal. The sacrificial layer may be applied via a sponge, a saturated surface, or spraying.

An ultrasonic jointing method is provided for performing an ultrasonic joint of a conductor part which is exposed by removing a coating of an electric wire with respect to a terminal. The ultrasonic jointing method includes: holding the conductor part of the electric wire and the terminal between an anvil and a horn in which a concave part is formed; and applying an ultrasonic vibration to the conductor part of the electric wire and the terminal that are held between the anvil and the horn. The conductor part is received in the concave part which has a space area of 0.89 to 1.46 times as large as a cross-sectional area of the conductor part of the electric wire.

Solder can be used to wet and bind glass substrates together to ensure a hermetic seal that superior (less penetrable) than conventional polymeric (thermoplastic or thermoplastic elastomer) seals in electric and electronic applications.

Solder can be used to wet and bind glass substrates together to ensure a hermetic seal that superior (less penetrable) than conventional polymeric (thermoplastic or thermoplastic elastomer) seals in electric and electronic applications.