The present disclosure relates to an electric wire connection structure including one or more copper-based conductor covered electric wires having a copper-based conductor covered part and exposed part; and one or more aluminum-based conductor covered electric wires having an aluminum-based conductor covered part and exposed part. An ultrasonic joint part is provided at a conductor stacked part in which the copper-based conductor exposed part and the aluminum-based conductor exposed part are superposed. A total contacting length L which is a summed length of a part at which the copper-based conductor exposed part and the aluminum-based conductor exposed part contact and a summed length x of a contour line of a space S formed at a part at which the copper-based conductor exposed part and the aluminum-based conductor exposed part are separate in a joint interface of the ultrasonic joint part satisfy a relational expression of (x/L)×100≤10% based on cross-section observation.

A method of connection to a conductive material for, such as, a switchable film, includes steps of providing a switchable film having a first substrate, a first conductive layer, a switchable layer, a second conductive layer, and a second substrate; applying a solder material to the first conductive layer with ultrasonic application to provide a first busbar; and applying the solder material to the second conductive layer with ultrasonic application to provide a second busbar. The busbars are to be connected to connectors.

A method of connection to a conductive material for, such as, a switchable film, includes steps of providing a switchable film having a first substrate, a first conductive layer, a switchable layer, a second conductive layer, and a second substrate; applying a solder material to the first conductive layer with ultrasonic application to provide a first busbar; and applying the solder material to the second conductive layer with ultrasonic application to provide a second busbar. The busbars are to be connected to connectors.

To provide a wire bonding apparatus, which is insusceptible to a bonding state at a second bonding point due to a wire cut error or the like, or to members such as a capillary and a wire, and is capable of automatically protruding the wire from a leading end of the capillary, provided is a wire bonding apparatus including: a capillary (6) having a through hole through which a wire (40) is to be inserted; a holding unit, which is provided above the capillary (6), and is configured to hold the wire (40) inserted through the capillary (6); and a vibrating unit configured to vertically vibrate the capillary (6). Under a state in which the holding unit holds the wire (40), the vibrating unit vertically vibrates the capillary (6) so that the wire (40) is protruded from the leading end of the capillary.

To provide a wire bonding apparatus, which is insusceptible to a bonding state at a second bonding point due to a wire cut error or the like, or to members such as a capillary and a wire, and is capable of automatically protruding the wire from a leading end of the capillary, provided is a wire bonding apparatus including: a capillary (6) having a through hole through which a wire (40) is to be inserted; a holding unit, which is provided above the capillary (6), and is configured to hold the wire (40) inserted through the capillary (6); and a vibrating unit configured to vertically vibrate the capillary (6). Under a state in which the holding unit holds the wire (40), the vibrating unit vertically vibrates the capillary (6) so that the wire (40) is protruded from the leading end of the capillary.

An ultrasonic processing system (1) which comprises an ultrasonic vibrator (10) having an ultrasonic sonotrode (30) and a working surface (31) for ultrasonic processing of a workpiece. The vibrator (10) comprises a longitudinal axis (L), an enclosed cavity (32, 51) extends along the longitudinal axis at least in the sonotrode (30), a medium inlet (52) through which a cooling medium is fed into the cavity (32, 51), at least one vortex generator (53) which arranged between the medium inlet (52) and the cavity (32, 51) such that a swirl motion of the medium is generated inside the cavity (32, 51) around the longitudinal axis. A cooling channel (34) is fluidly connected to the enclosed cavity (32, 51) to guide the medium in the vicinity of the working surface (31) such that the working surface (31) is cooled. A first medium outlet (33) is fluidly connected to the cooling channel (34).

An ultrasonic processing system (1) which comprises an ultrasonic vibrator (10) having an ultrasonic sonotrode (30) and a working surface (31) for ultrasonic processing of a workpiece. The vibrator (10) comprises a longitudinal axis (L), an enclosed cavity (32, 51) extends along the longitudinal axis at least in the sonotrode (30), a medium inlet (52) through which a cooling medium is fed into the cavity (32, 51), at least one vortex generator (53) which arranged between the medium inlet (52) and the cavity (32, 51) such that a swirl motion of the medium is generated inside the cavity (32, 51) around the longitudinal axis. A cooling channel (34) is fluidly connected to the enclosed cavity (32, 51) to guide the medium in the vicinity of the working surface (31) such that the working surface (31) is cooled. A first medium outlet (33) is fluidly connected to the cooling channel (34).

A screen tensioning apparatus for a mask is provided. The screen tensioning apparatus includes a supporting device, a first movable mechanism and an ultrasonic soldering device. The supporting device is disposed to support a mask framework. The ultrasonic soldering device includes an ultrasonic soldering head. The ultrasonic soldering head is fixedly connected to the first movable mechanism. The mask framework is disposed on the supporting device. The ultrasonic soldering head is disposed on one side of the mask framework facing away from the supporting device.

An ultrasonic transducer system is provided. The ultrasonic transducer system includes: a transducer mounting structure; a transducer, including at least one mounting flange for coupling the transducer to the transducer mounting structure; and a tuned resonator having a desired resonant frequency, the tuned resonator being integrated with at least one of the transducer mounting structure and the at least one mounting flange.

An ultrasonic transducer system is provided. The ultrasonic transducer system includes: a transducer mounting structure; a transducer, including at least one mounting flange for coupling the transducer to the transducer mounting structure; and a tuned resonator having a desired resonant frequency, the tuned resonator being integrated with at least one of the transducer mounting structure and the at least one mounting flange.