A method of joining a surface-mount component to a substrate includes placing a piece of solder on top of the substrate and temporarily bonding the piece of solder to the substrate with at least one temporary bond. The method also includes placing a surface-mount component on top of the substrate with a bottom face of the surface-mount component facing the substrate. The surface-mount component has at least one lateral side. The method further includes positioning the surface-mount component with the at least one lateral side proximate the piece of solder, heating the substrate and the piece of solder to a joining temperature for a time sufficient for the solder to flow into an area between the bottom face of the surface-mount component and the substrate, and cooling the substrate and solder.

A method of joining a surface-mount component to a substrate includes placing a piece of solder on top of the substrate and temporarily bonding the piece of solder to the substrate with at least one temporary bond. The method also includes placing a surface-mount component on top of the substrate with a bottom face of the surface-mount component facing the substrate. The surface-mount component has at least one lateral side. The method further includes positioning the surface-mount component with the at least one lateral side proximate the piece of solder, heating the substrate and the piece of solder to a joining temperature for a time sufficient for the solder to flow into an area between the bottom face of the surface-mount component and the substrate, and cooling the substrate and solder.

To provide a wire bonding apparatus, which is insusceptible to a bonding state at a second bonding point due to a wire cut error or the like, or to members such as a capillary and a wire, and is capable of automatically protruding the wire from a leading end of the capillary, provided is a wire bonding apparatus including: a capillary (6) having a through hole through which a wire (40) is to be inserted; a holding unit, which is provided above the capillary (6), and is configured to hold the wire (40) inserted through the capillary (6); and a vibrating unit configured to vertically vibrate the capillary (6). Under a state in which the holding unit holds the wire (40), the vibrating unit vertically vibrates the capillary (6) so that the wire (40) is protruded from the leading end of the capillary.

To provide a wire bonding apparatus, which is insusceptible to a bonding state at a second bonding point due to a wire cut error or the like, or to members such as a capillary and a wire, and is capable of automatically protruding the wire from a leading end of the capillary, provided is a wire bonding apparatus including: a capillary (6) having a through hole through which a wire (40) is to be inserted; a holding unit, which is provided above the capillary (6), and is configured to hold the wire (40) inserted through the capillary (6); and a vibrating unit configured to vertically vibrate the capillary (6). Under a state in which the holding unit holds the wire (40), the vibrating unit vertically vibrates the capillary (6) so that the wire (40) is protruded from the leading end of the capillary.

An exothermic welding apparatus and an exothermic welding method, belonging to the exothermic welding field are provided. The exothermic welding apparatus includes a mold, an igniter and an electronic starter, the mold has a holding space configured to accommodate an exothermic welding flux, the igniter includes a heating wire, a first conductor wire and a first connector, the heating wire is configured to ignite the exothermic welding flux directly, one end of the first conductor wire is electrically connected to the heating wire, the other end of the first conductor wire is electrically connected to the first connector, and the electronic starter cooperates with the first connector and is configured to supply power to the first connector. The exothermic welding apparatus can ignite an exothermic welding flux by supplying power with an electronic starter.

An exothermic welding apparatus and an exothermic welding method, belonging to the exothermic welding field are provided. The exothermic welding apparatus includes a mold, an igniter and an electronic starter, the mold has a holding space configured to accommodate an exothermic welding flux, the igniter includes a heating wire, a first conductor wire and a first connector, the heating wire is configured to ignite the exothermic welding flux directly, one end of the first conductor wire is electrically connected to the heating wire, the other end of the first conductor wire is electrically connected to the first connector, and the electronic starter cooperates with the first connector and is configured to supply power to the first connector. The exothermic welding apparatus can ignite an exothermic welding flux by supplying power with an electronic starter.

There is provided a method of joining a first member made of a niobium titanium alloy to a second member. The method comprises abutting a respective surface of each of the first member and the second member together to form an interface therebetween; providing a molten active solder at a surface of at least the first member at the interface and thermally activating the molten active solder; mechanically agitating the molten active solder so as to cause the molten solder to adhere to the first and second members and form a continuous body of molten solder linking the first and second; and causing the continuous body to solidify thereby forming a solder joint between the first and second members.

There is provided a method of joining a first member made of a niobium titanium alloy to a second member. The method comprises abutting a respective surface of each of the first member and the second member together to form an interface therebetween; providing a molten active solder at a surface of at least the first member at the interface and thermally activating the molten active solder; mechanically agitating the molten active solder so as to cause the molten solder to adhere to the first and second members and form a continuous body of molten solder linking the first and second; and causing the continuous body to solidify thereby forming a solder joint between the first and second members.

Techniques for bonding structural features together in an enclosure of an electronic device are disclosed. A structural feature may be ultrasonically soldered to the enclosure to provide structural support and form a magnetic circuit within the device. Also, ultrasonic welding can bond various features to an interior region of the enclosure without leaving a mark or trace to an exterior region of the enclosure in a location corresponding to the various features. Further, one or more features can be actuated against the enclosure to bond the one or more features by friction welding. In addition, a rotational friction welding machine can rotate a feature having a relatively small diameter at relatively high speeds against the enclosure to drive the feature into the enclosure and frictionally weld the feature with the enclosure. Also, the friction welding does not leave any an appearance of cosmetic deformation on the exterior region.

Techniques for bonding structural features together in an enclosure of an electronic device are disclosed. A structural feature may be ultrasonically soldered to the enclosure to provide structural support and form a magnetic circuit within the device. Also, ultrasonic welding can bond various features to an interior region of the enclosure without leaving a mark or trace to an exterior region of the enclosure in a location corresponding to the various features. Further, one or more features can be actuated against the enclosure to bond the one or more features by friction welding. In addition, a rotational friction welding machine can rotate a feature having a relatively small diameter at relatively high speeds against the enclosure to drive the feature into the enclosure and frictionally weld the feature with the enclosure. Also, the friction welding does not leave any an appearance of cosmetic deformation on the exterior region.