A wave soldering machine includes a wave soldering station configured to create a solder wave used to perform the wave soldering operation on the printed circuit board. The wave soldering machine further includes a finger conveyor system configured to deliver a printed circuit board to the wave soldering station. The finger conveyor system includes at least one chain conveyor including a chain having a plurality of fingers configured to support an edge of the printed circuit board. The finger conveyor system further includes a finger detection system having a tension roller assembly configured to engage each finger of the plurality of fingers. The tension roller assembly further is configured to move in response to engaging a finger in a non-operational position. The finger conveyor system further includes a sensor configured to detect movement of the tension roller assembly to the non-operational position.

A mold is used to form a solder joint to join the distal end of the guidewire to a wire coil. The mold has a cavity that can have different configurations so that the solder joint can be any of bullet shaped, micro-J shaped, cone shaped, truncated cone shaped, or have a textured surface.

A mold is used to form a solder joint to join the distal end of the guidewire to a wire coil. The mold has a cavity that can have different configurations so that the solder joint can be any of bullet shaped, micro-J shaped, cone shaped, truncated cone shaped, or have a textured surface.

A wave soldering station of a wave soldering machine includes a flow duct positioned in a reservoir of a solder pot, and a core frame supported by the flow duct. The wave soldering station further includes a first pump to deliver solder material to a first chamber, a second pump to deliver solder material to a second chamber, and a wave soldering nozzle assembly supported by the core frame. The wave soldering nozzle assembly includes a solder distribution baffle to create a solder wave, and an exit wing coupled to the core frame and configured to move from a lowered position to enable increased solder flow and a raised position to decrease flow of solder material. The first pump, the second pump and the exit wing are configured to control the flow of solder through the solder distribution baffle to vary a contact length of the solder wave.

A soldering system for processing at least one printed circuit board. The system comprises a first solder pot and a second solder pot, each configured to move within a movement plane. At least one of the first solder pot and the second solder pot is further configured to rotate about a solder pot axis extending transverse to the movement plane. The first solder pot and the second solder pot can be moved relative to the at least one printed circuit board, and at least one of the first solder pot and the second solder pot can be rotated about its solder pot axis relative to the at least one printed circuit board, to simultaneously process the at least one printed circuit board using both solder pots. The soldering system may thus be used to process either a single printed circuit board with both solder pots simultaneously or a pair of printed circuit boards simultaneously with each solder pot processing one of the pair of printed circuit boards. A corresponding soldering method is also disclosed.