A process for forming an electric heater comprising the steps: (a) providing a heater element and a power supply, (b) applying a layer of a copper paste onto the heater element and/or the power supply and drying the applied layer of copper paste, (c1) applying a solder agent onto the dried copper paste and appropriately arranging the heater element and the power supply such that the heater element and the power supply contact each other by means of the dried copper paste and the solder agent or (c2) appropriately arranging the heater element and the power supply such that the heater element and the power supply contact each other by means of the dried copper paste, and applying a solder agent next to the dried copper paste or (c3) if in step (b) the copper paste has been applied only onto the heater element and then dried, applying a solder agent onto the power supply and appropriately arranging the heater element and the power supply such that the heater element and the power supply contact each other by means of the dried copper paste and the solder agent or (c4) if in step (b) the copper paste has been applied only onto the power supply and then dried, applying a solder agent onto the heater element and appropriately arranging the heater element and the power supply such that the heater element and the power supply contact each other by means of the dried copper paste and the solder agent, and (d) diffusion soldering the arrangement produced in step (c1), (c2), (c3) or (c4) to form a connection between the heater element and the power supply, wherein the copper paste comprises or consists of (i) 66-99 wt.-% of at least one type of particles selected from the group consisting of copper particles, copper-rich copper/zinc alloy particles, and copper-rich copper/tin alloy particles, (ii) 0-20 wt.-% of at least one type of solder particles selected from the group consisting of tin particles, tin-rich tin/copper alloy particles, tin-rich tin/silver alloy particles, and tin-rich tin/copper/silver alloy particles, and (iii) 1-20 wt.-% of a vehicle.

The invention relates to a method for operating a soldering system for selective wave soldering comprising at least one solder crucible, the solder crucible comprising a solder reservoir, a solder nozzle and a solder pump, the solder pump being designed to guide the liquid solder out from the solder reservoir through the solder nozzle for generating a standing wave from liquid solder. The invention relates, in particular, to a method for cleaning a solder nozzle comprising the following steps: conveying solder from the solder reservoir at a first pump capacity which is adjusted in such a way that a standing wave of liquid solder is generated at a solder level which is below an upper edge of the nozzle outlet of the solder nozzle; introducing a cleaning agent into the nozzle outlet of the solder nozzle; increasing the pumping capacity of the solder pump to a second pump capacity such that the cleaning agent flows over the upper edge of the nozzle such that the cleaning agent is guided to an outer side of the solder nozzle.

A mold is used to form a solder joint to join the distal end of the guidewire to a wire coil. The mold has a cavity that can have different configurations so that the solder joint can be any of bullet shaped, micro-J shaped, cone shaped, truncated cone shaped, or have a textured surface.

The invention relates to a soldering nozzle for the simultaneous selective wave soldering of at least two spaced-apart rows of solder joints in a soldering installation, with a base portion which can be arranged on a nozzle plate, and with a wave portion which forms the solder wave during operation and which has a peripheral wall having a free upper side, and with at least one separating strip which can be inserted into the wave portion and which can be wetted with solder, wherein the at least one separating strip is formed as a frameless separating strip. The invention also relates to a soldering installation having a nozzle plate and having at least one soldering nozzle.

A method of manufacturing a pallet for use during manufacture of a printed circuit board assembly includes determining optimal solder flow for establishing connections between lead pins of a plurality of pin-through-hole components arranged on a circuit board, designing a pallet to include geometries configured to provide the optimal solder flow when the pallet, supporting the circuit board thereon, is passed through a wave solder machine, and creating the pallet based on the design. Pallets configured for optimal solder flow and methods of manufacturing printed circuit board assemblies using such pallet are also provided.

To provide a soldering method and a soldering apparatus which are capable of preheating a mask without degrading throughput. Provided is a soldering method including preheating a mask on which a substrate is not placed, placing the substrate on the preheated mask, and bringing at least a part of the substrate placed on the preheated mask into contact with molten solder and thus soldering the substrate.

To provide a soldering method and a soldering apparatus which are capable of preheating a mask without degrading throughput. Provided is a soldering method including preheating a mask on which a substrate is not placed, placing the substrate on the preheated mask, and bringing at least a part of the substrate placed on the preheated mask into contact with molten solder and thus soldering the substrate.

A soldering apparatus 100 including: a chamber 120 configured to contain solder and include an opening 122 configured to discharge the solder in a bottom surface or a side surface; a pump 140 configured to transport the solder to the chamber 120; and an inner bath 160 configured to communicate with the opening 120 and perform soldering using the solder fed through the opening 120.

Provided are a jet solder level confirmation jig and a method of handling the same, which allow the level of the jet wave of the molten solder to be accurately confirmed. A jet solder level confirmation jig is provided with a level confirmation unit for confirming a level of a jet wave of molten solder, a holding unit that holds the level confirmation unit, a notifying unit that notifies the level of the jet wave of the molten solder; and a bridge member having a length so as to be able to form a bridge in an upper part of a jet solder bath housed within a housing, the bridge member supporting the level confirmation unit in the upper part of the jet solder bath. The notifying unit is connected to a power supply unit of a jet soldering device.

An injection apparatus for injection material is disclosed. The injection apparatus includes a tank for storing material. The injection apparatus further includes a head body that has a surface for contacting a substrate and an opening part opened at the surface for discharging the material in fluid-communication with the tank. The injection apparatus further includes a member connected to the opening part, in which the member allows gas to flow into and flow out from the opening part.