The invention relates to a soldering system and a method for wave soldering, having at least one flux nozzle and a device for monitoring a state of a spray jet of the flux nozzle.

A wire automatic soldering system includes a carrier adapted to load an electrical product to be soldered, a robot adapted to grip and move the carrier on which the electrical product is loaded, a solder paste container containing a solder paste, and a heater configured to heat the solder paste and melt the solder paste into a liquid. The robot moves a plurality of wires of the electrical product into the solder paste container to solder the wires together with the solder paste.

A wire automatic soldering system includes a carrier adapted to load an electrical product to be soldered, a robot adapted to grip and move the carrier on which the electrical product is loaded, a solder paste container containing a solder paste, and a heater configured to heat the solder paste and melt the solder paste into a liquid. The robot moves a plurality of wires of the electrical product into the solder paste container to solder the wires together with the solder paste.

A control device of soldering device identifies the type of lead component to be soldered when soldering multiple types of lead components sequentially with jet device and reads out a value of a soldering parameter corresponding to the lead component type from an HDD. Then, the control device controls jet device so that the lead component is soldered based on the value of the soldering parameter. As a result, the lead of the lead component is soldered with the value of the soldering parameter corresponding to the type of the lead component.

A control device of soldering device identifies the type of lead component to be soldered when soldering multiple types of lead components sequentially with jet device and reads out a value of a soldering parameter corresponding to the lead component type from an HDD. Then, the control device controls jet device so that the lead component is soldered based on the value of the soldering parameter. As a result, the lead of the lead component is soldered with the value of the soldering parameter corresponding to the type of the lead component.

A method of pretinning a guidewire core made of shape memory alloy and having an elongate axis, comprising: placing a ball of solder in a pocket in a soldering block; melting the ball of solder; holding a guidewire core over the ball of solder; lowering the guidewire core into the ball of solder; removing the guidewire from the ball of solder.

A method of pretinning a guidewire core made of shape memory alloy and having an elongate axis, comprising: placing a ball of solder in a pocket in a soldering block; melting the ball of solder; holding a guidewire core over the ball of solder; lowering the guidewire core into the ball of solder; removing the guidewire from the ball of solder.

A wave soldering machine includes a housing and a conveyor configured to deliver a printed circuit board through the housing. The wave soldering machine further includes a wave soldering station coupled to the housing. The wave soldering station includes a reservoir of solder material, and a wave solder nozzle assembly configured to create a solder wave. The wave solder nozzle assembly has a nozzle core frame, a solder distribution baffle secured to the nozzle core frame, and a sliding plate that together define a nozzle. The sliding plate is movable with respect to the nozzle core frame between a close proximate position in which the nozzle is configured to produce a reduced width solder wave through the solder distribution baffle and a spaced apart position in which the nozzle is configured to produce an extended width solder wave through the solder distribution baffle.

Embodiments of the present invention relate to the field of soldering sheets, and provided therein are an ultra-thin soldering gasket and a preparation method therefor, a soldering method, and a semiconductor device. The ultra-thin soldering gasket comprises: an internal support structure and a solder layer which covers a surface of the internal support structure, the solder layer being formed by uniformly attaching a solder liquid to the surface of the internal support structure. The preparation method for an ultra-thin soldering gasket comprises the following steps: immersing an internal support structure that has passed through a surface treatment process into a solder liquid, then removing same, and cooling. The soldering method based on the ultra-thin soldering gasket comprises: placing an ultra-thin soldering gasket between soldering surfaces to be soldered, and then performing reflux soldering to form a semiconductor device. The ultra-thin soldering gasket is flat and is not warped, solders are uniform, the minimum thickness of a single layer is only five micrometers, and high-accuracy soldering requirements can be met.

Embodiments of the present invention relate to the field of soldering sheets, and provided therein are an ultra-thin soldering gasket and a preparation method therefor, a soldering method, and a semiconductor device. The ultra-thin soldering gasket comprises: an internal support structure and a solder layer which covers a surface of the internal support structure, the solder layer being formed by uniformly attaching a solder liquid to the surface of the internal support structure. The preparation method for an ultra-thin soldering gasket comprises the following steps: immersing an internal support structure that has passed through a surface treatment process into a solder liquid, then removing same, and cooling. The soldering method based on the ultra-thin soldering gasket comprises: placing an ultra-thin soldering gasket between soldering surfaces to be soldered, and then performing reflux soldering to form a semiconductor device. The ultra-thin soldering gasket is flat and is not warped, solders are uniform, the minimum thickness of a single layer is only five micrometers, and high-accuracy soldering requirements can be met.