An illustrative example method of making a magnetic drive component includes inserting a plurality of metal teeth into a metal tube. The teeth respectively have a first portion received against an inner surface of the tube. The teeth respectively have a second portion and a third portion spaced apart and projecting toward a center of the tube. The method includes securing the plurality of teeth to the tube.

An illustrative example method of making a magnetic drive component includes inserting a plurality of metal teeth into a metal tube. The teeth respectively have a first portion received against an inner surface of the tube. The teeth respectively have a second portion and a third portion spaced apart and projecting toward a center of the tube. The method includes securing the plurality of teeth to the tube.

The present disclosure provides a method of forming a hermetically sealed enclosure that comprises a diamond material. The method comprises providing first and second enclosure components comprising the diamond material and having first and second recesses, respectively, at edge portions. At least one of the first and second enclosure components has a cavity. The enclosure components have respective contact surfaces at the first and second recesses and are shaped such that an outer channel is formed by the co-operation of the first and second recesses when the first and second enclosure components are contacted at the contact surfaces to form the enclosure. The method further comprises bonding a first type of material to at least surface portions of the first and second recesses of the first and second enclosure components, respectively. The method also comprises bonding a second type of material to the first type of material so that the second type of material covers at least portions of the first type of material. The second type of material is biocompatible and suitable for forming a hermetically sealed seal. In addition, the method comprises contacting the enclosure components to form the enclosure and bonding the second type of material of the first enclosure component to the second type of material of the second enclosure component so as to form a hermetically sealed seal in the outer channel.

The present disclosure provides a method of forming a hermetically sealed enclosure that comprises a diamond material. The method comprises providing first and second enclosure components comprising the diamond material and having first and second recesses, respectively, at edge portions. At least one of the first and second enclosure components has a cavity. The enclosure components have respective contact surfaces at the first and second recesses and are shaped such that an outer channel is formed by the co-operation of the first and second recesses when the first and second enclosure components are contacted at the contact surfaces to form the enclosure. The method further comprises bonding a first type of material to at least surface portions of the first and second recesses of the first and second enclosure components, respectively. The method also comprises bonding a second type of material to the first type of material so that the second type of material covers at least portions of the first type of material. The second type of material is biocompatible and suitable for forming a hermetically sealed seal. In addition, the method comprises contacting the enclosure components to form the enclosure and bonding the second type of material of the first enclosure component to the second type of material of the second enclosure component so as to form a hermetically sealed seal in the outer channel.

The disclosure relates to a brazing method for joining substrates, in particular where one of the substrates is difficult to wet with molten braze material. The method includes formation of a porous metal layer on a first substrate to assist wetting of the first substrate with a molten braze metal, which in turn permits joining of the first substrate with a second substrate via a braze metal later in an assembled brazed joint. Ceramic substrates can be particularly difficult to wet with molten braze metals, and the disclosed method can be used to join a ceramic substrate to another substrate. The brazed joint can be incorporated into a solid-oxide fuel cell, for example as a stack component thereof, in particular when the first substrate is a ceramic substrate and the joined substrate is a metallic substrate.

The disclosure relates to a brazing method for joining substrates, in particular where one of the substrates is difficult to wet with molten braze material. The method includes formation of a porous metal layer on a first substrate to assist wetting of the first substrate with a molten braze metal, which in turn permits joining of the first substrate with a second substrate via a braze metal later in an assembled brazed joint. Ceramic substrates can be particularly difficult to wet with molten braze metals, and the disclosed method can be used to join a ceramic substrate to another substrate. The brazed joint can be incorporated into a solid-oxide fuel cell, for example as a stack component thereof, in particular when the first substrate is a ceramic substrate and the joined substrate is a metallic substrate.

A system may include a current source; a first metal or alloy component with a first major surface electrically coupled to the current source; a second metal or alloy component with a second major surface electrically coupled in series to the first component and the current source via an external electrical conductor, where the first and second major surfaces are positioned adjacent to each other to define a joint region; a metal or alloy powder disposed in at least a portion of the joint region; and a controller. The controller may be configured to cause the current source to output an alternating current that conducts through the first component and the second component to induce magnetic eddy currents, magnetic hysteresis, or both within at least a portion of the metal or alloy powder disposed in at least the first portion of the joint region.

One of a first metallic pipe containing a first metal as a main component and a second metallic pipe containing a second metal as a main component includes an expanded-diameter connecting part which is formed at an end part of the one metallic pipe. An inner diameter of the end part is greater than an inner diameter of an adjacent part that is adjacent to the end part. An intermetallic compound layer of the first and second metal is present at an interface of the first and second metal located between a brazing filler metal and the one or the other of the metallic pipes. A thickness of the intermetallic compound layer is configured such that the thickness of an end portion on the side of a base end is smaller than the thickness of an end portion on the side of an open end.

One of a first metallic pipe containing a first metal as a main component and a second metallic pipe containing a second metal as a main component includes an expanded-diameter connecting part which is formed at an end part of the one metallic pipe. An inner diameter of the end part is greater than an inner diameter of an adjacent part that is adjacent to the end part. An intermetallic compound layer of the first and second metal is present at an interface of the first and second metal located between a brazing filler metal and the one or the other of the metallic pipes. A thickness of the intermetallic compound layer is configured such that the thickness of an end portion on the side of a base end is smaller than the thickness of an end portion on the side of an open end.

The present invention provides a power module substrate including an insulating substrate, a circuit layer which is formed on one surface of the insulating substrate, and a metal layer which is formed on the other surface of the insulating substrate, in which the circuit layer has a first aluminum layer made of aluminum or an aluminum alloy which is bonded to the insulating substrate and a first copper layer made of copper or a copper alloy which is bonded to the first aluminum layer by solid-phase diffusion, the metal layer has a second aluminum layer made of aluminum or an aluminum alloy, and a relationship between a thickness t.sub.1 of the circuit layer and a thickness t.sub.2 of the second aluminum layer of the metal layer satisfy t.sub.1<t.sub.2.