A method is provided for joining at least two components of a medical instrument, the at least two components are held so as to form at least one soldering gap between mutually assigned joining areas of the components, a solder material is arranged for filling the at least one soldering gap, and the arrangement of the at least two components and of the solder material is heated to a soldering temperature of the solder material, wherein the solder material is an iron-based solder. A use of an iron-based solder and a medical instrument, in particular a laryngoscope spatula, are also provided.

A method is provided for joining at least two components of a medical instrument, the at least two components are held so as to form at least one soldering gap between mutually assigned joining areas of the components, a solder material is arranged for filling the at least one soldering gap, and the arrangement of the at least two components and of the solder material is heated to a soldering temperature of the solder material, wherein the solder material is an iron-based solder. A use of an iron-based solder and a medical instrument, in particular a laryngoscope spatula, are also provided.

A hollow aluminum structure that will be brazed includes at least one brazing sheet having a filler metal layer clad onto a core layer. The core layer is composed of aluminum or an aluminum alloy containing less than 0.2 mass % Mg. The filler metal layer is composed of an aluminum alloy that contains Si: 4.0-13.0 mass % and Bi: 0.01-0.3 mass %, and further contains Li: 0.004-0.08 mass % and/or Be: 0.006-0.12 mass %, the filler metal layer containing less than 0.1 mass % Mg. The hollow aluminum structure is assembled such that the filler metal layer is present at locations that will form both an interior-facing brazed joint and an exterior-facing brazed joint. Then, flux is applied onto the filler metal layer at the location that will form the exterior brazed joint, and the hollow aluminum structure heated in an inert gas atmosphere to form the interior brazed joint and the exterior brazed joint.

A hollow aluminum structure that will be brazed includes at least one brazing sheet having a filler metal layer clad onto a core layer. The core layer is composed of aluminum or an aluminum alloy containing less than 0.2 mass % Mg. The filler metal layer is composed of an aluminum alloy that contains Si: 4.0-13.0 mass % and Bi: 0.01-0.3 mass %, and further contains Li: 0.004-0.08 mass % and/or Be: 0.006-0.12 mass %, the filler metal layer containing less than 0.1 mass % Mg. The hollow aluminum structure is assembled such that the filler metal layer is present at locations that will form both an interior-facing brazed joint and an exterior-facing brazed joint. Then, flux is applied onto the filler metal layer at the location that will form the exterior brazed joint, and the hollow aluminum structure heated in an inert gas atmosphere to form the interior brazed joint and the exterior brazed joint.

A solder alloy has an alloy composition containing Zn of 3 through 25 mass %, Ti of 0.002 through 0.25 mass %, Al of 0.002 through 0.25 mass % and balance of Sn, a solder joint made of the solder alloy, and a jointing method using the solder alloy.

A solder alloy has an alloy composition containing Zn of 3 through 25 mass %, Ti of 0.002 through 0.25 mass %, Al of 0.002 through 0.25 mass % and balance of Sn, a solder joint made of the solder alloy, and a jointing method using the solder alloy.

A configuration for joining a ceramic layer has a thermal insulating material to a metallic layer. The configuration includes an interface layer made of metallic material located between the ceramic layer and the metallic layer, which includes a plurality of interlocking elements on one of its sides, facing the ceramic layer, the ceramic layer comprising a plurality of cavities aimed at connecting with the corresponding interlocking elements of the interface layer. The configuration also includes a brazing layer by means of which the interface layer is joint to the metallic layer. The invention also refers to a method for obtaining such a configuration.

A configuration for joining a ceramic layer has a thermal insulating material to a metallic layer. The configuration includes an interface layer made of metallic material located between the ceramic layer and the metallic layer, which includes a plurality of interlocking elements on one of its sides, facing the ceramic layer, the ceramic layer comprising a plurality of cavities aimed at connecting with the corresponding interlocking elements of the interface layer. The configuration also includes a brazing layer by means of which the interface layer is joint to the metallic layer. The invention also refers to a method for obtaining such a configuration.

In a lead-free solder bump, diffusion of Cu from intermetallic compound layers, which are respectively formed at joining interfaces with Cu electrodes is suppressed, so that the in metallic compound layers are not likely to disappear. Correspondingly, with the use of the intermetallic compound layers, Cu is not likely to diffuse from the Cu electrodes into the lead-free solder bump. Even when an electric current flows continuously between a first electronic member and a second electronic member through the lead-free solder bump, the occurrences of the electromigration phemenon and the thermomigration phenomenon are suppressed. Thus, the present invention provides a lead-free solder bump joining structure capable of suppressing the disconnection failure caused by the synergistic effect of the electromigration phenomenon and the thermomigration phenomenon.

In a lead-free solder bump, diffusion of Cu from intermetallic compound layers, which are respectively formed at joining interfaces with Cu electrodes is suppressed, so that the in metallic compound layers are not likely to disappear. Correspondingly, with the use of the intermetallic compound layers, Cu is not likely to diffuse from the Cu electrodes into the lead-free solder bump. Even when an electric current flows continuously between a first electronic member and a second electronic member through the lead-free solder bump, the occurrences of the electromigration phemenon and the thermomigration phenomenon are suppressed. Thus, the present invention provides a lead-free solder bump joining structure capable of suppressing the disconnection failure caused by the synergistic effect of the electromigration phenomenon and the thermomigration phenomenon.