The present disclosure provides an aluminium material for the manufacture of high-strength, soldered components, including an aluminium alloy. After soldering, the aluminium material is in materially-bonded contact with at least one solder layer. The object of providing an aluminium material is to provide not only good soldering properties and formability, but also high strength. This is achieved because the aluminium alloy of the aluminium material has a solidus temperature, and the aluminium material has an increase in yield strength compared to the state after soldering and cooling.

The present disclosure provides an aluminium material for the manufacture of high-strength, soldered components, including an aluminium alloy. After soldering, the aluminium material is in materially-bonded contact with at least one solder layer. The object of providing an aluminium material is to provide not only good soldering properties and formability, but also high strength. This is achieved because the aluminium alloy of the aluminium material has a solidus temperature, and the aluminium material has an increase in yield strength compared to the state after soldering and cooling.

A brazing sheet may be used for brazing under an atmosphere of an inert gas without flux. The brazing sheet may include at least three layers. The at least three layers may include a core material, a brazing material layer, and an intermediate layer. The at least three layers may be cladded by an outermost layer of the brazing material layer. The intermediate layer may be disposed on a face of the core material. The core material may be composed of a first aluminum alloy including at least one of (i) 0.20 weight % to 1.0 weight % of Cu, (ii) 0.8 weight % to 1.8 weight % of Mn, and (iii) 0.25 weight % to 1.5 weight % of Mg. The intermediate layer may be composed of a second aluminum alloy including 0.20 weight % or less of each of Si and Fe and 0.10 weight % or less of each of Cu, Mn, and Cr.

A brazing sheet may be used for brazing under an atmosphere of an inert gas without flux. The brazing sheet may include at least three layers. The at least three layers may include a core material, a brazing material layer, and an intermediate layer. The at least three layers may be cladded by an outermost layer of the brazing material layer. The intermediate layer may be disposed on a face of the core material. The core material may be composed of a first aluminum alloy including at least one of (i) 0.20 weight % to 1.0 weight % of Cu, (ii) 0.8 weight % to 1.8 weight % of Mn, and (iii) 0.25 weight % to 1.5 weight % of Mg. The intermediate layer may be composed of a second aluminum alloy including 0.20 weight % or less of each of Si and Fe and 0.10 weight % or less of each of Cu, Mn, and Cr.

A heat exchanger includes: a main body; and a tube sheet that is bonded to the main body with a brazing material and is used to fix the main body to a support by a fixing member. The tube sheet includes: a bonding surface to which the brazing material is applied; a rising portion that rises from the bonding surface; and a through-hole through which the fixing member is passed. The through-hole is opened at the rising portion, penetrates the tube sheet, and has an inner peripheral surface to which the brazing material is not applied. The main body includes heat transfer tubes through which refrigerant flows, and the tube sheet is bonded to surface of the heat transfer tube.

A ceramic circuit substrate having high bonding performance and excellent thermal cycling resistance properties, having a circuit pattern provided on a ceramic substrate with a braze material layer interposed therebetween, and a protruding portion formed by the braze material layer protruding from the outer edge of the circuit pattern, wherein: the braze material layer includes Ag, Cu, Ti, and Sn or In; and an Ag-rich phase is formed continuously for 300 μm or more, towards the inside, from an outer edge of the protruding portion, along a bonding interface between the ceramic substrate and the circuit pattern, and has a bonding void ratio of 1.0% or less.

A manufacturing method is provided during which a plurality of first apertures are formed in a first plate to provide an apertured first plate. A plurality of second apertures are formed in a second plate to provide an apertured second plate. The apertured first plate and the apertured second plate are bonded to a base sheet to form a structure. The base sheet is bent to form a bend in the structure between the apertured first plate and the apertured second plate.

A fixture assembly includes a first fixture portion, a second fixture portion that interfaces with the first fixture portion, and a sub-fixture movably mounted to the first fixture portion. A multiple of actuators selectively move the sub-fixture toward the second fixture portion. A method of manufacturing a fan blade includes deploying the sub-fixture from the first fixture portion to effectuate a peripheral diffusion bond to join the blade body and the cover of the fan blade.

A semiconductor device includes: a semiconductor die having a metal region; a substrate having a metal region; and a soldered joint between the metal region of the semiconductor die and the metal region of the substrate. One or more intermetallic phases are present throughout the entire soldered joint, each of the one or more intermetallic phases formed from a solder preform diffused into the metal region of the semiconductor die and the metal region of the substrate. The soldered joint has the same length-to-width aspect ratio as the semiconductor die.

A system for creating a braze joint within a component. The system includes an environment operable to reach a braze temperature sufficient to melt at least a portion of a braze material. The system also includes a component within the environment, the component including a base having a base surface, a recess depending from the base surface into the base to an inner edge, and a braze material within the recess and forming a cap above the base surface. The braze material fills the recess from the cap to the inner edge. The cap has an exposed braze surface. The system also includes an insulation layer that at least partially covers the exposed braze surface.