Patent classifications
B23K1/20
METHOD FOR BRAZING A METAL PART ONTO A ZIRCONIA COMPONENT, AND BRAZED IMPLANTABLE DEVICE
A method for brazing a metal part onto a surface of a zirconia component. The method involves the steps of altering the surface state of the component to permit the attachment of a first metallization layer, cleaning the component to eliminate the impurities from its surface, depositing a first metallization layer, having mainly titanium, on the surface of the component, depositing a second metallization layer, having mainly niobium, on the first metallization layer, applying the part against the second metallization layer, depositing a gold brazing metal on the part and the second metallization layer, cooling the brazed area in a temperature-controlled manner, and stress-relieving heat treatment being performed under load on the metal part before brazing.
Electronic assemblies having components with edge connectors
Circuit assemblies can be electrically interconnected by providing a circuit assembly having a top surface, a bottom surface, and a perimeter edge connecting the top and bottom surfaces, the perimeter edge being formed of insulative material and having a plurality of conductive features embedded in and exposed on the surface of the edge. The conductive features are arranged in contact sets, and each contact set is separated from adjacent contact sets by a portion of the perimeter edge that is free of conductive features. Each contact set includes conductive features that together form a distributed electrical connection to a single node. The insulative material is selectively removed to form recesses adjacent the conductive features exposing additional surface contact areas along lateral portions of the conductive features in the recesses.
Electronic assemblies having components with edge connectors
Circuit assemblies can be electrically interconnected by providing a circuit assembly having a top surface, a bottom surface, and a perimeter edge connecting the top and bottom surfaces, the perimeter edge being formed of insulative material and having a plurality of conductive features embedded in and exposed on the surface of the edge. The conductive features are arranged in contact sets, and each contact set is separated from adjacent contact sets by a portion of the perimeter edge that is free of conductive features. Each contact set includes conductive features that together form a distributed electrical connection to a single node. The insulative material is selectively removed to form recesses adjacent the conductive features exposing additional surface contact areas along lateral portions of the conductive features in the recesses.
HEAT EXCHANGER
A heat exchanger includes a plurality of flat tubes and a coupling header. The flat tubes are disposed in multiple tiers along a predetermined tube tier direction and in multiple rows so as to be adjacent to each other in a tube row direction intersecting the tube tier direction and the longitudinal direction of the flat tubes. The coupling header is formed by joining a first member to a plurality of second members in the tube tier direction. The first member has a plurality of through holes through which pass the first end portions of the flat tubes. The second members when joined to the first member forming a plurality of coupling passages where the first end portions of the flat tubes adjacent to each other in the tube row direction communicate with each other.
BRAZING METHODS USING POROUS INTERLAYERS AND RELATED ARTICLES
The disclosure relates to a brazing method for joining substrates, in particular where one of the substrates is difficult to wet with molten braze material. The method includes formation of a porous metal layer on a first substrate to assist wetting of the first substrate with a molten braze metal, which in turn permits joining of the first substrate with a second substrate via a braze metal later in an assembled brazed joint. Ceramic substrates can be particularly difficult to wet with molten braze metals, and the disclosed method can be used to join a ceramic substrate to another substrate. The brazed joint can be incorporated into a solid-oxide fuel cell, for example as a stack component thereof, in particular when the first substrate is a ceramic substrate and the joined substrate is a metallic substrate.
BRAZING METHODS USING POROUS INTERLAYERS AND RELATED ARTICLES
The disclosure relates to a brazing method for joining substrates, in particular where one of the substrates is difficult to wet with molten braze material. The method includes formation of a porous metal layer on a first substrate to assist wetting of the first substrate with a molten braze metal, which in turn permits joining of the first substrate with a second substrate via a braze metal later in an assembled brazed joint. Ceramic substrates can be particularly difficult to wet with molten braze metals, and the disclosed method can be used to join a ceramic substrate to another substrate. The brazed joint can be incorporated into a solid-oxide fuel cell, for example as a stack component thereof, in particular when the first substrate is a ceramic substrate and the joined substrate is a metallic substrate.
Joint structure for metallic pipes
One of a first metallic pipe containing a first metal as a main component and a second metallic pipe containing a second metal as a main component includes an expanded-diameter connecting part which is formed at an end part of the one metallic pipe. An inner diameter of the end part is greater than an inner diameter of an adjacent part that is adjacent to the end part. An intermetallic compound layer of the first and second metal is present at an interface of the first and second metal located between a brazing filler metal and the one or the other of the metallic pipes. A thickness of the intermetallic compound layer is configured such that the thickness of an end portion on the side of a base end is smaller than the thickness of an end portion on the side of an open end.
COATINGS TO PREVENT CUTTER LOSS IN STEEL BODY PDC DOWNHOLE TOOLS
Methods of preventing or reducing cutter loss in a steel body PDC drilling tool may include applying a hardfacing layer on a surface of a PDC cutter pocket to form a covered PDC cutter pocket, the hardfacing layer comprising a metal binder and coated tungsten carbide particles; and bonding a PDC cutter into the covered PDC cutter pocket with a brazing material. Steel body PDC drilling tools may include a steel body, a PDC cutter, a PDC cutter pocket, and a hardfacing layer. Methods of preventing or reducing cutter loss in a steel body PDC drilling tool may include applying a hardfacing layer on a surface of a PDC cutter pocket of the steel body PDC drilling tool; applying a coated buffering layer on the hardfacing layer to form a coated PDC cutter pocket; and bonding the PDC cutter into the coated PDC cutter pocket with a brazing material.
COATINGS TO PREVENT CUTTER LOSS IN STEEL BODY PDC DOWNHOLE TOOLS
Methods of preventing or reducing cutter loss in a steel body PDC drilling tool may include applying a hardfacing layer on a surface of a PDC cutter pocket to form a covered PDC cutter pocket, the hardfacing layer comprising a metal binder and coated tungsten carbide particles; and bonding a PDC cutter into the covered PDC cutter pocket with a brazing material. Steel body PDC drilling tools may include a steel body, a PDC cutter, a PDC cutter pocket, and a hardfacing layer. Methods of preventing or reducing cutter loss in a steel body PDC drilling tool may include applying a hardfacing layer on a surface of a PDC cutter pocket of the steel body PDC drilling tool; applying a coated buffering layer on the hardfacing layer to form a coated PDC cutter pocket; and bonding the PDC cutter into the coated PDC cutter pocket with a brazing material.
Solder preforms and solder alloy assembly methods
A method of assembling components, such as electronic components, onto a substrate, such as an electronic substrate, includes applying solder paste to an electronic substrate to form a solder paste deposit, placing a low temperature preform in the solder paste deposit, processing the electronic substrate at a reflow temperature of the solder paste to create a low temperature solder joint, and processing the low temperature solder joint at a reflow temperature that is lower than the reflow temperature of the solder paste. Other methods of assembling components and solder joint compositions are further disclosed.