A flux recovery device that recovers a flux component from a gaseous mixture. The flux recovery device includes a first water spray unit that sprays water into a gaseous mixture containing the flux component, a separation unit that includes an introduction port for introducing the gaseous mixture into which water is sprayed from the first water spray unit, and a second water spray unit that forms a precipitation flow inside of the separation unit. The separation unit uses a swirling flow to separate the flux component from the gaseous mixture. A condensation unit cools water vapor generated in the separation unit to change the water vapor to water droplets, thereby removing the water vapor. Water vapor generated in a separation unit is cooled by a condensation unit, recovered as water droplets, and reused.

Nanometers thick conformal coatings deposited by atomic-layer deposition (ALD) onto the metal surface of an active braze joint modifies the surface chemistry to eliminate excess braze filler metal flow. Unlike other means used to prevent braze filler metal runout, the thin ALD coating does not hinder next assembly processes, does not require post-braze cleaning, and does not alter the base material mechanical properties.

Nanometers thick conformal coatings deposited by atomic-layer deposition (ALD) onto the metal surface of an active braze joint modifies the surface chemistry to eliminate excess braze filler metal flow. Unlike other means used to prevent braze filler metal runout, the thin ALD coating does not hinder next assembly processes, does not require post-braze cleaning, and does not alter the base material mechanical properties.

A shield for shielding a portion of an electronic component from undesirable emissions from neighboring components. The shield comprises a metal body configured to be attached to a substrate, and solder selectively applied to a lower portion of the metal body in manner that allows for both location and volume of the solder to be controlled. A bond is created between the solder and the metal body. The bond may be a metallurgical bond created by proximity of the solder to the at least one leg and sufficient heat and time to bring the solder to a melting temperature of the solder; or a diffusion bond created by heat and pressure. A method of attaching the shield to the substrate is also described.

A shield for shielding a portion of an electronic component from undesirable emissions from neighboring components. The shield comprises a metal body configured to be attached to a substrate, and solder selectively applied to a lower portion of the metal body in manner that allows for both location and volume of the solder to be controlled. A bond is created between the solder and the metal body. The bond may be a metallurgical bond created by proximity of the solder to the at least one leg and sufficient heat and time to bring the solder to a melting temperature of the solder; or a diffusion bond created by heat and pressure. A method of attaching the shield to the substrate is also described.

A screen (24A-H) of a specified thickness (T) for insertion in a gap (32) between surfaces of workpieces (32, 34) to be joined by brazing. The screen thickness determines and maintains the gap thickness during brazing. The screen has a higher melting point than the braze filler material (22), is wettable by a melt of the braze filler material, and may have a higher tensile strength than the braze filler material at operating temperatures of the braze joint. The screen may include electrical resistance heating wires (52, 62) to melt the filler material (46). The screen may be covered by the filler material, forming a brazing foil (20B). The screen may include electrically conductive insulated wires (92, 93) connected to a sensor (95) such as a thermocouple or strain gauge to monitor a condition of the braze joint during subsequent operation.

Microfeature workpieces having alloyed conductive structures, and associated methods are disclosed. A method in accordance with one embodiment includes applying a volume of material to a bond pad of a microfeature workpiece, with the volume of material including a first metallic constituent and the bond pad including a second constituent. The method can further include elevating a temperature of the volume of material while the volume of material is applied to the bond pad to alloy the first metallic constituent and the second metallic constituent so that the first metallic constituent is alloyed generally throughout the volume of material. A thickness of the bond pad can be reduced from an initial thickness T1 to a reduced thickness T2.

A surface treatment method for aluminum heat exchangers including (a) a step wherein a chemical conversion coating film is formed on the surface of an aluminum heat exchanger by subjecting the aluminum heat exchanger to chemical conversion using a chemical conversion agent; (b) a step wherein the aluminum heat exchanger, the surface of which has been provided with a chemical conversion coating film in step (a), is brought into contact with a hydrophilizing agent that contains a hydrophilic resin; and (c) a step wherein a hydrophilized coating film is formed on the surface of the aluminum heat exchanger by baking the aluminum heat exchanger, which has been subjected to a contact treatment in step (b). The chemical conversion agent used in step (a) contains zirconium and/or titanium in an amount of 5-5,000 ppm by mass in total, vanadium in an amount of 10-1,000 ppm by mass and a metal stabilizer in an amount of 5-5,000 ppm by mass. In addition, the chemical conversion agent used in step (a) has a pH of 2-6.

A surface treatment method for aluminum heat exchangers including (a) a step wherein a chemical conversion coating film is formed on the surface of an aluminum heat exchanger by subjecting the aluminum heat exchanger to chemical conversion using a chemical conversion agent; (b) a step wherein the aluminum heat exchanger, the surface of which has been provided with a chemical conversion coating film in step (a), is brought into contact with a hydrophilizing agent that contains a hydrophilic resin; and (c) a step wherein a hydrophilized coating film is formed on the surface of the aluminum heat exchanger by baking the aluminum heat exchanger, which has been subjected to a contact treatment in step (b). The chemical conversion agent used in step (a) contains zirconium and/or titanium in an amount of 5-5,000 ppm by mass in total, vanadium in an amount of 10-1,000 ppm by mass and a metal stabilizer in an amount of 5-5,000 ppm by mass. In addition, the chemical conversion agent used in step (a) has a pH of 2-6.

Provided are a device packing facility and method using phthalate and a device processing apparatus utilizing the phthalate. The device packaging facility includes a mounting unit providing phthalate between first and second devices to attach the first and second devices to each other, a processing unit thermally processing the first and second devices that are attached to each other to remove the phthalate and fix the first and second devices to each other, and a transfer unit transferring the first and second devices that are attached to each other from the mounting unit to the processing unit.