A soldering and de-soldering station and systems including enhanced features for the soldering heating tools, load detection functionality, tip management, automatic tip temperature calibration, cartridge/handle position and movement sensing and interactive capabilities.

A solder removal apparatus is provided. The solder removal apparatus comprises a plurality of solder-interfacing protrusions extending from a body by a length. Each of the plurality of solder-interfacing protrusions is configured to remove a corresponding one of a plurality of solder features from a semiconductor device, where each of the plurality of solder features has a height and an amount of solder material.

Disclosed is a solder punch tool and method of using the same. The solder punch tool includes an extensible rod, such as a graphite rod, extensible from a first end of the solder punch tool, and a metal punch on an opposite end of the solder punch tool. Optionally, an A/C power cord and a light may each be removably attachable to the solder punch tool. In use, a user may melt solder clogging a hole in a printed circuit board, push a portion of the extensible rod through the hole and the molten solder, break off a portion of the extensible rod extending through the hole in the printed circuit board, and push such broken portion of the extensible rod through the hole using the metal punch so as to clear the hole to receive a replacement component.

Embodiments include a paste transfer tool (PTT), a semiconductor package, and a method of forming the semiconductor package with the paste transfer tool. The PTT includes a top surface and a bottom surface. The PTT also includes one or more pins, where each pin has a first end and a second end, and where the first end is disposed on the body and the second end has a nozzle tip. The method of forming the semiconductor package includes dipping the nozzle tip of the PTT in a paste reservoir to form paste dots on the nozzle tip; disposing the paste dots on one or more pads of a substrate with the PTT; and forming one or more bumps from the on paste dots on the one or more pads of the substrate, where the pads of the substrate are positioned on one or more regions of the substrate.

A worktable for a soldering iron a base plate with two fixed plates perpendicularly extending from the top thereof. At least one of the two fixed plates has a first locking member and a first notch. A movable plate is movably located between the two fixed plates for securing a larger part. The movable plate has a second notch for securing small part. An adjustment member rotatably extends through the two fixed plates and the movable plate to adjust a fitting distance for the solder parts. An axle is connected across the two fixed plates and carries a soldering wire roll thereto. A soldering iron seat is located beside one of the two fixed plates for receiving the soldering iron therein.

A worktable for a soldering iron a base plate with two fixed plates perpendicularly extending from the top thereof. At least one of the two fixed plates has a first locking member and a first notch. A movable plate is movably located between the two fixed plates for securing a larger part. The movable plate has a second notch for securing small part. An adjustment member rotatably extends through the two fixed plates and the movable plate to adjust a fitting distance for the solder parts. An axle is connected across the two fixed plates and carries a soldering wire roll thereto. A soldering iron seat is located beside one of the two fixed plates for receiving the soldering iron therein.

Gerber data for a substrate includes coordinates for physical features on the substrate. The coordinates are relative to a substrate origin point on the substrate. The gerber data allows a user to specify any of the physical features as soldering targets of a soldering apparatus that includes a motor for moving a soldering iron according to coordinates relative to a system origin point of the soldering apparatus. When the substrate is placed on the soldering apparatus, its substrate origin point differs from the system origin point of the soldering apparatus. The user may input coordinates for the substrate origin point, which are used by the soldering apparatus to derive coordinates, usable by soldering apparatus, from coordinates in the gerber data. In this way, it is possible to reduce the workload of the user when programming the soldering apparatus to perform a soldering process.

The invention discloses a smart desoldering device and method for laser removal of substrate solder mask driven by artificial intelligence. The smart desoldering device includes an artificial intelligence (AI) system including a database unit, a learning and training unit, a parameter optimization setting unit, a condition restriction unit and an AI model processing unit, a control processing module, a camera module and a laser desoldering module. The artificial intelligence (AI) system is used to learn and pre-train the types, sizes and thicknesses of substrates, the colors and thickness of solder mask and the depth around solder pads, and automatically optimize and set all processing parameters according to the characteristics of the substrate to be processed. The artificial intelligence (AI) system controls the laser desoldering module to perform laser desoldering on the substrate according to the first control command and a circuit layout diagram.

A soldering tip fastening device includes a soldering device fastener configured for fastening the soldering tip fastening device on a soldering device, and a soldering tip fastener configured to fasten a soldering tip on a soldering device when the soldering tip fastening device is fastened to the soldering device. The soldering tip fastener and the soldering device fastener are associated with opposite ends of the soldering tip fastening device. The soldering tip fastening device has a sleeve with an elastic element, the sleeve being configured such that the elastic element is tensioned during the fastening of the soldering tip on the soldering device by the soldering tip fastening device.

A soldering tip fastening device includes a soldering device fastener configured for fastening the soldering tip fastening device on a soldering device, and a soldering tip fastener configured to fasten a soldering tip on a soldering device when the soldering tip fastening device is fastened to the soldering device. The soldering tip fastener and the soldering device fastener are associated with opposite ends of the soldering tip fastening device. The soldering tip fastening device has a sleeve with an elastic element, the sleeve being configured such that the elastic element is tensioned during the fastening of the soldering tip on the soldering device by the soldering tip fastening device.