The present invention provides a substrate provided with a land to which the tip of a magnetic wire is to be soldered and a resin wall formed around and higher than the land. The resin wall has an inclined surface inclined at an angle greater than 90 with respect to the land.

The present invention provides a substrate provided with a land to which the tip of a magnetic wire is to be soldered and a resin wall formed around and higher than the land. The resin wall has an inclined surface inclined at an angle greater than 90 with respect to the land.

A soldering tool includes a housing having a handle portion defining a first longitudinal axis, and a head portion coupled to the handle portion and defining a second axis. The soldering tool further includes a heating element coupled to the head portion for movement therewith. The head portion is movable relative to the handle portion between a first orientation in which the second axis is coaxial with the first axis, and a second orientation in which the second axis is non-coaxial with the first axis.

A worktable for a soldering iron a base plate with two fixed plates perpendicularly extending from the top thereof. At least one of the two fixed plates has a first locking member and a first notch. A movable plate is movably located between the two fixed plates for securing a larger part. The movable plate has a second notch for securing small part. An adjustment member rotatably extends through the two fixed plates and the movable plate to adjust a fitting distance for the solder parts. An axle is connected across the two fixed plates and carries a soldering wire roll thereto. A soldering iron seat is located beside one of the two fixed plates for receiving the soldering iron therein.

A worktable for a soldering iron a base plate with two fixed plates perpendicularly extending from the top thereof. At least one of the two fixed plates has a first locking member and a first notch. A movable plate is movably located between the two fixed plates for securing a larger part. The movable plate has a second notch for securing small part. An adjustment member rotatably extends through the two fixed plates and the movable plate to adjust a fitting distance for the solder parts. An axle is connected across the two fixed plates and carries a soldering wire roll thereto. A soldering iron seat is located beside one of the two fixed plates for receiving the soldering iron therein.

A resistance soldering apparatus suited for soldering an electrical terminal to a glass surface and a method of using such an apparatus is described herein. The resistance soldering apparatus includes an electrode having a distal tip and an electrical terminal having a first major surface in which an indentation is defined and a second major surface opposite the first major surface on which a layer of a solder composition is disposed. The indentation is configured to receive the distal tip of the electrode. The distal tip of the electrode is placed within the indentation and an electrical current is passed through the electrode and the electrical terminal, The electrical current is sufficient to heat the electrode and melt the solder composition on the second major surface.

In a solder processing device (A) which includes: a substantially tubular iron tip (5) that can be heated and that is extended vertically; and a solder piece supply portion (2, 6) that supplies a solder piece (Wh) from above into the iron tip (5), and in which the heat of the iron tip (5) is used to melt the solder piece (Wh) such that the molten solder is supplied downward, the supplied solder piece (Wh) is forcefully brought into contact with the inner wall of the iron tip (5). In this way, it is possible to more reliably heat and melt the solder piece (Wh) by use of the heat of the iron tip (5).

A substantially tubular iron tip (5) that can be heated and that is extended vertically and a solder piece supply portion that supplies a first solder piece (Wh1) and a second solder piece (Wh2) in which a layer of a flux (72) is provided within a tubular solder layer in this order from above into the iron tip are provided, within the iron tip, the solder pieces are erected such that on the first solder piece, the second solder piece rides and the heat of the iron tip is used to melt the first solder piece and the second solder piece such that the molten solder is supplied downward. In this way, it is possible to more reliably heat and melt the solder pieces in a posture in which they are erected within the iron tip.

A substantially tubular iron tip (5) that can be heated and that is extended vertically and a solder piece supply portion that supplies a first solder piece (Wh1) and a second solder piece (Wh2) in which a layer of a flux (72) is provided within a tubular solder layer in this order from above into the iron tip are provided, within the iron tip, the solder pieces are erected such that on the first solder piece, the second solder piece rides and the heat of the iron tip is used to melt the first solder piece and the second solder piece such that the molten solder is supplied downward. In this way, it is possible to more reliably heat and melt the solder pieces in a posture in which they are erected within the iron tip.

The invention details the designs of cleaning pad assemblies for use with heating tools including for example soldering cartridges and soldering irons. The cleaning pads of the assembly are designed to effectively remove and clean the solder from heating tools during and at the end of soldering operations, and allow the collection of the removed solder.