The present invention discloses a vacuum reacting force welding method, comprising the following steps: die-bonding a chip onto a substrate through soldering to form a semi-finished product; placing the semi-finished product into a vacuum eutectic cavity (6) of a vacuum eutectic stove; vacuum-pumping the vacuum eutectic cavity; preheating the vacuum eutectic cavity to slowly increase the temperature; heating the vacuum eutectic cavity quickly to melt the solder; applying an acting force to the vacuum eutectic cavity to accelerate a rise of the vacuum eutectic cavity after the vacuum eutectic cavity descends; performing forced refrigeration to the exterior of the vacuum eutectic cavity, while introducing a protective gas to the interior thereof; releasing the vacuum state of the vacuum eutectic cavity after the solder is solidified. This invention also discloses a welding device using the vacuum reacting force eutectic welding method described herein.

The invention relates to a soldering tip assembly for an electric soldering device, in particular a soldering iron. The soldering tip assembly is designed to be releasably arranged on a soldering device handle which has a heating element, and the soldering tip assembly has a sleeve with a soldering tip provided on the distal end of the sleeve. The sleeve has an opening at the proximal end for introducing the heating element, wherein a holding element which at least partially surrounds the sleeve in an annular manner and a spring element which is provided between the holding element and the sleeve are provided, the spring element pushing the holding element in the distal direction. The sleeve has at least one stop arranged distally from the spring element. The stop secures the holding element against the soldering tip assembly in the distal direction.

An annular structure for an electronic flame off (EFO) wand of a wire bonder is positioned beneath a capillary of the wire bonder. The annular structure provides uniform heat to a bond wire extending from the capillary to form a free air ball (FAB). Because heat is uniformly applied to the bond wire, the FAB is uniformly formed and is centered with respect to the capillary. The FAB is then bonded to a bond pad of a substrate. Because the FAB was uniformly formed and is centered on the capillary, the FAB will also be centered on the bond pad.

The invention is directed to designs for heater-sensor sub-assemblies for soldering cartridges and de-soldering cartridges for soldering systems. The designs provide a high thermal capacity and accurate tip temperature sensing and control features. The coil portion of the heater assembly is spaced proximally from the distal end of the subassembly to segregate the coil from the thermocouple temperature sensor. The solder cartridges include connector wires of dissimilar sizes and materials to couple the heater coil wire to the connections of a handle and the soldering station to reduce heat conduction to the handle.

The invention is directed to designs for heater-sensor sub-assemblies for soldering cartridges and de-soldering cartridges for soldering systems. The designs provide a high thermal capacity and accurate tip temperature sensing and control features. The coil portion of the heater assembly is spaced proximally from the distal end of the subassembly to segregate the coil from the thermocouple temperature sensor. The solder cartridges include connector wires of dissimilar sizes and materials to couple the heater coil wire to the connections of a handle and the soldering station to reduce heat conduction to the handle.

A holding stand for a heating tool such as a soldering or de-soldering device. The holding stand has a rotary member for securing the heating tool and an assembly for moving and positioning the rotary member with the heating tool in any of three axis.

A modular soldering station includes a first platform having a liquid reservoir and a solder dispenser, a power supply assembled to the first platform and configured to power a soldering iron, and a second platform assembled to one of the first platform or the power supply and having a fluid absorbent medium fluidly coupled to the liquid reservoir.

Reflow Grid Array technology may be implemented on an interposer device, where the interposer is placed between a motherboard and a BGA package. The interposer may provide a controlled heat source to reflow solder between the interposer and the BGA package. A technical problem faced by an interposer using RGA technology is solder cleaning and removal when removing a BGA package. Technical solutions described herein provide processes and equipment for bulk solder removal from a BGA package that can be executed in the field.

Disclosed are processes and apparatuses for semiconductor die removal and rework, including thin dies. In one aspect the process involves the use of a localized induction heating system to melt targeted solder joints, thereby minimizing the degradation of the thermal performance of the assembly undergoing the rework. Use of a vacuum-based die removal head, optionally in combination with the induction heating system, allows for the removal of thin dies of 150 micrometers thick or less.

A detachment apparatus for detaching at least one component (120) from a circuit board (125) can include a shaft (105) configured to rotate about a central axis, at least one lever (110) having a first end and a second end, the lever being attached to the shaft at the first end, and a hook (115) attached to the second end of the lever. Rotation of the shaft causes the hook to come into contact with the component on the circuit board, and the hook is configured to separate the component from the circuit board.