A rework process includes attaching a first bond head to a first semiconductor package. The contact pads of the first semiconductor package are bonded to contact pads of a second semiconductor package by solder joints. The rework process further includes performing a first local heating process to melt the solder joints, removing the first semiconductor package using the first bond head, and removing at least a portion of solder from the contact pads of the second semiconductor package.

A soldering iron station and a method thereof for a soldering joint connection validation, the method including: identifying a type of the soldering cartridge being used; performing a preliminary validation by measuring the soldering tip temperature, after the soldering event has started; monitoring the power level delivered to the soldering tip to detect liquidus occurrence; determining the thickness of an intermetallic component (IMC) of the soldering joint; determining whether the thickness of the IMC is within a predetermined range, within a predetermined cooling time period; and indicating that a reliable soldering joint connection is formed, when the thickness of the IMC is within the predetermined range, within the predetermined cooling time period.

An intelligent soldering cartridge that includes: a housing; a solder tip; a heater for heating the solder tip; a storage device for storing information about characteristics of the cartridge; a processor for retrieving the information about characteristics of the cartridge, monitoring the power level delivered to the solder tip to detect liquidus occurrence at a solder joint, determining a thickness of an intermetallic compound (IMC) of the solder joint using some of the retrieved information, determining whether the thickness of the IMC is within a predetermined range, and generating an indication signal indicating that a reliable solder joint connection is formed when the thickness of the IMC is within the predetermined range; and an interface for transmitting the indication signal.

An intelligent soldering cartridge that includes: a housing; a solder tip; a heater for heating the solder tip; a storage device for storing information about characteristics of the cartridge; a processor for retrieving the information about characteristics of the cartridge, monitoring the power level delivered to the solder tip to detect liquidus occurrence at a solder joint, determining a thickness of an intermetallic compound (IMC) of the solder joint using some of the retrieved information, determining whether the thickness of the IMC is within a predetermined range, and generating an indication signal indicating that a reliable solder joint connection is formed when the thickness of the IMC is within the predetermined range; and an interface for transmitting the indication signal.

A desoldering tool and control system including enhanced features for detecting solder clogging as well as on-delay and sleep mode functions to enhance the life of the desoldering tool components.

Disclosed is a solder punch tool and method of using the same. The solder punch tool includes an extensible rod, such as a graphite rod, extensible from a first end of the solder punch tool, and a metal punch on an opposite end of the solder punch tool. Optionally, an A/C power cord and a light may each be removably attachable to the solder punch tool. In use, a user may melt solder clogging a hole in a printed circuit board, push a portion of the extensible rod through the hole and the molten solder, break off a portion of the extensible rod extending through the hole in the printed circuit board, and push such broken portion of the extensible rod through the hole using the metal punch so as to clear the hole to receive a replacement component.

A soldering iron head includes a bottom surface, a first side surface, a second side surface opposite to the first side surface, and a positioning slot formed on the bottom surface and extending between the first side surface and the second side surface. The positioning slot is adapted to accommodate and position an exposed end conductor of a cable. The cross section of the positioning slot is trapezoidal in shape, absent a lower bottom. An upper bottom facing side of the trapezoidal cross section of the positioning slot gradually increases in width from the first side surface to the second side surface.

The invention relates to a stand of a soldering system and to a soldering system. In addition to the stand, the soldering system includes an electric soldering device, in particular a soldering iron, with a handle, a heating element provided on the handle, and a soldering tip assembly which can be releasably secured to the handle and has a holding element. The stand has at least one exchangeable holder which is formed about an insertion axis and is designed to at least partly complement a holding element such that a soldering tip assembly arranged on the handle can be introduced into the exchangeable holder along the insertion axis, and the exchangeable holder has an anti-rotation element which interacts with the holding element such that, when the soldering tip assembly is inserted into the exchangeable holder, the holding element is rotationally fixed in the exchangeable holder when the handle is rotated from the securing position into the removal position.

A bond head assembly for bonding a semiconductor element to a substrate is provided. The bond head assembly includes a base structure, a heater, and a clamping system securing the heater to the base structure. The clamping system includes a plurality of elastic elements constraining the heater along a plurality of axes.

A welding assembly includes a sonotrode, cleaning station, and controller. The controller periodically commands clamping of the sonotrode onto the cleaning block, and a transmission of ultrasonic energy into the cleaning block for a calibrated duration sufficient for removing residual amounts of metal from welding pads of the sonotrode. The cleaning block may include an aluminum bar coated with a polymeric material, e.g., porous polyethylene silica or alumina composite. A thin sacrificial layer of an anti-adhesion material, e.g., colloidal silica, may be periodically applied to the welding pads, particularly after a transition from welding a first metal to welding a second metal. The sacrificial layer may be applied via a sponge, a saturated surface, or spraying.