Provided are flux for resin flux cored solder, flux for flux-coated solder, resin flux cored solder using the flux for resin flux cored solder, flux-coated solder using the flux for flux-coated solder, and a soldering method, which have low residue and are excellent in processability. The flux for resin flux cored solder or flux-coated solder contains a solid solvent in an amount of 70 wt % or more and 99.5 wt % or less, and an activator in an amount of 0.5 wt % or more and 30 wt % or less.

Provided are flux for resin flux cored solder, flux for flux-coated solder, resin flux cored solder using the flux for resin flux cored solder, flux-coated solder using the flux for flux-coated solder, and a soldering method, which have low residue and are excellent in processability. The flux for resin flux cored solder or flux-coated solder contains a solid solvent in an amount of 70 wt % or more and 99.5 wt % or less, and an activator in an amount of 0.5 wt % or more and 30 wt % or less.

A brazing system includes a touch screen display and a controller circuit board having a processor and a memory. The controller circuit board is configured to be manually set by an operator to support a single torch configuration or a multiple torch configuration. The single torch configuration includes a first integrated software having first computer-executable instructions stored in the memory and configured to execute on the processor, and the multiple torch configuration includes a second integrated software having second computer-executable instructions stored in the memory and configured to execute on the processor. The multiple torch configuration supports the independent setting up of multiple brazing torches and the simultaneous use of the multiple brazing torches by multiple users during multiple independent brazing processes. The controller circuit board is operatively connected to the touch screen display and configured to allow user interaction with the controller circuit board via the touch screen display.

A bond head for a thermocompression bonder is provided. The bond head includes a tool configured to hold a workpiece to be bonded, a heater configured to heat the workpiece to be bonded, and a chamber proximate the heater. The chamber is configured to receive a cooling fluid for cooling the heater.

A bond head for a thermocompression bonder is provided. The bond head includes a tool configured to hold a workpiece to be bonded, a heater configured to heat the workpiece to be bonded, and a chamber proximate the heater. The chamber is configured to receive a cooling fluid for cooling the heater.

The disclosure provides a soldering component and a method of assembling a soldering component to objects, the soldering component comprises a body part and an assembling part, the assembling part is for combining to the object, the body part has a snap-fit part, the snap-fit part has an elastic retracting space, and the elastic retracting space can elastically retract two or more fastening parts, so that each fastening part fastens into another object, and the soldering component has a solderable surface for soldering to an assembling part of the object, the assembling part of the object is preset with a tin soldering layer, which is heated and soldered the soldering component and the assembling part of the object.

A method for producing a wired circuit board, including an insulating layer having a first through portion passing through in a thickness direction thereof and a first terminal portion having a second through portion overlapped with the first through portion when projected in the thickness direction, includes the steps of providing a first bonding material at one surface in the thickness direction of the first terminal portion and allowing the first bonding material to flow from the one surface in the thickness direction of the first terminal portion toward the other surface in the thickness direction thereof into the second through portion by allowing the first bonding material to flow.

A method for producing a wired circuit board, including an insulating layer having a first through portion passing through in a thickness direction thereof and a first terminal portion having a second through portion overlapped with the first through portion when projected in the thickness direction, includes the steps of providing a first bonding material at one surface in the thickness direction of the first terminal portion and allowing the first bonding material to flow from the one surface in the thickness direction of the first terminal portion toward the other surface in the thickness direction thereof into the second through portion by allowing the first bonding material to flow.

In a solder processing device (A) which includes: a substantially tubular iron tip (5) that can be heated and that is extended vertically; and a solder piece supply portion (2, 6) that supplies a solder piece (Wh) from above into the iron tip (5), and in which the heat of the iron tip (5) is used to melt the solder piece (Wh) such that the molten solder is supplied downward, the supplied solder piece (Wh) is forcefully brought into contact with the inner wall of the iron tip (5). In this way, it is possible to more reliably heat and melt the solder piece (Wh) by use of the heat of the iron tip (5).

In a solder processing device (A) which includes: a substantially tubular iron tip (5) that can be heated and that is extended vertically; and a solder piece supply portion (2, 6) that supplies a solder piece (Wh) from above into the iron tip (5), and in which the heat of the iron tip (5) is used to melt the solder piece (Wh) such that the molten solder is supplied downward, the supplied solder piece (Wh) is forcefully brought into contact with the inner wall of the iron tip (5). In this way, it is possible to more reliably heat and melt the solder piece (Wh) by use of the heat of the iron tip (5).