A bond head assembly includes a collet and a planar compliant locating structure having a plane. The collet is operative to hold a die during a bonding process. The planar compliant locating structure includes a first flexural element that is positioned to contact a first side surface of the collet and a second flexural element that is positioned to contact a second side surface of the collet. The first and second side surfaces of the collet are substantially orthogonal to each other. Each of the first and second flexural elements is arranged such that a portion thereof is deflectable by movement of the collet against the flexural element, thereby causing the first or second flexural element to exert a biasing force against the first or second side surface of the collet along the plane of the compliant locating structure to restrict positional shifts of the collet towards the flexural element.

A bond head assembly includes a collet and a planar compliant locating structure having a plane. The collet is operative to hold a die during a bonding process. The planar compliant locating structure includes a first flexural element that is positioned to contact a first side surface of the collet and a second flexural element that is positioned to contact a second side surface of the collet. The first and second side surfaces of the collet are substantially orthogonal to each other. Each of the first and second flexural elements is arranged such that a portion thereof is deflectable by movement of the collet against the flexural element, thereby causing the first or second flexural element to exert a biasing force against the first or second side surface of the collet along the plane of the compliant locating structure to restrict positional shifts of the collet towards the flexural element.

In an embodiment, a soldering tip is configured for a number of solder pads at a number of radial locations and includes a soldering head, a shank, and a number of soldering feet. The soldering head is made of a thermally-conductive, corrosion-resistant material. The soldering head defines an upper head surface and a curved forward extension, the curved forward extension descending from the upper surface. The curved forward extension is lengthwise convexly curved and defines an extension face obverse to the upper head surface. The shank is coupled to the upper head surface of the soldering head and is configured to operatively couple with a soldering iron. The shank is made of a thermally conductive material. The soldering feet are operatively coupled to and protrude from the extension face. The soldering feet are configured to transfer bonding energy to the corresponding solder pads.

Semiconductor manufacturing equipment including a main body having a bonding head, a head heater at a bottom of the bonding head, the head heater including a thermal compression surface, negative pressure channels recessed from the thermal compression surface and the negative pressure channels including holes therein, and a bonding tool having a first surface, a second surface, grooves at the first surface, the first surface configured to contact the thermal compression surface, and the second surface opposite to the first surface contacting a semiconductor chip for thermal compression may be provided.

A method for manufacturing a soldered product by soldering a solder object portion, including: a solder supplying step that causes a cylindrical soldering iron having a through hole to contact with the solder object portion to supply a thread solder piece to the solder object portion from the through hole; a heating step that heats the thread solder piece with the cylindrical soldering iron and causes to melt the thread solder piece at the solder object portion; and a curing step that cures a melting object of the thread solder piece to solder the solder object portion. The thread solder piece is composed of a core containing a flux and a coating member containing a solder alloy that covers the core. The flux has a rosin having an acid value which is substantially as a main component thereof.

An iron holder includes a stand body, a rest, and a heat shield configured to at least partially surround a soldering iron. The stand body includes a tip support portion, a base portion, an intermediate portion, an accessory holding portion, and a handle support portion. The tip support portion is higher in elevation than the handle support portion, creating a tip-up angle for the soldering iron to rest at. The heat shield is disposed at the tip support portion and comprises one singular piece of metal that is bent into a half-pipe shape and perforated with holes. The handle support portion has a rubberized cover for additional grip and heat insulation. The rest ensures that a tip of the soldering iron does not contact the heat shield. In the tip-up orientation, the soldering iron handle is less likely to increase in temperature from the tip of the soldering iron.

An annular structure for an electronic flame off (EFO) wand of a wire bonder is positioned beneath a capillary of the wire bonder. The annular structure provides uniform heat to a bond wire extending from the capillary to form a free air ball (FAB). Because heat is uniformly applied to the bond wire, the FAB is uniformly formed and is centered with respect to the capillary. The FAB is then bonded to a bond pad of a substrate. Because the FAB was uniformly formed and is centered on the capillary, the FAB will also be centered on the bond pad.