A soldering device includes: a soldering iron; a driver for moving the soldering iron; an input receiver for receiving an input of size information of a workpiece; and a controller for controlling the driver. The controller sets a coordinate of a specific position at a predetermined distance away from a soldering position based on the size information, sets, a speed of a tip at a distant position to a predetermined speed, and sets, an evacuation speed from the soldering position to the specific position to a low speed which is lower than the predetermined speed.

A soldering device includes: a soldering iron; a driver for moving the soldering iron; an input receiver for receiving an input of size information of a workpiece; and a controller for controlling the driver. The controller sets a coordinate of a specific position at a predetermined distance away from a soldering position based on the size information, sets, a speed of a tip at a distant position to a predetermined speed, and sets, an evacuation speed from the soldering position to the specific position to a low speed which is lower than the predetermined speed.

The disclosure provides a soldering component and a method of assembling a soldering component to objects, the soldering component comprises a body part and an assembling part, the assembling part is for combining to the object, the body part has a snap-fit part, the snap-fit part has an elastic retracting space, and the elastic retracting space can elastically retract two or more fastening parts, so that each fastening part fastens into another object, and the soldering component has a solderable surface for soldering to an assembling part of the object, the assembling part of the object is preset with a tin soldering layer, which is heated and soldered the soldering component and the assembling part of the object.

The present invention is to provide a mechanism that does not cause a situation such as corrosion of the iron tip with an air nozzle due to blowing off solder from the iron tip of the soldering iron, and a mechanism capable of coping with various shapes of iron tips. In order to achieve the object of the present invention, an iron tip cleaner device for a soldering iron includes a cleaner chamber including a wall surface and an air jetting holes that is provided in the wall surface and jets air for blowing off solder on an iron tip. The solder on the iron tip is blown off by convection air generated when the air jetted from the air jetting holes collides with the wall surface.

An automatic soldering processing system is disclosed and includes a soldering-point information obtaining unit, a soldering-parameter generating unit, a solder feeding unit, an iron tip, a motion control unit, and a temperature control unit. The soldering-point information obtaining unit obtains an image of at least one soldering-point of an electronic product, the soldering-parameter generating unit generates soldering parameters such as solder feeding speed, solder feeding amount, moving speed, moving path, heating temperature and heating time for the at least one soldering-point correspondingly according to the image. The solder feeding unit feeds solder based on the solder feeding speed and the solder feeding amount, the iron tip performs a soldering action by using the solder, and the motion control unit and the temperature control unit control the iron tip according to the moving speed, the moving path, the heating temperature, and the heating time.

An automatic soldering processing system is disclosed and includes a soldering-point information obtaining unit, a soldering-parameter generating unit, a solder feeding unit, an iron tip, a motion control unit, and a temperature control unit. The soldering-point information obtaining unit obtains an image of at least one soldering-point of an electronic product, the soldering-parameter generating unit generates soldering parameters such as solder feeding speed, solder feeding amount, moving speed, moving path, heating temperature and heating time for the at least one soldering-point correspondingly according to the image. The solder feeding unit feeds solder based on the solder feeding speed and the solder feeding amount, the iron tip performs a soldering action by using the solder, and the motion control unit and the temperature control unit control the iron tip according to the moving speed, the moving path, the heating temperature, and the heating time.

A soldering iron device includes a main body, where an end portion of the main body is provided with a tip, a heating core for heating the tip is provided in the main body, and a measuring element is provided in the main body; and the measuring element includes a mounting rod and a sensor, the sensor is provided on an end portion of the mounting rod, a measuring cavity is formed in the tip, the sensor is inserted into the measuring cavity, and the mounting rod extends toward a direction away from the tip. Compared with the prior art, since the sensor is not provided in the heating core, but is directly inserted into the tip, the present disclosure overcomes the heat transfer distance between the heating core and the tip and directly measures the temperature of the tip, which is highly accurate in measurement and strongly practicable.

A soldering iron device includes a main body, where an end portion of the main body is provided with a tip, a heating core for heating the tip is provided in the main body, and a measuring element is provided in the main body; and the measuring element includes a mounting rod and a sensor, the sensor is provided on an end portion of the mounting rod, a measuring cavity is formed in the tip, the sensor is inserted into the measuring cavity, and the mounting rod extends toward a direction away from the tip. Compared with the prior art, since the sensor is not provided in the heating core, but is directly inserted into the tip, the present disclosure overcomes the heat transfer distance between the heating core and the tip and directly measures the temperature of the tip, which is highly accurate in measurement and strongly practicable.

A soldering station includes a first tool port configured to interface with a first soldering tool, a second tool port configured to interface with a second soldering tool, a display configured to display information relating to one or both of the first and second soldering tools, and processing circuitry configured to interface with the display to provide the information relating to one or both of the first and second soldering tools. The first tool port has a first indicator associated therewith and the second tool port has a second indicator associated therewith. The first indicator generates a first color that is also generated at a third indicator associated with the first soldering tool. The second indictor generates a second color that is also generated at a fourth indicator associated with the second soldering tool, the first and second colors being different from each other.

A soldering and de-soldering station and systems including enhanced features for the soldering heating tools, load detection functionality, tip management, automatic tip temperature calibration, cartridge/handle position and movement sensing and interactive capabilities.